參考文獻 |
[1] M.J. AlamU, D.C. Cameron, “Optical and electrical properties of transparent conductive ITO thin films deposited by sol gel process,” Thin Solid Films, 455 459, 2000.
[2] B. O’Connor, C. Haughn, K-H. An, K. P. Pipe and M. Shtein, “Transparent and conductive electrodes based on unpatterned, thin metal films,” Applied Physics Letters, 93, 223304, 2008.
[3] E. Fortunato, D. Ginley, H. Hosono, and D. C. Paine, “Transparent conducting oxides for photovoltaics,” Mrs Bulletin, Volume 32, March 2007.
[4] S. Ishibashi, Y. Higuchi, Y. Ota, and K. Nakamura “Low resistivity indium-tin oxide transparent conductive films. II. Effect of sputtering voltage on electrical property of films,” Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8, 1399, 1990.
[5] J-Y. Lee, S. T. Connor, Y. Cui, and P. Peumans, “Solution-processed metal nanowire mesh transparent electrodes,” American Chemical Society, 2008.
[6] J. Kim, Wilson Jose da Silva, Abd. Rashid bin Mohd Yusoff and J. Jang, “Organic devices based on nickel nanowires transparent electrode,” Scientific Reports, 2016.
[7] H-G. Im, S-H. Jung, J. Jin, D. Lee, J. Lee, I-D. Kim and B-S. Bae, “Flexible transparent conducting hybrid film using a surfaceembedded copper nanowire network: a highly oxidation-resistant copper nanowire electrode for flexible optoelectronics,” American Chemical Society,2014.
[8] W. Xiong, H. Liu, Y. Chen, M. Zheng, Y. Zhao, X. Kong, Y. Wang, X. Zhang, P. Wang, and L. Jiang, “Highly conductive, air-stable silver nanowire@iongel composite films toward flexible transparent electrodes,” Adv. Mater., DOI: 10.1002/adma.201600358, 2016.
[9] J. H M Maurer, L. Gonzalez-Garc ́ ía, B. Reiser, I. Kanelidis, and T. Kraus, “Templated self-assembly of ultrathin gold nanowires by nanoimprinting for transparent flexible electronics,” American Chemical Society, 2016.
[10] P.M Ajayan and Z.Z. Otto, “Applications of carbon nanotubes,” Carbon nanotubes. Springer Berlin Heidelberg, 2001.
[11] P.S.M Vosguerichian and B. Zhenan, “A review of fabrication and applications of carbon nanotube film-based flexible electronics,” Nanoscale, 2013.
[12] Y-M. Chien, F. Lefevre, I. Shih and R. Izquierdo, “A solution processed top emission OLED with transparent carbon nanotube electrodes” Nanotechnology, 2010.
[13] M.J. Allen, V.C Tung and R.B. Kaner, “Honeycomb carbon: a review of graphene,” Chemical reviews, 2009.
[14] H. Cho, J-W. Shin, N.S. Cho, J. Moon, J-H. Han, Y-D. Kwon, S. Cho, and J-I. Lee, “Optical effects of graphene electrodes on organic light-emitting diodes,” Ieee Journal of selected topics in Quantum Electronics, Vol. 22, No. 1, January/February 2016.
[15] X. Li, Y. Zhu, W. Cai, M. Borysiak, B. Han, D. Chen, R.D. Piner, L. Colombo, and R.S. Ruoff, “Transfer of large-area graphene films for high-performance transparent conductive electrodes,” American Chemical Society, 2009.
[16] Y. Jang, Ji. Kim and D. Byun, “Invisible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing,” Journal of Physics D: Applied Physics, 2013.
[17] M-G. Kang, H.J. Park, S.H. Ahn, L.J. Guo, “Transparent Cu nanowire mesh electrode on flexible substrates fabricated by transfer printing and its application in organic solar cells,” Solar Energy Materials and Solar Cells, 2010.
[18] G. Kim, J-H. Shin, H-J. Choi, H. Lee, “Fabrication of transparent and flexible Ag three-dimensional mesh electrode by thermal roll-to-roll imprint lithography,” J Nanopart Res, 2014.
[19] Q. Zhang, X. Wan, F. Xing, L. Huang, G. Long, N. Yi, W. Ni, Z. Liu, J. Tian, and Y. Chen, “Solution-processable graphene mesh transparent electrodes for organic solar cells,” Nano Research, 2013.
[20] T. Gao, B. Wang, B. Ding, J-k. Lee, and P.W. Leu, “Uniform and ordered copper nanomeshes by microsphere lithography for transparent electrodes,” American Chemical Society, 2014.
