無鉛銲料與無電鍍鈷基板於多次迴焊之界面反應與可靠度測試

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姓名

蔡宜伶(Yi-lin Tsai) 查詢紙本館藏

畢業系所

化學工程與材料工程學系

論文名稱

無鉛銲料與無電鍍鈷基板於多次迴焊之界面反應與可靠度測試

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摘要(中)

本研究利用Sn-3.0Ag-0.5Cu (SAC305)與無電鍍鈷基板進行多次迴焊，探討其界面反應與微結構變化對於接點機械性質之影響。無電鍍鈷系統包含無電鍍鈷(Electroless Co，EC)、無電鍍鈷/浸金(Electroless Co/Immersion Au，ECIG)、無電鍍鈷/無電鍍鈀(Electroless Co/Electroless Pd，ECEP)無電鍍鈷/無電鍍鈀/浸金(Electroless Co/Electroless Pd/Immersion Au，ECEPIG)四種。其中無電鍍鈷層含有微量元素鎢、磷，即Co(W,P)層。實驗結果顯示，在較高的P含量中添加鈀層之系統(ECEP、ECEPIG)，多次迴焊後介金屬化合物(Co,Cu,Pd)Sn3會發生大規模剝離現象，且在推力測試結果中以延性破壞為主，相較於無添加鈀的系統(EC、ECIG)以及較低P含量的ECEPIG有較高的推力值。鈀層的添加與較高的P含量會促使介金屬化合物產生大規模剝離，因此界面由原本的介金屬化合物/基板轉變為SAC305銲料/基板，破壞行為則由脆性轉變為延性，並提升了接點的機械強度。

摘要(英)

This study investigated the evolution of microstructure of the intermetallic compounds formed between Sn3.0Ag0.5Cu solder and Co-based surface finishes. The influence of massive spalling of intermetallic compounds (IMCs) on the mechanical properties of solder joints was also studied. The SAC305 reflowed on four kinds of Co-based surface finish substrates, electroless Co (EC), electroless Co/immersion Au (ECIG), electroless Co/electroless Pd (ECEP), electroless Co/electroless Pd/immersion Au (ECEPIG). The CoSn3 was the main intermetallic compound (IMC) in the systems, and the CoSn3 would spalling massively in some specific substrates during multiple-reflows. The results indicated that the occurrence of massive spalling in IMCs relies on the addition of Pd layer and the P content on Co-based surface finishes. To understand the relationship between the evolution of microstructure and the mechanical strength of solder joints, the shear test was used to measure the mechanical properties. The results of shear test showed that the massive spalling of CoSn3 could transform the failure mode from brittle to ductile and enhance the shear strength of joints.

關鍵字(中)

★ 無電鍍鈷
★ 可靠度

關鍵字(英)

論文目次

中文摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第一章序論 1
1-1 前言 1
1-2 電子構裝 1
1-2-1 構裝層級 2
1-2-2 構裝技術 2
1-2-3 銲點凸塊結構 3
1-2-4 多次迴焊 3
1-3界面反應 4
1-4 擴散阻障層 5
1-4-1 無電鍍鎳/浸金(ENIG) 5
1-4-2 無電鍍鎳/無電鍍鈀/浸金(ENEPIG) 5
1-4-3 添加鈀對界面的影響 6
1-5 銲料與Co之界面反應 7
1-5-1 銲料/Co界面反應 7
1-5-2 銲料/Co(P)界面反應 8
1-5-3 銲料/Co(W,P)界面反應 9
1-6 大規模剝離現象 10
1-6-1 潤濕層(Wetting layer)消耗完畢 10
1-6-2 系統中有限元素(Limited Reactive Constituents) 11
1-6-3 降低界面能 11
1-7推力測試 12
1-8 研究目的 14
第二章實驗方法 31
2-1 材料製備 31
2-2 液/固界面反應 32
2-3 金相處理與試片分析 33
2-3-1 掃描式電子顯微鏡(SEM) 33
2-3-2 場發射式電子微探儀(FE-EPMA) 33
2-4 推力測試 34
第三章結果與討論 35
3-1無鉛銲料與EC、ECIG、ECEP、ECEPIG基材多次迴焊之界面反應 35
3-1-1 SAC/EC 多次迴焊界面反應 35
3-1-2 SAC/ECIG 多次迴焊界面反應 36
3-1-3 SAC/ECEP 多次迴焊界面反應 36
3-1-4 SAC/ECEPIG 多次迴焊界面反應 37
3-1-5 SAC/Low-P ECEPIG 多次迴焊界面反應 37
3-2介金屬化合物生成與形貌變化 37
3-2-1 (Co,Cu,Pd)Sn3的大規模剝離 37
3-2-2 Co-Sn-P層的生成 39
3-2-3 (Cu,Co,Pd)6Sn5的生成 39
3-3無鉛銲料與無電鍍鈷基材之機械強度研究 40
3-3-1 SAC305與EC、ECIG、ECEP、ECEPIG接點機械強度 40
3-3-2 SAC305與EC、ECIG、ECEP、ECEPIG破壞模式 41
3-3-3 SAC305 與ECEPIG、Low-P ECEPIG機械性質比較 42
3-3-4 破壞行為探討 43
第四章結論 57
參考文獻 59

