參考文獻 |
[1]A.Nathan and B.R.Chalamala, “Special Issue on Flexble Electronics
Techology, Part 1:System and Applications”, Proceeding of IEEE,Vol 93, Issue 7, pp.1235-1238, 2005.
[2]潘漢昌,塑膠基板鍍膜與製程簡介,科儀新知(第145期),p88-97,2005。
[3]李正中,薄膜光學與鍍膜技術(第七版),p410-414,2012。
[4]D. Hegemann, U. Vohrer, C. Oehr, R. Riedel, Surface and Coatings
Technology, 116-119, pp.1033-1036, 1999.
[5]魏敬倫,以反應性射頻磁控濺鍍搭配HMDSO電漿聚合鍍製氧化矽摻碳
薄膜阻障層之研究,國立中央大學光電科學與工程學系,碩士論文,民
國101年。
[6]楊士賢,以脈衝式電漿輔助化學氣相沉積法製備氟化非晶薄膜之研究,
中原大學化學工程學系,碩士論文,民國94年。
[7]Q.Xie, J.Xu, L.Feng, L.Jiang, W.Tang, X.Luo, C.Han, “Facile creation creation of a super amphiphobic coating surface with bionic microstructure”, Adv.Mater., 16,pp.302-205, 2004.
[8]C.Oehr, M.Muller, B.D.Hegemann, U.Vohree,Surface and Coatings Technology Technology, 116-110, pp.25-35, 1999.
[9]D.Hegemann, R.Reidel, C.Oehr, Thin Solid Films, 339, pp.154-159, 1999.
[10]H.Yasuda, T.Hirotsu, “Critical evaluation of condition of plasma polymerization” J.Polym.Sci.Pol.Chem., 16,pp.743, 1978.
[11]M.R.Alexander, F.R.Johns, R.D.Short, J.Phys.Chem., B101, pp.3614, 1997.
[12]M.Goujon, T.Belmonte, G.Henrion, “OES and FTIR diagnostics of
gas mixtures for SiO_x deposition assisted by RF plasma”,
Surface and Coatings Technology, 188-189, pp.756-761, 2004.
[13]D.S.Campbell, Mechanical Properties of Thin Film,Thin Film Technology,
L.I.Massel and R.Glang ed., New York, McGraw-Hill Book Company,
pp.12-21, 1970.
[14]K.L.Chopra, Mechanical effects in thin films, Thin Film Phenomena, p.266,
McGRAW-HILL, New York, 1969.
[15]R.W.Hoffman, Physics of Thin Films, Vol.3, Academic Press,New York, p.211, 1966.
[16]K.Kinosita, K.Maki, K.Nakamizo, and K.Takeuchi, “Stress in vacuum deposited films of silver”, Jpn.J.Appl.Phys.6, pp.42-53, 1967.
[17]J.D.Wilcock, ”Stress in thin films”,Ph.D.Dissertation,Electrical Engineering
Department, Imperial College,London University,London, 1967.
[18]E.Bauer, A.K.Green, and K.M.Kunz, “The formation of thin continuous films from isolated nuclei”, in Basic Problems in Thin Film Physics, edited by R.Niedermager and H. Mayer, Vandenhoeck and Ruprecht:Gottingen, pp.135-151, 1966.
[19]E.Klokholm and B.S.Berry, “Intrinsic stress in evaporated metal films“, J.Electrochem.Soc., 115, pp.823-826, 1968
[20]R.W.Hoffman, “Stress in thin films:the relevance of gain boundaries and impurities”, Thin Solid Films, 34, pp185-190, 1976.
[21]P.A.Alexander and R.W.Hoffman, “Effect of impurities on intrinsic stress in thin Ni films” ,J.Vac.Sci.Tech., 13, pp.96-98, 1976.
[22]F.M.D’Heurle, ”Aluminum films deposited by rf sputtering”, Metallurgical Transactions, 1, pp.725-732, 1970.
[23]K.H.Muller, “Stress and microstructure of sputter-deposited thin films:Molecular dynamics investigations”, J.Appl. Phys., 62, pp.1796-1799, 1987.
[24]H.Windischmann, “An intrinsic stress scaling law for polycrystalline thin
films prepared by ion beam sputtering”, J.Appl. Phys., 62, pp.1800-1807,
1987.
[25]C.A.Davis, “A simple model for formation of compressive stress in thin film
by ion bombardment“, Thin Solid Films, 226, pp3-14, 1993.
[26]G.G.Stoney, “The tension of metallic films deposited by electrolysis”, Proc.
Roy.Soc., A82, pp.172-175, 1909.
