摘要(英) |
Most of the wastes from the PCB manufacturing processes are copper-containing waste liquids. Due to the waste cleaning method and the consideration of industrial production operating costs in high-concentration portions most of the high-concentration waste solutions are shipped to contractors and recovered. The low-concentration noble metal palladium waste is directly discharged into the wastewater treatment plant. The main purpose of this study is to explore a cost-effective way to recover the precious metal palladium from the low-concentration waste liquid.
The results of the study show that the use of different types of reducing agents for the reduction and recovery of palladium-containing wastes from PCBs are based on the laboratory and actual plant operating results with the cost of reagents, reaction time, pH, deposition type, and recycled palladium content. In order to evaluate the conditions, zinc powder is the best feasible solution. In this study, the recoveries of E-plants in the five Pd-bearing waste liquids are the largest. It is estimated that the COD value is small, and the solution only exists as a single substitution reaction, indicating a pH range of 1~ 3.5 is the best.The more dosing the higher the palladium recovery rate. The best dosage of zinc is 6~7 g/l, and the best recovery rate can be obtained. In the tin-palladium system, due to the tin ion competition, the recovery rate is low resulting in more zinc and copper loss in the waste liquid. Recovery of palladium-containing waste liquor with zinc as a reducing agent, the reaction rate increased with the initial concentration. This reaction follows the Nernst equation reaction, the higher the initial concentration of reduced material, the greater the chemical driving force (ΔE). In different reaction time experiments, it shows that the three reducing agents (zinc, sodium borohydride, dimethylamineborane) reach a reaction of more than 85% at 0.5 hr, but it is caused by the back dissolution phenomenon with time. pH 0.5 is the best reaction time.
XRD analysis is performed on activated palladium wastes of A and E plants and zinc reduction method. The powder is analyzed by XRD and the result of the alignment is palladium. The powder is digested with aqua regia and refluxed and determined by atomic absorption spectrometry (AA). The palladium content is 49.2% and 52.7%, which is the highest recovery content of the reducing agent selected for this study.
According to SEM analysis, the recoverable palladium particle size is 4-10 μm when zinc is used as a reducing agent. And the particle size is 70-100 nm with sodium borohydride, and the particle size is 0.5-2 μm with sodium hypophosphite, Dimethylaminoborane. The particle size obtained by the alkane is 50~70 nm. It can be seen that the dimethylamine borane can get smaller particle size, but it is not good for the recovery of palladium metal from the actual plant., The recovery rate is reduced, while zinc and sodium borohydride are decreased. Flocculated palladium sludge can be obtained to increase filtration efficiency. ASAP surface pore analysis shows that the specific surface area and the smaller porosity can be obtained with sodium borohydride as a reducing agent. Although the sodium borohydride has a stronger reducing power, it is still a zinc powder if it is better recycled. |
參考文獻 |
1.TPCA 台灣電路板協會,建構北台灣電子科技網絡從PCB產業開始,台灣電路板協會產業報告,2013。
2.經濟部工業局,印刷電路板業污染防治法規與處理技術手冊,2014.
3.經濟部水利署 PCB 產業缺限水緊急應變措施,節水資源網, 2008.
4.行政院環保署,廢棄物清理法,2018。
5.經濟部工業局,PCB行業製程減廢及污染防治技術,環保技術輔導計畫,2008。
6.黃永方,印刷電路板產業化學鎳廢液回收鎳金屬之研究,碩士論文,國立交通大學,2009。
7.盧宜源,貴金屬冶金學,中國中南大學出版社,2011。
8.TPCA 台灣電路板協會,電路板濕製程全書,2008。
9.郭子瑋,自廢棄活性碳觸媒回收貴重金屬鈀之研究,碩士論文,國立台北科技大學,2011。
10.葉雅靜,SAC305合金及SAC105合金與ENEPIG表面處理之接合研究,碩士論文,國立交通大學,2012。
11.翁文爐,含貴金屬廢液資源化技術探討,2004。
12.經濟部工業局,電子零組件製造業產業節水與水再生技術手冊,2012。
13.凌景宏,探討活性碳對水溶液中重金屬銅、鈀、鎳之吸附程序,碩士論文,中原大學,2009。
14.鄧婉妤,以Fenton法結合Ferrite Process處理含EDTA與重金屬廢水,碩士論文,國立中山大學環境工程研究所,2004。
15.林坤明,羥乙基乙二胺(AEEA)對印刷電路板廢水銅離子處理效果之影響,碩士論文,國立中央大學環境工程研究所,2009。
16.陳進揚,以Fenton法及UV/H2O2結合Ferrite Process處理印刷電路板廢水之研究,碩士論文,國立中山大學環境工程研究所,2006。
17.鄭永富,印刷電路板顯影去墨廢液以Fenton 法配合PAC 吸附處理之研究,碩士論文,國立中央大學環境工程研究所,2008。
18.Ali Behnamfard,Mohammad Mehdi Salarirad,Francesco Veglio,Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation,Waste Management。
19.Zhiyuan Zhang, Fu-Shen Zhang,Selective recovery of palladium from waste printed circuit boards by anovel non-acid process,Journal of Hazardous Materials。
20.侯萬善,廢水金屬處理回收之技術方案與經濟效益,綠色技術發展中心。
21.彭振育,以鹼性萃取劑集支撐性液膜萃取分離鈀與鉑並以生命週期評估法探討環境影響係數之研究,國立台北科技大學,2014。
22.徐華祥,含金廢液資源化探討以印刷電路板為例,國立中央大學環境工程研究所碩士論文。
23.吳南明,陳文欽,應用置換法處理醫療電子印刷電路板硫酸銅廢液,元培醫事科技大學環境工程衛生系,健康管理學刊第二期第十二卷,2014。
24.顧洋,經濟部工業局,高級氧化程序在廢水的應用,1993。
25.許迪翔,洪肇嘉,以 STELLA 系統動態模式模擬活性碳吸附實驗,國立雲林科技大學環安系,台灣環境資源永續發展研討會,2008。
26.徐梓源,印刷電路板業含銀廢液電解之研究,國立中央大學環境工程研究所碩士論文,2015。
27.曾俊傑、陳彥政、張章平、郭俊良、葛明德,奈米鈀活化液應用於無電電鍍銅之研究,國防大學理工學院應用化學及材料科學系,中正嶺學報第四十卷第一期,(2011)。
28.黃聖淵,離子交換與電解法回收鈀和釕之探討,私立義守大學生物技術與化學工程研究所碩士論文,(2014)。
29.莊連春,印刷電路板業廢水處理技術介紹,萬能科技大學環境工程系。
30.Johan Sohaili, Shantha Kumari Muniyandi and Siti Suhaila Mohamad,A Review on Printed Circuit Board Recycling Technology,Department of Environmental Engineering,Faculty of Civil Engineering, Universiti Teknologi Malaysia,2012.
