博碩士論文 106450038 詳細資訊




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姓名 范秋月(Chiou-Yueh Fan)  查詢紙本館藏   畢業系所 高階主管企管碩士班
論文名稱 半導體封測產業併購動機及效益探討─以A公司為例
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摘要(中) 面對資訊科技時代企業全球化的潮流,全球半導體產業的發展軌跡也愈加快速,而半導體封測業者之間的競爭也隨著產業的發展而變得更加激烈,許多企業透過併購其它公司來擴張其事業版圖。
併購即所謂M&A(合併與收購;Merge & Acquisition),是企業經營成長的一項策略工具,企業可以藉由併購來提昇企業綜效(Synergy),已經是許多跨國企業征戰全球佈局與提高全球市場競爭力的重要途徑。經由併購,併購後之公司可擁有更大的市場份額,這有助於公司獲得規模經濟並變得更有利可圖;同時,併購也將減少競爭者增加市場佔有率,並可能導致消費者的價格上漲。
本文透過分析A公司的併購模式及併購綜效,深入研究個案公司2000年至2017年所進行之併購事件對企業成長的影響,找出在併購上所面臨的挑戰與威脅提出最佳的因應策略;另外根據財務指標分析來探討A公司歷年併購案的併購績效,檢視合併後A公司在國際市場上的競爭能力,進一步提出對半導體封測產業在併購策略之建議。
摘要(英) With the globalization of information technology, the pace of development of the global semiconductor industry has accelerated, and the competition among semiconductor packaging and test companies has become more and intense,
Merger and acquisition (M&A), is a strategic tool for business growth, companies seek to extract synergies through mergers and acquisitions, for many multinational corporations, it is thought an important approach to improve enterprises globalization and market competition capability. Through mergers and acquisitions, companies will have an increased market share, which helps the firm gain economies of scale and become more profitable; the mergers and acquisitions will also reduce competition, increase market power and could lead to higher prices for consumers.
This paper analyzes the M&A model of company A and synergies in regard to M&A. The purpose of this study is to analyze the impact of M&A conducted by case companies from 2000 to 2017 on business growth, to find out more about M&A challenges and threats, and how to best prepare for countermeasures. The paper also addresses the practical applications of financial statement; In addition, according to financial indicators, analyze the company’s M&A benefits over the years, review the international competitiveness of company A in the market after M&A, further proposals for the M&A strategy of the semiconductor packaging and testing industry were presented.
關鍵字(中) ★ 半導體封測業
★ 併購
★ 綜效
關鍵字(英) ★ Semiconductor Packaging and Test
★ M&A
★ synergy
論文目次 1.1 前言 1
1.2 研究動機 4
1.3 研究目的 4
1.4 研究範圍 4
1.5 論文架構 5
第二章 產業分析與文獻探討 7
2.1 半導體簡介 7
2.2 半導體封測製程與技術發展 10
2.3 併購定義、種類與動機 12
2.4 跨國企業併購 16
2.5 併購後的整合與執行 19
2.6 併購效益 21
第三章 個案公司介紹 25
3.1 個案公司簡介 25
3.2 成長歷程 26
3.3 產品介紹 27
3.4 經營理念與核心文化 30
3.5 經營策略及價值訴求 32
3.6 未來挑戰 33
第四章 個案分析與探討 36
4.1 個案背景 36
4.2 個案公司之併購動機 38
4.3 個案公司併購後整合策略 43
4.4 個案公司之併購效益 47
4.5 個案公司策略發展與長期經營目標 54
第五章 結論與建議 56
5.1 研究結論 56
5.2 對個案公司建議 59
5.3 後續研究建議 60
參考文獻 61
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指導教授 何應欽 審核日期 2019-6-6
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