以微陽極導引電鍍法製備銅螺旋微米結構與其機械性質分析

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顧乃華(Nai-Hua Gu) 查詢紙本館藏

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機械工程學系

論文名稱

以微陽極導引電鍍法製備銅螺旋微米結構與其機械性質分析
(On the Microhelix Structures of Copper Prepared by Microanode Guided Electroplating and their Mechanical properties)

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摘要(中)

本研究使用微陽極導引電鍍法在銅片基材上電鍍微米尺度之銅螺旋結構物。採用直徑為 75 μm 之白金絲，經樹脂鑲埋後露出角錐狀、圓盤狀兩種不同形狀微陽極，在含硫酸銅溶液之鍍浴中，控制微陽極與銅片間偏壓在3.4 V，並維持微陽極與銅基材（或螺旋結構物）頂端之間距在 30 μm，進行微陽極導引電鍍。結果顯示：在圓盤狀微陽極電鍍所得之微螺旋的線徑均勻度較佳，隨電鍍時間增長下，粗細不均的現象較不明顯。藉由商用 COMSOL軟體來模擬兩種不同形狀微陽極導引電鍍過程之電場分布，得知在使用圓盤形微陽極微電鍍過程，其電場分佈較適合生長線徑均勻之微螺旋。以圓盤形微陽極導引電鍍法在製作銅螺旋之微結構時，依據 COMSOL 軟體之電場強度模擬結果與實際實驗交互比對，可以推測可行的析鍍電場強度範圍需要高於 10 kV/m 以上，此工作範圍將決定銅微螺旋之直徑與螺距之大小。當螺旋直徑由 230 μm 增加到 470 μm，微螺旋線徑會逐漸下降，且螺旋線徑均勻度上升；螺距由 145 μm 增加到 250 μm 時，微螺旋線徑也會逐漸下降，螺旋線徑均勻度上升。本研究製程在螺旋之直徑為 390、 470 μm，螺距於215、 250 μm，可以得到均勻的銅微螺旋結構，其螺旋線徑變化量小於 10%。
若改變鍍浴中銅離子濃度使其電導率介於 5、 10、 15 及 20 S/m 之間，以圓盤形微陽極導引電鍍銅螺旋結構，結果發現鍍液之電導率 5 S/m 時，獲得之銅螺旋結構最均勻，其螺旋線徑增加量可低於 15%，隨著鍍液之電導率上升至 20 S/m，其螺旋線徑增加量將高達 76.3%。經微力壓縮實驗與奈米壓痕試驗來研究微螺旋之機械性質，所得銅微螺旋之硬度、楊氏模數與彈性常數接隨電鍍浴電導率上升而提高，電導率 20 S/m 之鍍液析鍍出之銅微米螺旋結構的硬度為 0.355 GPa，楊氏模數為 5.445 GPa，彈簧之彈性常數為0.775 mN/μm。

摘要(英)

The copper microhelix was prepared by microanode guiding electroplating (MAGE) technique. A microanode was made of platinum (75 μm in diameter). The copper microhelix structure was deposited at a potential of 3.4 V. The initial gap between microanode and the top of the coils was set at a distance of 30 μm. We used two different shape of microanode (cone-liked and disk-liked) to do the electroplating. We observed that the line diameter of helix structure made with disk like microanode didn’t increase with time, and then used commercial software (COMSOL Multiphylics) to simulate the electric field of two type of microanode and verified the result of experiment. The result was that the disk like microanode had better electric filed distribution. We found that the electric field should higher than 10 kV/m when deposited the copper microhelix. This working range could decide the wire diameter of the copper microhelix. The larger helix diameter (390, 470 μm) and higher pitch (215, 250 μm) could have better wire diameter (the amount of change is less than 10%).
Then we used the disk like microanode to do the copper helix structure deposition in the bath with conductivity of 5, 10, 15, and 20 S/m, than analysed the mechanical properties with microforce compression test and nanoindentation test. In the result, copper helix structure had the best hardness (0.355 mN/μm2), Young’s modulus (5.445 GPa), and spring constant (0.775 mN/μm) at
conductivity of 20 S/m.

關鍵字(中)

★ 微陽極導引電鍍
★ 銅微米螺旋結構
★ 奈米壓痕

關鍵字(英)

★ Microanode guided electroplating
★ Copper microhelix structure
★ Nanoindentation

論文目次

摘要 I
ABSTRACT III
表目錄 VIII
圖目錄 X
符號與字母縮寫說明 XIII
第一章、前言 1
1-1 研究背景 1
1-2 研究動機 3
1-3 研究目的 4
第二章、基礎理論與文獻回顧 5
2-1 電鍍原理 5
2-2 局部微電鍍之發展 6
2-3 奈米壓痕測試估計材料之硬度與楊氏模數 9
2-4 動態微力拉伸與壓縮試驗估計彈簧常數 11
2-5 電場模擬軟體之有限元素分析理論基礎 12
第三章、研究方法 15
3-1 研究方法流程 15
3-2 微陽極導引電鍍設備與三維控制平台之架設 15
3-2-1 微陽極與陰極試片製作 16
3-2-2 鍍液調配 17
3-3 即時影像微陽極導引電鍍系統之調校與操作 17
3-4 實驗步驟 19
3-4-1 微陽極之形狀對銅微螺旋析鍍物之影響 19
3-4-2 微螺旋析鍍物之螺距與直徑參數研究 20
3-4-3 鍍浴電導率對微螺旋形貌與機械性質影響研究 21
3-4-4 析鍍物之形貌觀察 21
3-4-5 微螺旋析鍍物之硬度與楊氏模數測定 22
3-4-6 微螺旋析鍍物之彈簧係數測定 22
3-5 電場模擬方式與設定 23
第四章、結果 25
4-1 微陽極形狀之影響 25
4-1-1 角錐式微陽極與圓盤式微陽極電鍍結果 25
4-1-2 角錐式微陽極與圓盤式微陽極模擬結果 26
4-2 螺旋間距與直徑參數對析鍍物形貌之影響 26
4-3 鍍浴之電導率對微螺旋形貌影響 28
4-4 微螺旋析鍍物之奈米壓痕試驗 28
4-5 微螺旋析鍍物之動態微力壓縮試驗 29
第五章、討論 31
5-1 微陽極形狀之選擇與電場模擬分析 31
5-2 微電鍍之電場強度與析鍍物螺距、直徑之關聯性 32
5-3 微電鍍之電場強度受鍍浴電導率之影響 34
5-4 微陽極導引電鍍析鍍銅螺旋的工作範圍探討 35
第六章、結論與前瞻 36
參考文獻 37

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指導教授

林景崎(Jing-chie Lin)

審核日期

2015-8-17

推文