博碩士論文 106353006 詳細資訊




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姓名 許博印(Po-Yin Hsu)  查詢紙本館藏   畢業系所 機械工程學系在職專班
論文名稱 晶粒成長行為對於高功率元件可靠度改善的驗證
(Validation of Reliability Improvement of High power Component Based on Grain growth Behavior)
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摘要(中) 科技產業近年蓬勃發展,在競爭激烈的環境中,企業欲維持市場的競爭力,須有效提升產品可靠度品質與壽命。因此,利用加速試驗(Accelerated Testing)可在相對較短的時間內預測產品的品質與可靠度。
當產品承受不同溫度負載時,各材料間的熱膨脹係數不匹配會造成熱應力產生,導致材料介面之間疲勞老化。本論文以半導體元件作為研究對象,探討熱能量對於可靠度之影響並提出改善方案。結果顯示熱能量為造成元件失效主因,而材料內部的微觀晶粒成長與熱能量呈現正相關。接下來以不增加散熱結構作為前提,在趨勢線斜率以及成本耗損之中找尋降低熱能量之最佳化方式,試圖提升產品可靠度。
摘要(英) The technology industry has flourished in recent years. In a highly competitive environment, enterprises must effectively improve the quality and longevity of their products in order to maintain market competitiveness. Therefore, Accelerated Testing can predict the quality and reliability of products in a relatively short period of time.
When the product is subjected to different temperature loads, the thermal expansion coefficient mismatch between the materials will cause thermal stress, resulting in fatigue aging between the material interfaces. This thesis takes semiconductor components as the research object, discusses the influence of thermal energy on reliability and proposes improvement schemes. The results show that thermal energy is the main cause of component failure, and the microscopic grain growth inside the material is positively correlated with thermal energy. Next, based on the premise of not increasing the heat dissipation structure, the trend of reducing the thermal energy is sought in the slope of the trend line and the cost loss, in an attempt to improve the reliability of the product.
關鍵字(中) ★ 熱能量
★ 熱膨脹係數
★ 疲勞老化
關鍵字(英) ★ Thermal energy
★ Thermal expansion coefficient
★ Fatigue aging
論文目次 目錄
摘要 iii
Abstract iv
誌謝 v
第一章 緒論 1
1-1前言 1
1-2研究動機與目的 3
1-3文獻回顧 5
1-4組織與架構 8
第二章 樣品架構與量測手法 9
2-1樣品結構 9
2-2可靠性試驗方法 9
2-3 即時溫度監測 11
2-4失效模式 14
2-5 檢測與分析 16
第三章 實驗數據與分析 18
3-1測試樣品與架構 18
3-2 實驗設計參數 20
3-3 實驗結果分布 22
3-4失效結構與分析 28
第四章 改善實驗方法 31
4-1熱能密度對同質材料測試 31
4-2熱能量對非同質材料測試 38
4-3熱能密度對同質材料微觀的影響 53
4-4熱能量對非同質材料微觀的影響 55
第五章 結論與未來展望 59
參考文獻 62
參考文獻 [1] Karen Bruzda,”Stress Minimization During Deflection of Thermally Conductive Gap Pads”, 2007: 1-4244-0958-6
[2] Thomas Rector Bieler.L.P. Lehman.Tim Kirkpatrick,” Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints.” IEEE Transactions on Components and Packaging Technologies(2008) 31(2):370 - 381
[3] Wataru Nakayama ; Katsuhiro Koizumi ; Takashi Fukue ; Masaru Ishizuka ; Tatsuya Nakajima ; Hiroko Ohta ; Ryuichi Matsuki,”Thermal characterization of high-density interconnects: A methodolgy tested on a model coupon”, Conference on. IEEE,(2010)
[4] High performance thermal interface materials with enhanced reliability, 28th IEEE Intersociety
Conference on. IEEE, (2012), 12692478
[5] Haitao, M. A., X. Haiping, and L. Wang. "Effect of a trace of Bi and Ni on the microstructure and wetting properties of Sn– Zn–Cu lead-free solder." J. Mater. Sci. Technol 23 (2007): 81-84.
[6] Tateyama, Kazuki, et al. " Effects of Bi Content on Mechanical Properties and Bump Interconnection Reliability on Sn-Ag Solder Alloys.”  Proceedings of SPIE - The International Society for Optical Engineering (2000)23:1063-1674
[7] Zhou Bin ; Qiu Baojun ,”Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology “,504.1 (2009): 10444986
[8] JEDEC Standard .”Power and Temperature Cycling” JESD22-A105C, Jedec Solid state technology association (2004)
指導教授 傅尹坤(Yiin-Kuen Fuh) 審核日期 2019-6-26
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