博碩士論文 104323047 詳細資訊




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姓名 戴衡君(Heng-Chun Tai)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 雷射光誘發氧化還原合成N型矽奈米晶之研究
(Study of Synthesis of N-type Silicon Nanocrystals by Laser Induced Redox Process)
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摘要(中) 一般而言,多孔矽結構都是使用外加電場驅動的電化學蝕刻產生。透過控制電流、電壓以及時間控制在蝕刻液中來產生所需要的多孔矽結構。本研究的特點處為不施以外加電場,純使用1064nm波長雷射和蝕刻溶液,於N型矽晶圓表面上進行氧化還原反應就可以產生多孔矽結構,而其蝕刻的現象會發生在受雷射照射以及非受雷射照射側。但透過調整蝕刻溶液的體積比例,可以控制其蝕刻現象只發生在非受雷射照射的那一側。隨著蝕刻時間的改變,蝕刻點的表面結構也會隨之變化。且透過改變蝕刻溶液的體積比例,可以改變所生成的矽奈米晶粒尺寸。根據實驗結果,這現象能用蝕刻液-半導體能障(Schottky Barrier)原理及改變方式來解釋。
摘要(英) In general, porous silicon structures are produced using electrochemical etching driven by electric fields. The desired porous silicon structure is generated by controlling the current, voltage, and time in the etchant. The characteristic of this study is not applied to the external electric field, only use of 1064nm wavelength laser and etchant, in the N-type silicon wafer surface redox reaction can produce porous silicon structure, and the etching phenomenon occurs not only on the laser irradiation side but also on the non-laser irradiation side. But by adjusting the volume ratio of the etchant, it can control the etching phenomenon only occurs on the side of the non-laser irradiation. When the etching time changes, the surface structure of the etching point will also change. By changing the volume ratio of the etchant, the size of the nanocrystal grains can be changed. According to the experimental results, this phenomenon can be explained by electrolyte-semiconductor barrier (Schotty barrier) theory.
關鍵字(中) ★ 矽奈米晶
★ 蝕刻
★ 光化學
★ 光激發光
★ 費米能階
關鍵字(英)
論文目次 摘要 I
Abstract II
誌謝 III
目錄 IV
圖目錄 VII
表目錄 XII
第一章 緒論 1
1.1研究背景 1
1.2多孔矽的製作 2
1.2.1濕式蝕刻法(Wet Etching) 3
1.2.2電化學蝕刻法(Electrochemical Etching) 4
1.2.3乾式蝕刻(Dry Etching) 5
1.3多孔矽的應用 5
1.4研究動機與目標 11
第二章 原理與文獻回顧 12
2.1 多孔矽模型理論 12
2.1.1 Rate模型(Rate Model) 12
2.1.2量子模型(The Quantum Model) 13
2.1.3貝爾模型(The Beale Model) 13
2.1.4擴散限制模型(The Diffusion-Limited Model) 14
2.2多孔矽的形成機制 15
2.2.1電化學蝕刻 15
2.2.2光化學蝕刻 17
2.3光電效應 18
2.3.1光電效應吸收機制 19
2.4蕭特基接觸原理 20
2.4.1半導體-金屬接面原理 22
2.4.2半導體-電解液接面原理 23
第三章 實驗準備與實驗步驟 24
3.1實驗材料及設備 24
3.2分析儀器介紹 27
3.3實驗步驟 32
3.3.1實驗流程 32
3.3.2矽晶圓清洗 34
3.3.3實驗設備架設 35
3.3.4實驗參數設定 36
第四章 結果與討論 37
4.1 光化學蝕刻結果討論 37
4.1.1 HF:EtOH = 2:1 38
4.1.2 HF:EtOH = 1:2 47
4.1.3 HF:EtOH = 1:1 55
4.2 雷射照射蝕刻現象 68
第五章 結論 70
第六章 參考文獻 71
參考文獻
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指導教授 李天錫 審核日期 2017-6-21
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