||In this thesis, we proposed a design of transmitter optical sub-assembly for 4-channel x 25-Gbps optical interconnect module using silicon interposer structure. For the operating data rate of 25 Gbps, we design the applicable high frequency metal transmission lines, optical device and package technology.|
In fabrication of this transmitter optical sub-assembly, the wet etching technology from our laboratory is used to etch a micro groove with optical-coupling 45-degree reflector on the silicon substrate. In the design of this silicon optical bench (SiOB), the polymer waveguide could be passive aligned by the groove. Then the metal layer coated on the reflector would increase the coupling efficiency for the laser with wavelength of 850 nm. After metal transmission lines and AuSn solder bumping are mounted on the SiOB, the vertical-cavity-surface-emitting-laser (VCSEL) would be packaged on the SiOB by flip-chip packaging technology.
The optical characteristic, -1 dB tolerance of optical level of VCSEL is . The high frequency electric characteristic, the single-ended transmission lines can keep the return loss below -20 dB and insertion loss of -0.4 dB above. For the 1mm-length differential transmission lines, the return loss also can be -20dB below and above -1 dB for insertion loss. The eye pattern of the transmitter optical sub-assembly, the signal to noise ratio (SNR) can achieve 6.81 dB level.
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 Chongjin Xie, R&D Lab, Ali Infrastructure Service, Alibaba Group,” Optical Interconnects in Datacenters”, Asia Communications and Photonics Conference (ACP) © 2015 OSA
 Akinori Hayakawa, Hiroji Ebe, Yanfei Chen, Toshihiko Mori,” Silicon Photonics Optical Transceiver for High-speed, High-density and Low-power LSI Interconnect”, FUJITSU Sci. Tech. J., Vol. 52, No. 1, pp. 19–26 (January 2016)
 Norio Chujo, Toru Yazaki, Toshiaki Takai,” A 25-Gb/s × 4-Ch, 8 × 8 mm2, 2.8-mm Thick Compact Optical Transceiver Module for On-Board Optical Interconnect”, OFC/NFOEC Technical Digest © 2013 OSA
 Yasunobu Matsuoka, Yong Lee, and Hideo Arimoto Research & Development Group, Center for Technology,”A High-density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Optical Sub-assembly Techniques”,978-1-4799-8815-0/15/©2015 IEEE
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 陳進達,” 以矽光學平台為基礎之4通道 x 10 Gbps光學連結模組之接收端”,(國立中央大學光電科學研究所碩士論文，2010)
 林書玄,” 適用於20 Gbps矽基高頻傳輸線開發及其板對板光學連接模組之應用”,(國立中央大學光電科學研究所碩士論文，2013)