博碩士論文 107329008 詳細資訊



以作者查詢圖書館館藏 、以作者查詢臺灣博碩士 、以作者查詢全國書目 、勘誤回報 、線上人數：10 、訪客IP：3.145.44.174
姓名 陳俊宇(Chun-Yu Chen)  查詢紙本館藏   畢業系所 材料科學與工程研究所
論文名稱 以濕蝕刻法於可撓性聚亞醯胺基板製作微通孔之研究
(Fabrication of Micro-through holes by wet etching on Flexible Polyimide Substrate)
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 ( 永不開放)
摘要(中) 本研究期望利用電鍍法製作銅蝕刻遮罩，並藉由濕式蝕刻法，在PI基板上蝕刻出30 μm之圓孔且taper angle趨近於0.，並探討在蝕刻中加入水刀、水刀前淨泡蝕刻液、蝕刻時間對PI開孔以及蝕刻輪廓之影響。
本研究結果顯示： (1) 在蝕刻中加入水刀裝置可使蝕刻錐角較為垂直，但不影響蝕刻速率。(2) 水刀前浸泡腐蝕液，使PI有些微侵蝕的效果，在定溫、定壓下，蝕刻時間為影響蝕刻輪廓的主要因素，水刀與前浸泡搭配出接近的時間可得類似的蝕刻輪廓。當蝕刻時間增加時，PI基板側面蝕刻輪廓由原本的倒梯形，因回蝕的現象發生逐漸轉變尖嘴狀，隨著回蝕不斷發生蝕刻輪廓再逐漸轉變為正梯形，隨後不斷往側面蝕刻。(3)在85.的條件下，前浸泡10sec.+過水刀8次可以得到較理想的蝕刻輪廓，其taper angle為28.。利用乾蝕刻短時間修飾濕蝕刻之試片，可減少taper angle約12.，使輪廓較為垂直。(4)蝕刻後的試片Cpk值為0.98，在製程能力上仍需改善均勻性。
摘要(英) This study expects to fabricate 3D arrays Φ30μm micro holes on the flexible PI substrate by wet etching and discuss the effect of injection times of nozzle, immersion the etching solution before injection nozzle and the etching time to the etching profile.
The results are as follow: (1) Adding the nozzle to the process can make the etching profile more vertical,but doesn’t affect the etching rate.(2)Immersion the etching solution before the nozzle injection makes the PI substrate slightly erosive, the etching time is the main factor affecting the etching profile, that means at the constant temperature and pressure, using different combination of injection times and previous immersion times can make a similar etching profile, when the etching time increases, the etching profile changes from inverted trapezoid into a trapezoid, because the etching happens from the bottom.(3) under the condition of 85.C, previous immersion 30s and 6 times of nozzle injection can get the ideal etching profile, its taper angle is about 28.. Using dry etching to modify the wet etched sample in 6mins can reduce the taper angle about 12..(4)The Cpk value is 0.98, that means the uniformity of the holes needs to be improved .
關鍵字(中) ★ 聚亞醯胺
★ 濕式蝕刻法
★ 微通孔		 關鍵字(英) ★ polyimide
★ wet etching
★ micro through hole
論文目次 目錄
摘要 I
Abstract II
目錄 IV
表目錄 VII
圖目錄 VIII
一、前言與文獻回顧 1
1.1 電路板(PCB)簡介 1
1.2 軟性電路板(FPC)製程 1
1.3 聚亞醯胺（PI）研究背景 2
1.3.1 聚亞醯胺(PI)種類介紹 2
1.5 聚亞醯胺(PI)軟性電路板 4
1.5.1具有接著劑型銅箔基板 5
1.5.2無接著劑型銅箔基板 6
1.6 微影成像技術及原理[XIA1] 9
1.6.1 設計光罩 9
1.6.2 光阻[XIA2] 10
1.6.3 曝光[XIA3] 11
1.6.4 顯影[XIA4] 12
1.7 穿孔製程 12
1.7.1 機械穿孔 12
1.7.2 雷射穿孔 15
1.7.3 蝕刻製程 18
1.8 濕蝕刻參數之影響[HAN1] 21
1.9 聚亞醯胺(PI)的蝕刻機制 22
1.8 聚亞醯胺蝕刻後表面形貌 24
1.9 製程能力指數 (Process Capability Index,PCI) 25
1.10 研究背景與目的 26
二、實驗方法 28
2.1實驗步驟 28
2.1.1銅遮罩之製備 29
2.2實驗藥品與儀器 30
2.2.1濕蝕刻機 30
2.2.2 PI蝕刻液 31
2.2.3乾蝕刻機 32
2.2.4電子槍蒸鍍系統(E-Gun Evaporator) 32
2.2.5光學顯微鏡(OM) 32
2.2.6冷場發射掃描式電子顯微鏡(Cold Field-Emission Scanning Electron Microscope ; CFESEM) 32
2.2.7旋轉塗佈機(spin coater) 33
2.2.8 光罩對準曝光機 34
2.2.9 高解析電源電錶(Biologic sp-150) 34
三、結果與討論 35
3.1 銅遮罩之形貌影響 35
3.2 蝕刻參數的影響 37
3.2.1 水刀對濕蝕刻的影響 37
3.2.2 前淨泡的影響 39
3.2.3 蝕刻時間的影響 40
3.2.4 蝕刻時間對蝕刻輪廓的變化 45
3.3 聚亞醯胺蝕刻原理 47
3.4 乾蝕刻製程比較 49
3.5 乾、濕蝕刻結合製程 50
3.6 蝕刻後孔徑Cpk分析 53
四、結論 55
五、參考文獻 57
參考文獻 U. Buder, J.-P. von Klitzing, “Reactive ion etching for bulk structuring of polyimide”, Sensors and Actuators Vol.132, PP.393-399(2006)
T.T Cao, U. Male and D.S. Huh,“Fabrication of pore-selective carboxyl group functionalized polyimide honeycomb-patterned porous films using KOH humidity”, Polymer, Vol. 153, PP.86-94, (2018)
張靖霖,軟板製程技術與應用全覽，亞洲智識(2004)
Ching-Ho Yen, Chun-Chia Lee, “A Rectifying Acceptance Sampling Plan Based on the Process Capability Index”,Mathematics,(2020)
