||By the principle of the fluid of heat pipe heated in the high temperature|
area, the density and the ration become lower; therefore, the temperature
goes higher. On the contrary, the high density and ration of the cold fluid
goes down, replacing the rising part. The cold fluid goes up again when
heated. The alternating phenomena lead to convective transfer of capacity
formation. According the principle, the thermal cycling is carried out on
lamps and lanterns. In addition, each of the modulation factor and
parameter is set during simulation. The result of simulation is received by
using the simulation software, COMSOL Multiphysics. To analyze the
result of each group helps to understand how to obtain the most advanced
heat pipe device and to lower the highest temperature and LED lamp. The
highest temperature is 46.9℃ in the beginning of designed simulation.
temperature of LED chip, 40.8℃, and aluminum substrate , 28.2℃～30℃,
and the surface of lamps and lanterns, 30℃～32℃. Therefore, the highest
temperature decreases on the aluminum substrate of the main part of lamps
and lanterns and the surface of LED. Consequently, the temperature of
aluminum substrate declines dramatically to attain the fine effects of heat
dissipation, beneficial to the cooling design of LED.
|| Jeff Y. Tsao,“Solid-state Lighting Lamps, Chips, and Materials for Tomorrow”, IEEE Circuit & Devices Magazine, vol. 20, issue 3, pp. 28~37, 2004.|
 N. Holonyak and S. F. Bevacqua, “Coherent (visible) light emission from Ga(As 1-x P x ) junctions,” Appl. Phys. Lett. 1, 82-83 (1962).
 C. P. Kuo, R. M. Fletcher, T. D. Osentowski, M. C. Lardizabal, M.
G. Craford, and V. M. Robbins, “High performance AlInGaP visible light emitting diodes,” Appl. Phys. Lett. 57, 2937-2939 (1990).
 H. Sugawara, M. Ishikawa, and G. Hatakoshi, “High-efficiency InAlGaP/GaAs visible light-emitting diodes,” Appl. Phys. Lett. 58, 1010-1012 (1991).
 S. Nakamura, T. Mukai, and M. Senoh, “High-brightness InGaN/AlGaN double-heterostructure blue-green-light-emitting diodes,” J. Appl. Phys. 76, 8180-8191 (1994).
 S. Nakamura, M. Senoh, N. Iwasa, S. Nagahama, T. Yamada, and T. Mukai, “ Superbright Green InGaN Single-Quantum-Well-Structure Light-Emitting Diodes,” Jpn. J.
Appl. Phys. 34, L1332-L1335 (1995).
 Jeong Park and Chin C. Lee, “An Electrical Model With Junction Temperature for Light-Emitting Diodes and the Impact on Conversion Efficiency”, IEEE Electron Device Letters, vol. 26, no. 5, pp. 308~310, 2005.
 Eugene Hong and Nadarajah Narendran, “A Method
for Projecting Useful Life of LED Lighting Systems”, Third International Conference on Solid State Lighting, Proceedings of SPIE, vol. 5187, pp. 93~99, 2004.
 Y. Shimizu, K. Sakano, Y. Noguchi, and T. Moriguchi, “Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material,” United States Patent, US 5998925 (1999).
 Nadarajah Narendran and Yimin Gu, “Life of LED-Based White Light Sources”, IEEE/OSA Journal of Display Technology, vol. 1, no. 1, pp. 167~171, 2005.
 李冠賢，＂垂直放置鰭片之自然對流熱傳性能實驗研究 ＂，國
 S. H. Park, Robust Design and Analysis for
Quality Engineering, Chapman & Hall, pp. 25-58, 1996.
 Incropera DeWitt 原著，侯順雄、王松浩、張仲卿譯者，「熱
傳遞」，高立圖書，民國 96 年 10 月。
 林志勳， ＂應用田口法開發LED燈具設計＂， 國立中央大學
 Aibara, T., 1968, “Natural Convective Heat Transfer in Vertical Parallel Fins of Rectangular Profiles,” The Japan Society of Mechanical Engineers (JSME), Vol. 34. Quoted in Yeh, L. T., Chu, R. C., 2002, Thermal
Management of Microelectronic Equipment, ASME Press, New York.
 Güvenç, A., and Yüncü, H., 2001, “An Experimental Investigation on Performance of Fins on a Horizontal Base in Free Convection Heat Tr- ansfer,” Heat and Mass Transfer, Vol. 37, pp. 409-416
 Ostrach, S., 1953, “An Analysis of Laminar Free Convection Flow and Heat Transfer about a Flat Plate Parallel to the Direction of the Generating Body Force,” National Advisory Committee for Aeronautics, Report 1111.