以電漿聚合鍍製氧化矽摻碳氫薄膜應力之研究

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姓名

鄭敬龍(Jing-Long Cheng) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

以電漿聚合鍍製氧化矽摻碳氫薄膜應力之研究
(Stress analysis of films deposited by HMDSO/O2 plasma polymerization)

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摘要(中)

光學薄膜是鍍製不同的高低折射率材料組成多層膜結構，利用干涉原理來達到光學效果。然而過多的膜層會導致薄膜應力過大使光學鍍膜之波面變形，易造成光電元件壽命短少，進而導致光學薄膜品質降低。過大的薄膜應力會使薄膜產生破裂或起皺而導致剝落，使得光學薄膜元件之良率與穩定性受到很大的誤差。因此如何有效利用鍍製具有可撓性之電漿聚合薄膜來減少多層光學薄膜之應力，是本研究所探討之重點。
在本研究中使用電漿聚合反應來裂解HMDSO (Hexamethyldisiloxane)單體，進而鍍製出氧化矽摻碳氫之電漿聚合薄膜，分別改變HMDSO流量、氧氣流量、Beam Current以及Anode Voltage四種參數來鍍製電漿聚合薄膜，分析其組成結構、光學性質、元素比例與薄膜應力並且找出之間關係。從中發現當聚合薄膜之線狀/籠狀比例上升，應力大小會有下降之趨勢(從 GPa下降至 GPa)，並且平均穿透率皆維持在90 %以上。證明了利用改變參數可以有效控制電漿聚合膜之線狀/籠狀比例並且可以預測出鍍製電漿聚合膜之應力。最後在鍍有電漿聚合薄膜之樣品上加上多層膜結構，證明電漿聚合薄膜能夠有效控制多層膜應力，降低70 %的多層膜應力。

摘要(英)

The large stress causes films cracking or wrinkling and resulted the thin films peeling, so that reduced the yield and stability of the optical thin films production. Therefore, how to coat flexible polymeric films effectively and reduce the stress of multilayer optical films is the aim in this study.
In this study, HMDSO monomer was lysed by plasma polymerization, and then the plasma polymer films was coated. The composition structure, optical properties, proportion of elements and films stress of the coated polymer films were investigated by changing the flow of HMDSO, the flow of oxygen, beam current and anode voltage. The average transmittance of the deposited films is above 90%. When the Linear/Cage ratio decreases, the stress decreases from GPa to GPa. It proved that we can control the Linear/Cage ratio effectively and predicted the plasma polymer films stress by changing parameters. Finally, the multilayers were coated on the precoated polymer film shown that the stress of the multilayers was reduced 70 % effectively.

關鍵字(中)

★ 電漿聚合
★ 薄膜應力

關鍵字(英)

★ plasma polymerization
★ Stress

論文目次

總目錄
摘要……………………………………………………………………….I
Abstract…………………………………………………………………..II
誌謝…..…………………………………………………………………III
總目錄……………………………………………………………….…..V
圖目錄………………………………………………………………......IX
表目錄…………………………………………………………………..XI
第一章緒論 1
1-1 前言 1
1-2 研究動機 2
1-3 研究內容 2
第二章基礎理論與文獻回顧 4
2-1 電漿輔助化學氣相沉積 4
2-1-1 電漿基本原理 4
2-1-2 電漿聚合[6] 6
2-1-3 HMDSO碎裂反應 9
2-2 薄膜應力與應力量測 11
2-2-1 薄膜應力分析 11
2-2-2 內應力分析 13
2-2-3 薄膜應力計算公式 16
2-2-4 減低薄膜應力方法 18
2-3 薄膜應力量測方法 19
2-3-1 干涉相移式應力量測法[40][41] 20
第三章實驗方法與儀器原理 25
3-1 實驗方法 25
3-1-1 實驗流程 25
3-1-2 實驗步驟 26
3-2 鍍膜系統 28
3-2-1 有機單體-HMDSO 28
3-2-2 離子源系統 30
3-2-3 電子槍蒸鍍系統 31
3-3 量測儀器 34
3-3-1 紫外/可見/紅外光分光光譜儀 34
3-3-2 傅立葉轉換紅外線光譜儀 34
3-3-3 X射線光電子能譜儀 35
3-3-4 應力量測系統 37
第四章結果與討論 38
4-1 討論不同氧氣流量對薄膜結構之影響 38
4-1-1 FTIR分析 39
4-1-2 結構與應力之比較 42
4-2 討論不同HMDSO流量對薄膜結構之影響 43
4-2-1 FTIR分析 43
4-2-2 鍍率與光學穿透率分析 45
4-2-3 結構與應力之比較 47
4-3 討論不同Beam current與Anode Voltage對薄膜結構之影響 48
4-3-1 FTIR分析 49
4-3-2 光學穿透率分析 51
4-3-3 結構與應力之比較 52
4-4 XPS分析 53
4-4-1 不同Beam Current之XPS分析 55
4-4-2 不同HMDSO流量之XPS分析 57
4-5 薄膜應力與參數之關係 59
4-6 多層膜應力比較 61
第五章結論 64
參考文獻………………………………………………………………..66

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指導教授

李正中、郭倩丞
(Cheng-Chung Lee、Chien-Cheng Kuo)

審核日期

2015-1-29

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