鎖相熱影像檢測法用以檢測材料內部缺陷

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姓名

陳贊年(Tsan-nien Chen) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

鎖相熱影像檢測法用以檢測材料內部缺陷
(Internal defect detection using lock-in thermography)

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摘要(中)

本篇論文建立一套非接觸式、非破壞性的檢測物體內部缺陷深度與半徑的方法，利用在鎖相熱成像法中在物體輸入周期性變化的熱功率的特性導入熱波原理，藉由熱波原理控制檢測的深度。並根據有限元素分析軟體對不同缺陷深度與半徑進行模擬的結果建立一套使用週期性熱功率量測物體後，可以從量測的結果推算出在物體內部缺陷分布情形，並且同時得知缺陷深度與半徑的方法，最後進行實驗對模擬的結果進行確認。

摘要(英)

This research successfully builds a non-destructive, non-contact detection method of determining the internal defect depth and defect radius in samples. In lock-in thermography method, the samples are measured by periodically changed heat flux. The effect about periodically changed heat flux is known as thermal wave effect. As thermal wave effect shows, the detection depth is related with the frequency of heat flux By finite element analysis software, the defect depth and defect radius we can be measured after using two difference frequency heat power detect a sample. The simulation results are proved by experiment.

關鍵字(中)

★ 鎖相熱成像
★ 熱
★ 缺陷
★ 檢測

關鍵字(英)

★ Lock-in thermography
★ Heat
★ Defect
★ Detect

論文目次

摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VII
表目錄 XI
第一章緒論 1
1.1 前言 1
1.2文獻回顧 6
1.3研究動機與目的 8
第二章基本原理 10
2.1 基本熱傳原理 10
2.1.1 熱傳導 10
2.1.2 熱對流 13
2.1.3 熱輻射 14
2.2 熱波現象 15
2.3 鎖相原理 17
2.4 暫態鎖相誤差修正 20
第三章模擬分析 23
3.1 引言 23
3.2 有限元素分析法 23
3.3 模擬模型建立 25
3.4 模擬結果與誤差分析 31
3.4.1 缺陷寬度與深度分析 31
3.4.2 各種環境條件誤差分析 39
3.4.3 不同材質與幾何結構情況下驗證 47
第四章實驗驗證與分析 50
4.1 實驗架構 50
4.2 紅外線熱像儀誤差分析 54
4.3 實驗與模型驗證 55
第五章結論 65
第六章未來展望 66
參考資料 68
附錄一 LED樣品量測結果 70
附錄二熱波的干涉現象 73

參考文獻

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指導教授

鍾德元(Te-yuan Chung)

審核日期

2013-8-29

推文