摘要(英) |
Semiconductor factories use many kinds of organic solvents in their manufacturing processes which will cause health hazards or to the worse occupational diseases for laborers exposing themselves to this environment for long duration of time. This study aims to evaluate health risk of occupational exposure for laborers working in a wafer-surface treatment process of a semiconductor plant to realize their actual exposure pattern. The methods of chemicals exposure assessment and control measure include preliminary hazard analysis, additive effect assessment, health risk assessment, abnormal health data analysis, and chemicals management classification.
Six working groups with similar organic solvent exposure were selected as study targets. They include cleaning operation area (SEG01), electronically photolithography zone (SEG02), photo resisting area (SEG03), wet photo resisting area (SEG05), electronically grinding zone (SEG09), and wet etching zone (SEG17).
The values of additive effect regarding to chemicals exposure for laborers based on environmental monitoring data from 2010 to 2014 are as follows. The value of 0.11 for cleaning area (SEG01), 0.13 for electronically photolithography zone (SEG02), 0.20 for photo resisting area (SEG03), 0.13 for wet photo resisting area (SEG05), 0.06 for electronically grinding zone (SEG09), and 0.18 for wet etching zone (SEG17). Among various values, the value of photo resisting area (SEG03) is the highest. However, the values of additive effect in each working group are all smaller than 1 and thus they meet regulatory requirements.
According to health risk assessment, the hazard index (HI) of chronic inhalation for each group in descending order is SEG03 (1.72 * 10-1), SEG05 (1.15 * 10-1), SEG09 (1.22 * 10-3), SEG01 (8.22 * 10-4), SEG17 (6.24 * 10-4), and SEG02 (1.68 * 10-4). The computed values are all smaller than one, the allowable criterion. For laborers working in the similar area, the health hazard in the photo resisting area (SEG03) is more severe than that in the wet photo resisting area (SEG05) and the wet etching zone (SEG17) is inferior to he electronically yellow-ray zone (SEG02). The result is similar to that of additive effect.
The decending order of abnormal rate for health examination data is the photo resisting area (SEG03, 16.2%), the cleaning area (SEG01, 15.3%), the wet photo resisting area (SEG05, 11.5%), the electronically photolithography zone (SEG02, 10.9%), the wet etching zone (SEG17, 10.8%), and the electronically grinding zone (SEG09, 10.6%). For paired t-test between laborers of each working area and administrative staff on creatine and glomerular filtration rate, significant differences were found for laborers in the areas of SEG02, SEG05, SEG09, and SEG17. The hazardous materials both used in SEG02 and SEG17 were acetone, phenol and PGMEA (Propylene Glycol Monomethyl Ethyl Acetate) and the quantity of phenol was found with significant difference from the comparison.
To sum up the above assessments, SEG03 was ranked as the area with the highest risk and the causal hazardous substances were naphthalene, acetone, isopropyl alcohol, and NMP (N-Methyl-2-pyrrolidone). The health risk of SEG05 was ranked second with causal hazardous substances including naphthalene, acetone and isopropanol. The laborers in the above mentioned areas should enhance the checking frequency of machine leakage, protective equipment maintenance, safety of chemicals storage, and fault machine listing mechanism. The phenol used in SEG02 and SEG17 is probably the causing substance of creatinine abnormality of laborers in health examination. The monitoring frequency for environmental exposure of laborers in these two areas should be increased and discard manual replacement of the photoresist agent.
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參考文獻 |
ACGIH(American Conference of Governmental Industrial Hygienists) . 2014 Risk Assessment [online], Available:http://www.acgih.org/home [accessed 1/22/2015].
EPA, Exposure Assessment, Available: http://www.epa.gov/sustainability/analytics/ exposure-assessment.htm, last updated on 11/14/2013.
EPA, Exposure Assessment, Available: http://www.epa.gov/sustainability/analytics/ exposure-assessment.htm, last updated on 6/25/2014.