參考文獻

1. 田民波，「半導體電子元件構裝技術」，五南圖書出版股份有限公司，台灣(2008)。
2. 徐祥禎，電子構裝結構分析，中華民國力學學會，台灣(2009)。
3. 汽車元件用構裝材料技術趨勢，工研院電子報(2015)。
4. 葉英傑碩士論文，國立中央大學工業管理研究所(2000)。
5. W.H. Zhong, Y.C. Chan, M.O. Alam, B.Y. Wu , J.F. Guan, “Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints”, J. Alloys. Compd. 414 (2006) 123.
6. W.H. Zhong, Y.C. Chan, B.Y. Wu, M.O. Alam, J.F. Guan, “Multiple reflow study of ball grid array(BGA) solder joint on Au/Ni metallization”, J. Mater. Sci. 42 (2007) 5239
7. H.H. Manko, “Solders and Soldering: Materials, Design, Production, ans Analysis for Reliable Bonding”, 3rd edition, McGraw-Hill, New York, (NY 1992)
8. H.D. Blair, T.Y. Pan, and J.M. Nicholson, “Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders”, Proc. Electronic Component and Technol. Conf. (Piscataway, NJ: IEEE, 1998) 259.
9. K. Zeng, R. Streman, D. Abbott, and Masood Murtaza, “The root cause of black pad failure of solder joints with Eeectroless Ni immersion gold plating”, JOM (2006) 75.
10. K. Suganuma and K.S. Kim, “The root cause of the black pad phenomenon and avoidance tactics” JOM (2008) 61.
11. C.F. Tseng, J.G. Duh, “The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P solder joint during a liquid state reaction”, J. Mater. Sci. 48 (2013) 857.
12. I.T. Wang, J.G. Duh, C.Y. Cheng, “Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd immersion Au electroless Ni solder joints after aging”, J. Mater. Sci. Eng. B 177 (2012) 278.
13. B.M. Chung, Y.H. Bake, J. Choi, J.Y. Huh, “Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and ENEPIG Surface Finish During the Reflow Process”, J. Electron. Mater. 41 (2012) 3348.
14. W.H. Wu, C.S. Lin, S.H. Huang, C.E. Ho, “Influence of Palladium Thickness on the Solder Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish ”, J. Electron. Mater. 39 (2010) 2387.
15. C.H. Wang, S.W. Chen, “Sn/Co solid/solid interfacial reactions”, Intermetallics 16 (2008) 524.
16. W.J. Zhu, J. Wang, H.S. Liu, Z.P. Jin, W.P. Gong, “The interfacial reaction between Sn–Ag alloys and Co substrate”, Mater. Sci. Eng. A 456 (2007) 109.
17. L. Maganin, V. Sirtori, S. Seregni, A. Origo, P.L. Cavallotti, “Electroless Co-P diffusion barrier in Pd-free soldering”, Electrochim. Acta 50 (2005) 4621.
18. N.D. Lu, D.H. Yang, L.L. Li, “Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures”, Acta Mater. 61 (2013) 4581
19. C.H. Wang, S.E. Hung, C.W. Chiu, “Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate”, J. Alloy. Compd. 619 (2015) 474
20. C.H. Wang, S.E. Huang, J.L. Liu, “Liquid-state interfacial reactions of Sn-Zn/Co couple at 250 OC”, J. Electron. Mater. 41 (2012) 3259.
21. A.Kohn, M. Eizenberg, Y. Shacham-Diamand, Y. Sverdlov, “Characterization of electroless deposited Co(W,P) thin film for encapsulation of copper metallization”, Mater. Sci. Eng. A 302 (2001) 18.
22. H.C. Pan, T.E. Hsieh, “Diffusion barrier characteristics of electroless Co(W,P)”, J. Electrochem. Soc.158 (2011) 4581.
23. H.C. Pan, T.E. Hsieh, “An investigation of diffusion barrier characteristics of an elecroless Co(W,P) layer to lead-free SnBi solder”, J. Electron. Mater. 40 (2011) 330.
24. C.K. Shin, Y.J. Baik, J.Y. Huh, “Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni Ti thin films and Ni foils”, J. Eleectron. Mater. 30 (2001) 1323.