[21] H. Wu, L. Hu, M.W. Rowell, D. Kong, J.J. Cha, J.R. McDonough, J. Zhu, Y. Yang, M.D. McGehee, and Y. Cui, “Electrospun metal nanofiber webs as high-performance transparent electrode,” American Chemical Society, 2010.
[22] J. Xu, C. Liu, P-C. Hsu, K. Liu, R. Zhang, Y. Liu, and Y. Cui, “Roll-to-Roll transfer of electrospun nanofiber film for high-efficiency transparent air filter,” American Chemical Society, 2016.
[23] 裘性天 黃亭凱,特殊形貌銅與銀奈米材料製備之簡介, The Chinese Chemical Society, March, 2007.
[24] K-S. Chou, C-Y. Ren, “Synthesis of nanosized silver particles by chemical reduction method,” Materials Chemistry and Physics, 2000.
[25] D. He, B. Hu, Q-F. Yao, K. Wang, and S-H. Yu, “Large-scale synthesis of flexible freestanding sers substrates with high sensitivity: electrospun pva nanofibers embedded with controlled alignment of silver nanoparticles,” American Chemical Society, 2009.
[26] K-L. Liang, Y-C. Wang, W-L. Lin and J-J. Lin, “Polymer-assisted self-assembly of silver nanoparticles into interconnected morphology and enhanced surface electric conductivity,” The Royal Society of Chemistry, 2014.
[27] Y. Lee, J-r. Choi, K.J. Lee, N. E. Stott and D. Kim, “Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics,” Nanotechnology, 2008.
[28] B. Lee, Y. Kim, S. Yang, I. Jeong, J. Moon, “A low-cure-temperature copper nano ink for highly conductive printed electrodes,” Current Applied Physics, 2009.
[29] Y-T. Cheng, R-H. Uang, K-C. Chiou, “Effect of PVP-coated silver nanoparticles using laser direct patterning process by photothermal effect,” Microelectronic Engineering, 2011.
[30] Y-L. Zhang, Q-D. Chena, H. Xiaa, H-B. Sun, “Designable 3D nanofabrication by femtosecond laser direct writing,” Nano Today, 2010.
[31] S. Hong, J. Yeo, G. Kim, D. Kim, H. Lee, J. Kwon, H. Lee, P. Lee, and S.H. Ko, “Nonvacuum, maskless fabrication of a flexible metal grid transparent conductor by low-temperature selective laser sintering of nanoparticle ink,” American Chemical Society,2013.
[32] H. Min, B. Lee, S. Jeong, M. Lee, “Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink,” Optics & Laser Technology, 2017.
[33] H. Narcus, “Metal Finishing,” 1947.
[34] A. E. Carhill, “AES Pro,”1957.
[35] R. j. Zebliski, “U.S. Patent,” June 27, 1972.
[36] H. Oita, M. Matsuoka and C. Iwakura, “Deposition rate and morphology of electroless copper film from solutions conting 2 2’-dipyridyl,” Electrochimica Acta, 1997.
[37] D.T. Hsu, F.G. Shi, S. Lopatin, Y.S. Dimand, B. Zhao, M. Brongo and P.K. Vasudev, “Electroless copper deposition solution induced chemical changes in low-k fluorinated dielectrics,” Materials Science in Semiconductor Processing, 1999.
[38] Y.A. Yang, Y.B. Wei, B.H. Loo and J.N. Yao, “Electroless copper plating on a glass subatrate coated with ZnOfilm under UV illumination,” Journal of Electroanalytical Chemistry, No. 462, 1999.
[39] J. P. O’kelly, K. F. Mongey, Y. Gobil, J. Torres, P. V. Kelly, and G. M. Crean, “Room temperature electroless plating copper seed layer process for damascence interlevel metal structures,” Microelectronic Engineering, Vol. 50, 2000.
[40] H. Honma and T. Kobayashi, “Electroless copper deposition process using glyoxylic acid as a reducing agent,” J. Electrochem, 1994.
[41] J. Shu, B. P. A. Grandjean, and S. Kaliaguine, Ind.Eng, “Effects of Cu(OH)2 on electroless copper plating,” Ind. Eng. Chem. Res, Vol. 36, 1997.
[42] A. Hung, “Electroless copper deposition with hypophosphite as reducing agent,” Plating and Surface Finishing, Vol. 75, No. 1, 1988.
[43] 蔡明蒔, “半導體製程中銅電鍍技術之製程及設備,”電子月刊, 4月號, 1999.
[44] H. H. Hsu, J. W. Yeh, and S. J. Lin, “Repeated 3d nucleation in electroless cu deposition and the grain boundary structure involved,” J. Electrochem.Soc, 2003.