IARC(International Agency for Research on Cancer). 2014 Who/IARC Classification of Tumours [online], Available: http://whobluebooks.iarc.fr/ [accessed 1/17/2015].
IRIS (Integrated Risk Information System). 2006. IRIS Database for Risk Assessment, U.S. Environmental Protection Agency [online], Available: http://www.epa.gov/iris/subst/0051.htm [accessed 1/15/2015].
NIOSH (National Institute for Occupational Safety and Health), Manual of Analytical Methods [online], Available: http://www.cdc.gov/niosh/docs/2003-154/[accessed 2/11/2015].
NRC ,“ Red Book”,“ Risk Assessment in the Federal Government: Managing the Process” in 1983.
The American Conference Of Governmental Industrial Hygienists (ACGIH) , Categories For Carcinogenicity.
SAHTECH 財團法人安全衛生技術中心,化學品分級管理運用指引,2012。
內政部統計處,全國簡易生命表,2013。
行政院環保署,健康風險評估技術規範,2011。
吳東毅,化學品分級管理,勞動部職業安全衛生研究所,2013。
吳幸娟、李聯雄,職業暴露限制值制定中健康風險評估之運用,勞動部職業安全衛生研究所,2012。
林瑞玉,職業安全衛生風險評估實務,工安技術論壇,2008。
洪健仁,半導體廠局部尾氣處理設備危害與風險評估,碩士論文,中央大學,2009。
科學工業園區管理局,作業環境測定計畫撰寫範例,2009。
郭育良,職業病概論,2010。
國家環境毒物研究中心,環境毒物知多少,2014。
國民健康局,環境健康風險季刊,國立成功大學環境微量毒物研究中心,2010。
國立台灣大學公共衛生學院健康風險及政策評估中心,台灣一般民眾暴露參數彙編,DOH-96-HP-1801,P33、P56,2008。
張大元,健康風險評估 Health Risk Assessment,職場健康週,2010。
張書豪、張木彬,科學園區空氣污染物排放特性之探討,國科會研究報告,2000。
陳永銘,腎功能檢測,健康教育中心知識庫,台大醫院,2011。
勞動部職業安全衛生研究所,職業暴露研究成果輯,2012。
勞動部,作業環境測定指引,2010。
勞動部,風險評估技術指引,2010。
勞動部,危害性化學品標示及通識規則,2014。
勞動部,勞工作業場所容許暴露標準,2014。
勞動部,勞工作業環境監測實施辦法,2014。
勞動部,危害性化學品評估及分級管理辦法,2014。
勞動部,勞工健康保護規則,2014。
勞動部,職業安全衛生管理辦法,2014。
勞動部職業安全衛生署,GHS化學品全球調和制度,2014。
勞動部職業安全衛生署,CCB化學品分級管理,2014。
勞動部勞動及職業安全衛生研究所,作業環境測定數據統計評估工具使用技術手冊,2012。
楊秀宜、張大元,半導體封裝測試製程安全衛生調查研究,勞動部職業安全衛生研究所,2014。
楊啟賢、蔡忠融,印刷業作業環境有機溶劑使用及其勞工健康狀況調查,勞動部職業安全衛生研究所,2013。
經濟部投資業務處,半導體產業分析及投資機會,2008。
經濟部技術處,台灣半導體設備產業現況與未來展望,2012。
經濟部工業局,職業衛生風險評估及管理實務手冊,2004。
詹長權,健康風險評估指引,衛生福利部國民健康署,國立台灣大學公共衛生學院,2003。
蔡朋枝、李聯雄,職業衛生暴露危害因子調查Ⅱ,勞動部職業安全衛生研究所,2009。
蔡朋枝,職場暴露與健康風險評估,勞工健康論壇,2014。
羅俊光,半導體業作業環境空氣中揮發性有機化合物氣相層析質譜儀分析方法建立,勞動部職業安全衛生研究所,2000。
蘇茂豐,國內半導體製造業及光電業之產業現況、製程廢氣污染來源與排放特性,環保技術e報,第3期,2003。
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