Guoyun Zhou, Wenbin Li, “ Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL”,Applied Surface Science,Vol.479,PP.512-518,(2019)
Ji-song Han, Zhi-yong Tan, K. Sato and M. Shikida,“Three-dimensional interconnect technology on a flexible polyimide film”, Journal of Micromechanics and Microengineering, Vol. 14, PP.38-48, (2004)
Ji-song Han, Zhi-yong Tan, K. Sato and M. Shikida,“Polyimide Film Micromachining by Wet-Etching Technology”, IEEJ Transactions on Sensors and Micromachines, Vol. 125, PP.27-36, (2005)
Ji-song Han, Zhi-yong Tan, “Thermal characterization of micro heater
arrays on a polyimide film substrate for fingerprint sensing applications” , Journal of Micromechanics and Microengineering , Vol.15,PP.282-289(2005)
Masatoshi Ohnishi,Hirokazu Shikata, “Micro-hole processing of polyimide film by ultra-short laser pulses and its applications”,Applied Physics A,Vol.98,PP.123-127(2010)
Michal Zawierta, Mariusz Martyniuk , “Control of Sidewall Profile in Dry Plasma Etching of Polyimide”, Journal of Microelectromechanical systems, Vol. 26 ,PP. 593-600(2017)
D. Kim and Y.R. Shen,“Study of wet treatment of polyimide by sumfrequency vibrational spectroscopy”, Appl. Phys. Lett., Vol. 74, PP. 3314-3316, (1999)
C.P. Liu, J.Y. Lin, Y.F. Liu and S.J. Chang,“ Facile chemical method of etching polyimide films for failure analysis (FA) applications and its etching mechanism studies”, Microelectronics Reliability, Vol. 54, PP.911-920, (2014)
Lee, Young Jun; Oh, Seon-Geun , “A Study of Dry Etching Characteristics of Polyimide Films in Flexible Displays with Trench Structures” , Science of Advanced Materials, Vol.8 , PP. 851-853 (2016)
A. Saiki, T. Iwayanagi, S. Nonogaki, T. Nishida and S. Harada, U.S. Pat, Vol. 4, PP.436-583, (1984)
Takashi Oguni, “Development of "TPE3000" Polyimide Etching Solution and Polyimide Processing using that Solution”, Journal of Photopolymer Science and Technology, Vol. 22,PP.397-402,(2009)
Takayuki Shibata, Satoshi Yukizono, “ Modified imprinting process using hollow microneedle array for forming through holes in polymers”, Microelectronic Engineering,Vol.88,PP2121-2125,(2011)
Takahiro Kawashima,Takahiro Sakai, “Mechanical characterization and insertion performance of hollow microneedle array for cell surgery”, Journal of Micro/Nanolithography, MEMS, and MOEMS,Vol.8,003041,(2009)
H.S. Virk,“ Physical and chemical response of 70 MeV carbon ion irradiated Kapton-H polymer”, Nucl. Instrum. Meth. Phys. Res. B, Vol. 191, PP.739-743,(2002)
Umashankar Male, Do Sung Huh, “Fabrication of robust honeycomb patterned porous films by thermochemical cross-linking of polyimide”,Vol.178,(2019)
Wanqin Zhao, Lingzhi Wang,“Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser”,Polymers,Vol.10,PP.1390,(2018)
蕭宏,“ 半導體製程技術導論”, 全華圖書股份有限公司, PP.180-181, (2014)
蕭宏,“ 半導體製程技術導論”, 全華圖書股份有限公司, PP.181-184, (2014)
蕭宏,“ 半導體製程技術導論”, 全華圖書股份有限公司, PP.193-196, (2014)
蕭宏,“ 半導體製程技術導論”, 全華圖書股份有限公司, PP.201-203, (2014)
蕭宏,“ 半導體製程技術導論”, 全華圖書股份有限公司, PP.316-328, (2014)
蕭育生,“化學法製備鎳奈米顆粒及鎳薄膜於軟性聚亞醯胺基板與特性研究”,國立交通大學材料工程研究所碩士論文,(2005)
C. Zhang, N.R Quick and A. Kar,“ A model for self-defocusing in laser drilling of polymeric materials”, Journal of Applied Physics, Vol. 103, PP.014909-014909-8, (2008)
沼倉研史,“高密度軟性電路板入門”,全華圖書股份有限公司 , PP.17-22,(2004)
沼倉研史,“高密度軟性電路板入門”,全華圖書股份有限公司 , PP.30-34,(2004)
Wanqin Zhao , Lingzhi Wang , “Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser” , Polymers , Vol. 10(12),(2018)
指導教授 李勝隆 李勝偉(Sheng Long Lee Sheng Wei Lee) 審核日期 2020-7-22
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題，請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407，或E-mail聯絡  - 隱私權政策聲明