[27]K.G.Soderberg and A.K.Graham, “Stress in electro-deposits–Its significance
”, Proc.Am.Electroplater’s Soc., 34, p.97, 1947.
[28]R.H.D.Barklie and H.J.Davies, “The effect of surface conditions and electro
deposited metal on the resistance of materials to repated stress”, Proc.Inst.
Mech.Eng., p.2731, 1930.
[29]C.E.Heussner, A.R.Balden,and L.M.Morse, “Stress Data on Copper Deposits from Alkaline Baths”, Plating, 35, pp.719, 1948.
[30]A.Brenner and S.Senderoff, “Calculation of stress in electrodeposits from
the curvature of a plated strip”, J.Research of the Nat’l.Bureau of U.S.
Standards, 42 (Research paper RP1954), pp.105-123,1949.
[31]N.N.Davidenkov, “Measurement of residual stress in electrolytic deposits”,
Sov.Phys., 2, pp.1595-2598, 1961.
[32]B.J.Pond, J.I.DeBar, C.K.Carniglia, and T.Raj, “Stress reduction in ion beam
sputtered mixed oxide films”, APPLIED OPTICS,Vol.28,No.14,1989.
[33]郭倩丞,高密度分波多工器(DWDM)濾光片的應力與溫飄特性研究,國
立中央大學光電研究所,博士論文,民國96年。
[34]李坤憲,濺鍍薄膜之光學常數與界面應力,國立中央大學光電科學與工
程學系,博士論文,民國100年。
[35]A.C.Ferrari, B.Kleinsorge, N.A.Morrison, A.Hart, V.Stolojan, and J.Robertson, “Stress reduction and bond stability during thermal annealing of tetrahedral amorphous”, Journal of Applied Physics 85, 7191, 1999.
[36]H.K.Pulker, “Stress measurement and calculation for vacuum deposited
Deposited films”, Thin Solid Film, 58, pp.371-376, 1979.
[37]Hidetoshi YANAI, Nobuyuki KISHINE, Yukari KOMABA, and Tukitaka
MURAKAMI, “Measurement of Young’s modulus and stress analysis of a
magnetic thin film“, JSME Inter.J.Series A, Vol.39, No.1, pp.129-134, 1996.
[38]Anthony E.Ennos, “Stresses developed in optical film coatings”, Applied
Optics, Vol.5, No.5, No.1, Jan, pp.51-61, 1966.
[39]H.Liungcrantz, L.Hultman, and J. E. Sundgren, “Residual Stress and
Fracture Properties of Magnetron Sputtered Ti Films and Si Microelements”, J.Vac.Sci.Technol.A 11(3), pp.543-553, 1993.
[40]田春林,光學薄膜應力與熱膨脹係數量測之研究,國立中央大學光電科
學研究所,博士論文,民國89年。
[41]江政忠,離子源輔助真空蒸鍍高反射拋物面鏡之研究,國立中央大學
光電科學研究所,博士論文,民國85年
[42]Tung-Ying Lin, and Ching-Ting Lee, “Organosilicon function of gas barrier
films purely deposited by inductively coupled plasma chemical vapor
deposition system”, Journal of Alloys and Compounds, 542, pp11-16, 2012.
[43]Alfred Grill, Deborah A. Neumayer, “Structure of low dielectric constant to
extreme low dielectric constant SiCOH films:Fourier transform infrared
spectroscopy characterization”, Journal of Applied Physics 94, pp.6697, 2003.
[44]P.Raynaud, B.Despax, Y.Segui, H.Caquineau, Plasma Process. Polym.2,
pp.45–52, 2005
[45]C.Y.Kim, S.H.Kim, H.S.Kim, R.Navamathavan, C.K.Choi, J.Korean Phys.
Soc.50, pp.1119–1124, 2007.
[46]P.G.Pai, S.S.Chao, Y.Takagi, G.Lucovsky, J.Vac.Sci.Technol.A4, pp.689, 1986.
[47]C.T.Kirk, Phys Rev B 38, pp.1255, 1988.
[48]E.Dehan, P. Temple-Boyer, R. Henda, J. J. Pedroviejo, E. Scheid, “Optical
and structural properties of SiOx and SiN x materials”, Thin Solid Films,
266, p.14, 1995.
[49]Mariadriana Creatore, Fabio Palumbo, Riccardo d’Agostino, and Pierre Fayet, “RF plasma deposition of SiO-like films:plasma phase diagnostics and gas barrier film properties optimisation” Surface and Coatings Technology 142-144, pp.163-168, 2001.
[50]M.R.Alexander, et al., Appl. Surf. Sci. 137, pp.179, 1999.
|