[45] C-Y. Kao and K-S. Chou, “Electroless copper plating onto printed lines of nanosized silver seeds,” Electrochemical and Solid-State Letters, 2007.
[46] Y-C. Liao and Z-K. Kao, “Direct writing patterns for electroless plated copper thin film on plastic substrates,” American Chemical Society, 2012.
[47] Y. Jin, D. Deng, F. Xiao, “Site-selective fabrication of patterned transparent copper mesh on flexible substrates at mild temperature for green, low cost electronics,” Electronic Components and Technology Conference, 2013.
[48] P-C. Hsu, D. Kong, S. Wang, H. Wang, A.J.W. Hui and Y. Cui, “Electrolessly deposited electrospun metal nanowire transparent electrodes,” American Chemical Society, 2014.
[49] S. Kiruthika, R. Gupta, A. Anand, A. Kumar and G. U. Kulkarn, “Fabrication of oxidation-resistant metal wire network-based transparent electrodes by a spray-roll coating process,” American Chemical Society, 2015.
[50] J. Huang, Z. Chen, F. Zhou, H. Wang, Y. Yuan, W. Chen, M. Gao, Y. Zhan, “High-adhesive electroless copper plating on polyethylene surface modified with primer,” J Solid State Electrochem,2017.
[51] H. Niino and A. Yabe, “Excimer laser polymer ablation: formation of positively charged surfaces and its application into the metallization of polymer films,” Applied Surface Science, 1993.
[52] D. Chena, Y. Lia, Q. Lua, J. Yina, Z. Zhua, “Selective silver seeding on laser modified polyimide for electroless copper plating”, Applied Surface Science, 2005.
[53] J. Xu, Y. Liaoa, H. Zengc, Z. Zhou, H. Sun, J. Song, X. Wang, Y. Cheng, Z. Xu, K. Sugiok, and Katsumi Midorikawa, “Selective deposition of conductive copper films on glass surfaces using femtosecond laser surface modification and electroless plating,” Lasers in Material Processing and Manufacturing, Vol. 6825, 68250L, 2007.
[54] Y. Liao, J. Xu, H. Sun, J. Song, X. Wang, Y. Cheng, “Fabrication of microelectrodes deeply embedded in LiNbO3 using a femtosecond laser,” Applied Surface Science, 2008.
[55] M. Lv, J. Liu, X. Zeng, Q. Du, J. Ai, “High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating,” Applied Surface Science, 2015.
[56] M. Hu, Q. Guo, T. Zhang, S. Zhou and J. Yang, “SU-8-induced strong bonding of polymer ligands to flexible substrates via in situ cross-linked reaction for improved surface metallization and fast fabrication of high-quality flexible circuits”, American Chemical Society,2016
[57] K. Kordas, S. Leppavuori, A. Uusimaki, Thomas F. George, L. Nanai, R. Vajtai, K. Bali, J. Bekesi, “Palladium thin film deposition on polyimide by CW Ar laser radiation for electroless copper plating,” Thin Solid Films, 2001.
[58] J.G. Liu, C.H. Chen, J.S. Zheng, J.Y. Huang, “CO2 laser direct writing of silver lines on epoxy resin from solid film,” Applied Surface Science, 2005.
[59] D. Chen, Q. Lu and Y. Zhao, “Laser-induced site-selective silver seeding on polyimide for electroless copper plating,” Applied Surface Science, 2006.
[60] N.S. Dellasa, P. K. Meinert, S. E. Mohney, “Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition,” Journal of Laser Applications Volume 20, Number 4 November 2008.
[61] K-L. Liang, Y-C. Wang, W-L. Lin and J-J. Lin, “Polymer-assisted self-assembly of silver nanoparticles into interconnected morphology and enhanced surface electric conductivity,” RSC Adv, 2014.
[62] R. Abargues, M.L. Martinez-Marco, P.J. Rodriguez-Canto, J. Marques-Hueso, J.P. Martinez-Pastor, “Metal-polymer nanocomposite resist: a step towards in-situ nanopatterns metallization,” Advances in Resist Materials and Processing Technology, 2013.
[63] J. Chung, et al. “Conductor microstructures by laser curing of printed gold nanoparticle ink,” Applied Physics Letters, 2004.
[64] M. Aminuzzaman, W. Akira and M. Tokuji, “Laser direct writing of conductive silver micropatterns on transparent flexible double-decker-shaped polysilsesquioxane film using silver nanoparticle ink,” Journal of Electronic Materials, 2015.
[65] 魏楷, “雷射直寫技術應用於金屬網格軟性透明電極製作,” 2017.
[66] Alzoubi, Khalid, et al. “Bending fatigue study of sputtered ITO on flexible substrate,” Journal of Display Technology, 2011.
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