31.曾迪,吳文明,一種膠體活化鈀活化後的酸鈀廢液中回收鈀的工藝,中國專利,2015。
32.El-Safty SA, Shenashen MA, Sakai M, Elshehy E, Halada K.Detection and Recovery of Palladium, Gold and Cobalt Metals from the UrbanMine Using Novel Sensors/Adsorbents Designated with Nanoscale Wagonwheel-shaped Pores, National Institute for Materials Science,Waseda University, Japan,2015.
33. Philip L. Sibrell,Leaching of petroleum catalysts with cyanide for palladium recovery. Report of investigations,1995.
34.洪委成,鋁合金無電鍍鎳製程探討與表面特性研究,碩士論文,國立高雄應用科技大學,2008。
35.吳明晃,以化學置換程序處理水溶液中含鎘汞離子之研究,碩士論文,國立台灣科技大學,2000。
36.李建豪,十二烷基硫醇螯合鈀超微粒子之製備,碩士論文,國立成功大學,1999。
37.潘贈傑,奈米鈀觸媒於矽烷改質之矽晶片上無電鍍鎳沉積之研究,碩士論文,國立清華大學,2014。
38.謝重仁,鈀金屬奈米粒子應用於印刷電路板無電鍍金屬層之研究,碩士論文,國立清華大學,2002。
39.郭俊良,製備奈米鈀活化液應用於無電電鍍製程之研究,碩士論文,國立中正理工學院,2007。
40.郭子豪,鈀、銀鈀金屬奈米粒子的製備與鑑定,碩士論文,國立中正大學,2007。
41.王正全,鈀奈米粒子之製備與應用,博士論文,國立成功大學,2001。
42.陳帛佑,無電鍍純鈀應用於印刷電路版表面處理上之研究,碩士論文,國立清華大學化學工程研究所,2009。
43.宋?謙,IC載板無電鍍鎳鈀金製程品質改善之實務研究,碩士論文,元智大學化學工程與材料科學學系,2016。
44.陳志銘,導入鈀表面處理層對錫鋅銲料與銅基材間介面反應的影響,碩士論文,國立中興大學化學工程研究所,2012。
45.黃建芬,一種高硫銅收補劑,中華人民共和國發明專利,西北冶礦研究所,2011。
46.郭放,一種採用超分子二次球型配位識別分離富集鈀的方法,中華人民共和國發明專利,遼寧大學,2010。
47.韓樹山,貴金屬和有色金屬硫化礦複合浮選藥劑,中華人民共和國發明專利,瀋陽冶礦研究所,1999。
48.A.L.AnacletoJ.R.Carvalho,Mercury cementation chloride solutions using iron, zinc and aluminium,Minerals Engineering, Volume 9, Issue 4,April 1996,Pages 385-397.
49.Hisayoshi Umeda,Atsushi Sasaki,Kunihiko,Takahashi,Kazutoshi Haga1, Yasushi Takasaki, Atsushi Shibayama1, Recovery and concentration of precious metals from strong acidic wastewater,Materials Transactions, Vol. 52, No. 7, The Japan Institute of Metals,2011.
50.M.Sathishkumar, K.Sneha, and Y.-S. Yun, Palladium Nanocrystal Synthesis Using Curcuma longa Tuber Extract, International Journal of Materials Sciences.ISSN 0973-4589 Volume 4, Number 1, 2009.
51.Wang Danzhou, Xu Jiayi, Zhang Xiaogeng,Practice of Water Pollution Tax in Foreign Countries and Its Reference for China ,Management School, Jinan University, Guangzhou Guangdong , China,2017.
52.Dian E. Roberts, Johannesburg,Robert J.Jackson,Recovery of platinum group metal and gold by synergistic react ion between allylalkyl thionocarbamates and dithiopi-iosphates,United States Patent,American Cyanamid company. |