博碩士論文 104324016 詳細資訊




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姓名 鐘元亨(Yuan-Heng Zhong)  查詢紙本館藏   畢業系所 化學工程與材料工程學系
論文名稱 添加微量錫銀銅合金之銅薄膜與銅基板之接合研究
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摘要(中) 在電子構裝中,以銲料為主的覆晶接合方式已經沿用數十年,然而銲料與金屬層或金屬基板在加熱時會反應生成介金屬化合物,產生許多可靠度的問題,因此,許多研究開始朝向直接銅-銅接合的方法以消除這些問題。銅具有良好的導電性以及成本低等優點,但其表面易氧化及汙染的問題仍是直接銅-銅接合所要面臨的一大挑戰。由於表面的氧化以及汙染物會使構裝溫度增加,因此許多研究為了降低構裝溫度,於製程上的環境方面以及表面處理的要求相對嚴格,製造成本也因儀器的使用而增加,因此在本實驗中以微米級的銅顆粒作為介質,並在其中加入微量的錫粉(SAC305),藉著其低熔點特性與銅反應來補強顆粒連接性的不足,以達到銅-銅接合的目的,其製程簡單,製造成本相對較低,對環境要求也比較不嚴苛。
將銅箔表面經研磨處理後,作為接合基板,以化學還原的方式,保護微米銅顆粒表面不被氧化,並添加錫銀銅合金(SAC305)及其他物質作為之溶劑的調整,配製成銅墨,並塗佈於銅箔上,觀察並改善接合狀況,並在不同的溫度、時間以及錫(SAC305)含量的條件下作比較,並在氮氣的條件下完成低溫接合。
摘要(英) Solder bump bonding has been the mainstream in packaging technology for many years. Cu to Cu bonding has been reported in recent years because of its excellent conductivity and low costs. However, great challenges exist for Cu to Cu bonding process due to surface oxidation when fabricated at high bonding temperature. In this study, micron-size Cu particles added with trace amount of SAC305 particles are used to fabricate strong Cu bumps. SAC 305 quickly dissolves in Cu matrix and fills the gaps between the Cu particles by interfacial reaction. Pastes are formed by micron-size Cu and SAC 305 particles dissolving in a solvent to prevent from oxidation by chemical reaction. The pastes are coated on Cu foils to form Cu bumps and aged at various temperatures and times. The Cu coated foils are bonded face-to-face and a continuous void-free Cu bumps at a temperature below 150 oC in a nitrogen environment without external pressure.
關鍵字(中) ★ 銅-銅接合
★ 燒結
關鍵字(英)
論文目次 中文摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VI
表目錄 X
第一章 序論 1
1-1 前言 1
1-2 微電子構裝 2
1-2-1 構裝之定義與目的 2
1-2-2 電子構裝層級區分 3
1-3 3D IC 構裝技術 6
1-4 無鉛銲料可靠度問題之文獻回顧 7
1-4-1 銲料過冷度對構裝之影響 7
1-4-2 介金屬化合物之相生成對可靠度之影響 9
1-4-3 三維積體電路構裝之可靠度問題 10
1-5 銅-銅接合之文獻回顧 14
1-5-1 表面活化接合(Surface Activated Bonding, SAB) 14
1-5-2 熱壓接合 16
a、銅表面改質接合 17
1. Ar-FAB + CMP 17
2. 銅表面親水接合 19
3. 金屬鹽反應接合 21
4. 銅自擴散接合 22
1-5-3鈍化層保護接合 25
a、自組裝單分子層保護接合(Self-Assembled Monolayer, SAM) 26
1、有無SAM之比較 28
2、不同SAM處理之比較 29
b、金屬鈍化層接合 32
1、金鈍化層 32
2、鈦鈍化層 35
3、鈀鈍化層 37
1-5-4 銅燒結接合 38
a、奈米級銅墨接合 39
b、微米級銅墨接合 41
1-6 研究動機 43
第二章 實驗方法 44
2-1 材料製備 44
2-1-1 銅箔準備 44
2-2 銅-錫混合墨製備 44
2-3 銅燒結接合 46
2-4 試片分析 46
2-4-1 掃描式電子顯微鏡(SEM) 46
2-4-2 X-ray繞射儀(XRD) 47
2-4-3 能量散步光譜儀(EDS) 47
第三章 結果與討論 48
3-1 不同溶劑之銅錫混合墨薄膜燒結接合 48
3-1-1 0.5M抗壞血酸溶液之銅錫混合墨 48
3-1-2 微量明膠溶液之銅錫混合墨 52
3-1-3 明膠-甲酸溶液之銅錫混合墨 54
3-2 不同參數對明膠-甲酸溶液之銅錫混合墨燒結的影響 56
3-2-1 溫度對燒結接合之影響 56
3-2-2 不同粒徑混合粉比較 59
3-2-3 錫含量改變對燒結接合之影響 60
3-3 膠體溶液之影響 63
3-3-1 明膠膠體粒子 63
3-3-2 水溶劑之影響 63
第四章 結論 65
參考資料 67
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指導教授 吳子嘉(Albert T. Wu) 審核日期 2017-8-17
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