博碩士論文 105226036 詳細資訊




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姓名 林冠廷(Kuan-Ting Lin)  查詢紙本館藏   畢業系所 光電科學與工程學系
論文名稱 以玻璃中介層架構設計適用於高畫質多媒體介面之光連接收發模組
(Design of Optical Interconnect Transceiver Based on Glass Interposer and Applied for High Definition Multimedia Interface)
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摘要(中) 本論文提出以玻璃中介層架構設計適用於高畫質多媒體介面(High Definition Multimedia Interface , HDMI)之光連接收發模組,此模組整合垂直共振腔型面射型雷射、光偵測器、雷射驅動晶片、轉阻放大器晶片、微45°反射面及高分子聚合物波導於玻璃中介層上。其中垂直共振腔型面射型雷射、光偵測器與雷射驅動晶片、轉組放大器晶片之間以高頻傳輸線連接,並以覆晶封裝方式封在玻璃中介層一側,另一側封裝高分子聚合物波導。
經由光學模擬,最佳的光學耦合效率發射端光學系統為57.68%,接收端光學系統為59.62%。在最佳光學耦合效率降至 -1 dB為準為時,雷射與光偵測器位移容忍度均為 9 m以上,在發射端與接收端多模光纖位移容忍度均為 13 m以上。各通道間光學串音干擾在發射端與接收端皆小於 -44 dB以下。
提出的玻璃中介層上之高頻傳輸線設計,發射端與接收端中所設計之單端式高頻傳輸線,在頻率0 ~ 62.5 GHz其反射損耗皆小於 -20 dB、插入損耗皆大於 -0.2 dB。模組內所設計之差動式高頻傳輸線,在頻率0 ~ 50 GHz,四個通道的反射阻抗皆小於 -10 dB、插入損耗皆大於 -1.5 dB。
在印刷電路板上之高頻傳輸線設計,各通道插入損耗在0 ~37.5 GHz皆高於 -2 dB,反射損耗皆低於 -8 dB。最後光連接收發模組覆晶封裝於印刷電路板之差動式高頻傳輸線,各通道插入損耗在0 ~37.5 GHz皆高於 -2 dB,反射損耗在0 ~37.5 GHz皆低於 -7 dB。
摘要(英) In this thesis, we proposed the design of optical interconnect transceiver based on glass interposer and applied for High Definition Multimedia Interface (HDMI). The VCSELs, PD, VCSELs Driver IC, TIA, 45° micro-reflector and polymer waveguides will be integrated on glass interposer. The VCSELs, PD and Driver IC, TIA connecting with each other using high-frequency transmission lines and integrated on one side of glass interposer by flip-chip packaging. Polymer waveguides package on another side of glass interposer.
The simulation result of maximum optical coupling efficiency is 57.68 % at optical system of transmitting end and 59.62 % at optical system of receiving end. The alignment tolerance at -1 dB level for VCSEL and PD are larger than 9 m, MMF are larger than 13 m at TOSA and ROSA. The optical crosstalk between each channel is smaller than -44 dB at TOSA and ROSA.
Design of high-frequency transmission lines on glass interposer is proposed. According to the simulation result, design of single-ended and differential-pair transmission lines for TOSA and ROSA. Single-ended transmission lines at 0~62.5 GHz, return loss is smaller -20 dB and insertion loss larger than -0.2 dB for each channel. Differential-pair transmission lines at 0~50 GHz, return loss is smaller than -10 dB and insertion loss is larger than -1.5dB for each channel.
Design of differential–pair transmission lines on printed circuit board (PCB) is proposed. According simulation result, differential-pair transmission lines at 0~7.5 GHz, return loss smaller than -8 dB and insertion loss larger than -2 dB for each channel. Simulation of transmission lines when optical interconnect transceiver flip-chip packaging on PCB, return loss is smaller than -7 dB and insertion loss is larger than -2 dB for each channel.
關鍵字(中) ★ 玻璃中介層
★ 高分子聚合物波導
★ 高畫質多媒體介面
關鍵字(英) ★ Glass interposer
★ polymer waveguide
★ High Definition Multimedia Interface
論文目次 中文摘要 I
英文摘要 II
誌謝 III
目錄 IV
圖索引 VI
表索引 XII
第一章 緒論 1
1-1前言 1
1-2光電混合式HDMI與相關技術之發展現況 6
1-3以玻璃中介層架構設計適用於光學式HDMI之收發模組 9
第二章 HDMI光連接收發模組之光學系統的設計與模擬 11
2-1玻璃中介層之光連接收發模組架構 11
2-2高分子聚合物波導結構尺寸設計 13
2-3高分子聚合物波導之光學模擬 22
2-3-1高分子聚合物波導之光場變化模擬 22
2-3-2面射型雷射、光偵測器與多模光纖之容忍度模擬 25
2-3-3高分子聚合物波導之串音干擾模擬 29

第三章 HDMI光連接收發模組之高頻傳輸線的設計與模擬 31
3-1高頻傳輸線的設計原理 33
3-2單端式高頻傳輸線設計與模擬 35
3-2-1發射端之單端式高頻傳輸線 36
3-2-2接收端之單端式高頻傳輸線 38
3-3差動式高頻傳輸線設計與模擬 40
第四章 印刷電路板上高頻傳輸線之設計與模擬 43
4-1印刷電路板上差動式高頻傳輸線設計與模擬 44
4-2光連接收發模組封裝於印刷電路板上時之高頻傳輸線模擬 48
第五章 結論和未來展望 50
5-1結論 50
5-2未來展望 51
參考文獻 52
參考文獻 [1] IHS Markit: Year 2018 Will See First Uses of 8K Resolution Display, 2018
[2] HDMI Licensing Administrator, Inc: The Road to 8K and Next Generation Features, 2018
[3]Wikipedia: HDMI
[4] Silicon Line: Technology, The Data Rate Explosion
[5] Schlepple, N., Nishigaki, M., Uemura, H., Furuyama, H., Sugizaki, Y., Shibata, H., Koike, Y. : Ultracompact 4×3.4 Gbps optoelectronic package for an active optical HDMI cable. In: CPMT Symposium Japan, 2nd IEEE, pp. 1–4, 2012
[6] H.-S. Lee, S.-S. Lee, Y.-S. Son, "CWDM based HDMI interconnect incorporating passively aligned POF linked optical subassembly modules", Opt. Exp., vol. 19, no. 16, pp. 15380-15387, 2011.
[7] H. S. Lee, S. S. Lee, and Y. S. Son, “High tolerance receptacle type active optical interconnect incorporating collimated beam based optics,” J. Lightwave Technol. 31(5), 815–821, 2013
[8] W. T. Khan, J. Tong, S. Sitaraman, V. Sundaram, R. Tummala, and
J. Papapolymerou, “Characterization of electrical properties of glass and
transmission lines on thin glass up to 50 GHz,” in Proc. IEEE Electron.
Compon. Technol. Conf., San Diego, CA, USA, 2015, pp. 2138–2143.
[9] W. C. Lai et al., “300 mm size ultra-thin glass interposer technology
and high-Q embedded helical inductor (EHI) for mobile application,” in
IEDM Tech. Dig., Washington, DC, USA, 2013, pp. 13.4.1–13.4.4.
指導教授 伍茂仁 張正陽(Mount-Learn Wu Jenq-Yang Chang) 審核日期 2018-7-24
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