25. S.C. Yang, C.E. Ho, C.W. Chang, C.R. Kao, “Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element”, J. Appl. Phys. 101 (2007) 084911.
26. C.E. Ho, R.Y. Tsai, Y.L. Lin, C.R. Kao, “Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni”, J. Electron. Mater. 32 (2002) 584.
27. C.E. Ho, Y.W. Lin, S.C. Yang, C.R. Kao, D.S. Jiang, “Effect of limited Cu supply on soldering reactions between SnAgCu and Ni”, J. Electron. Mater. 35 (2006) 1017.
28. J.W. Jang, L.N. Ramanathan, J.K. Lin, D.R. Frear, “Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under”, J. Appl. Phys. 95 (2004) 8286.
29. J.H. Hong, H.Y. Lee, Albert T. Wu, “Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes”, J. Alloys Compd. 580 (2013) 195.
30. C.F. Ho, J.G. Duh, “Correlation between microstructure evolution and mechanical strength in the Sn-3.0Ag-0.5Cu ENEPIG solder joint”, Mater. Sci. Eng. A 580 (2013) 169.
31. Y.J. Chen, C.K. Chung, C.R. Kao, “Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics”, Microelectron. Reliab. 53 (2013) 47.
32. S. Kumar, D. Jung, T. Jung, “High-speed shear test for low alpha SAC105 Solder ball of sub-100n dimension for wafer level packaging”, IEEE Trans. Compon. Package. Manuf. Technol. 3 (2013) 441.
33. F. Song, S.W. R. Lee, K. Newman, B. Sykes, S. Clark, “Brittle failure mechanism of SAC and SnPb solder ball during high speed ball shear and cold ball pull test”, Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007.
34. F. Zhu, H. Zhang, R. Guan, S. Liu, “Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5”J. Alloy. Compd. 438 (2007) 100.
35. T.K. Lee, B. Zhou, T.R. Bieler, C.F. Tseng, J.G. Duh, “The Role of Pd in SAC solder interconnect mechanical shock performance”, J. Electron. Mater. 42 (2013) 215.
36. D.Y.R. Chong, F.X. Che, J.H.L. Pang, Kellin Ng, J.Y.N. Tan, P.TH. Low, “Drop impact reliability testing for lead-free and lead-based soldered IC packages”, Microelectron. Reliab. 46 (2006) 1160.
37. JEDEC JESD22-B117B-2014
38. J.W. Jang, P. G. Kim, K. N. Tu, D. R. frear, P. Thompson, “Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology”, J. Appl. Phys. 85 (1999) 8456.
39. J.W. Kim, Y.C. Lee, S.S. Ha, S.B. Jung, “Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test”, J. Mater. Sci. - Mater. Electron. 20 (2009) 17.
40. P.G. Kim, K.N. Tu, “Morphology of wetting reaction of eutectic SnPb solder on Au foils”, J. Appl. Phys. 80 (1996) 3822.
41. S.P. Peng, W.H. Wu, C.E. Ho, Y.M. Huang, “Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure”, J. Alloys Compd. 493 (2010) 431.
42. Y. Wang, K.N. Tu, “Ultrafast intermetallic compound formation between eutectic SnPb and Pd where the intermetallic is not a diffusion barrier”, Appl. Phys. Lett. 67 (1995) 1069.
43. Y.C. Sohn, J. Yu, “Spalling of intermetallic compound during reaction between lead free solders and electroless Ni(P) metallization”, J. Mater. Res. 19 (2004) 2428.
44. C.Y. Ho, J.G. Duh, C.W. Lin, C.J. Lin, Y.H. Wu, H.C. Hong, T.H. Wang, “Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu-ENEPIG solder joints with ultra-thin Ni–P deposition”, J. Mater. Sci. 48 (2013) 2724.
45. J.M. Koo, S.B. Jung, “Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging”, Microelectron. Reliab. 47 (2007) 2169.

指導教授

吳子嘉(Tz-jia Wu)

審核日期

2015-7-28

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