使用濕式蝕刻後處理輔助之雷射藍寶石通孔研究

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蔣劭威(Shao-Wei Chiang) 查詢紙本館藏

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機械工程學系

論文名稱

使用濕式蝕刻後處理輔助之雷射藍寶石通孔研究
(Research on Laser Sapphire Vias Using Wet Etch Post-processing)

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摘要(中)

因為堅硬、易脆耐磨耗與高透光等特性，藍寶石的微精密加工一直很具有挑戰性，超快脈衝式雷射被認為是很有潛力的工具之一。本研究以降低雷射藍寶石基板微鑽孔之錐度為目的，嘗試一新雷射加工策略。載板為厚度 170微米的藍寶石基板，雷射則使用 300飛秒脈衝期、波長 1030奈米的飛秒雷射。此策略採用一雙週期、內外雙迴圈之螺旋鑽法：週期一使用相對較低的雷射能量強度 (Energy intensity)，先進行直徑較大之外迴圈螺旋鑽，再實施直小的內；而週期二，則提高能量強度，重複週期一之外、內雙迴圈螺旋鑽。實驗結果顯示，經過週期一之螺旋鑽後，會因為燒蝕過程複雜的光與材料相互作用，在基板內形成似沙漏形狀之孔洞，孔壁週圍材料結構與最後形狀，則由燒蝕過程複雜的光相互作用、在不同階段所成包括融化、再凝固之重鑄層與堆積殘渣。週期二螺旋鑽可有效移除這些沉積物，有效地降低圓孔錐度。最後，本研究使用硫酸與磷混合溶液，以進一步改因雷射能量在孔壁週圍引起的材質改變。藉此，本研究成功地實現徑 105 μm、錐角 0.5°、深寬比為 1.6之通孔

摘要(英)

Micro-precision machining of sapphire has always been challenging because of its hard-ness, brittleness, wear resistance, and high transmission. Ultrashort-pulsed lasers are considered to be one of the most promising tools. In this study, a new laser sapphire drilling strategy was developed to reduce the taper of micro-drilling. The carrier is a sapphire substrate with a thick-ness of 200 microns, and the laser is a femtosecond laser with a pulse duration of 300 femto-seconds and a wavelength of 1030 nanometers. This scanning strategy adopts a double-cycle auger method with inner and outer double loops: Cycle I uses a relatively low laser energy intensity, first conducts the outer loop auger with a larger diameter, and then implements a smaller diameter auger. Inner loop auger; while Cycle II increases the energy intensity, repeat-ing the outer and inner double loop auger of Cycle I. The experimental results show that after one cycle of auger drilling, an hourglass-like hole will be formed in the substrate due to the complex interactions between light and material in the ablation process. The hole’s final struc-ture and shape are determined by the overall effects of light-sapphire interactions and the com-plex processes of the ablation and the deposits from the cooling and resolidification processes. The second cycle of the auger effectively removes these deposits, effectually reducing the taper of the round hole. Finally, this study used a mixed solution of sulfuric acid and phosphoric acid to further etch away the damage and stucuturelly altered layers around the hole wall. As a result, this study successfully realized through holes with a diameter of 105 μm, a taper angle of 0.5, and with an aspect ratio of 1.6.

關鍵字(中)

★ 藍寶石
★ 濕式蝕刻
★ 雷射鑽孔加工
★ 飛秒雷射

關鍵字(英)

★ sapphire
★ wet etching
★ laser drilling
★ femtosecond laser

論文目次

中文摘要 …………………………………………………………………………………………………… vi
Abstract…………………………………………………………………………………………………… vii
誌謝 ………………………………………………………………………………………………………… viii
大綱 ………………………………………………………………………………………………………… ix
圖目錄 ……………………………………………………………………………………………………… xii
表目錄 ……………………………………………………………………………………………………… xviii
chapter1 緒論 …………………………………………………………………………………………… - 1 -
1.1 前言 …………………………………………………………………………………………………… - 1 -
1.2 研究背景、動機與目的 ……………………………………………………………………………… - 5 -
Chapter2 文獻回顧與基礎理論 ………………………………………………………………………… - 7 -
2.1 藍寶石的加工方法藍寶石的加工方法 ………………………………………………………………- 7 -
2.1.1 非傳統加工方法介紹 …………………………………………………………………………… - 7 -
2.2 飛秒雷射加工飛秒雷射加工 ………………………………………………………………………- 13 -
2.2.1 飛秒雷射特色及種類介紹 ……………………………………………………………………… - 13 -
2.2.2 飛秒雷射鑽孔透明材料原理與機制 …………………………………………………………… - 14 -
2.2.3 飛秒雷射鑽孔方法及策略 ……………………………………………………………………… - 18 -
2.2.4 雷射加工藍寶石特點分析 ……………………………………………………………………… - 19 -
2.3 藍寶石雷射加工結合濕式蝕刻製程 ……………………………………………………………… - 24 -
2.3.1 藍寶石濕式蝕刻原理與回顧 …………………………………………………………………… - 24 -
2.3.2 雷射加工結合濕式蝕刻特點 …………………………………………………………………… - 25 -
2.4 傳承與創新傳承與創新 ………………………………………………………………………… - 27 -
Chapter3 實驗方法 ………………………………………………………………………………… … - 29 -
3.1 實驗流程 ………………………………………………………………………………………………- 29 -
3.2 實驗材料製備 ……………………………………………………………………………………… - 29 -
3.2.1 藍寶石晶圓 …………………………………………………………… …………………………- 29 -
3.2.2 藍寶石預清洗 …………………………………………………………………………………… - 30 -
3.3 複合式雷射鑽孔結合濕式蝕刻 …………………………………………………………………… - 31 -
3.3.1 雷射設備相關規格介紹 ……………………………………………………………………………- 31 -
3.3.2 雷射掃描參數規劃 …………………………………………………………………………………- 32 -
3.3.3 濕式蝕刻製程 ……………………………………………………………………………………- 34 -
3.4 表面特徵和性能量測設備介紹 ………………………………………………………………………- 35 -
3.5 實驗儀器設備清單 ………………………………………………………………………………… - 39 -
Chapter4 結果與討論 ……………………………………………………………………………… - 40 -
4.1 週期一雙迴圈飛秒雷射鑽孔徑及特徵的影響分析………………………………………………… - 40 -
4.1.1 雷射焦點位置對於鑽孔影響……………………………………………………………………… - 41 -
4.1.2 雷射能量對於鑽孔影響 ……………………………………………………………………………- 45 -
4.1.3 雷射掃描次數對於鑽孔影響……………………………………………………………………… - 47 -
4.2 週期二雙迴圈飛秒雷射鑽孔徑及特徵的影響分析………………………………………………… - 48 -
4.2.1 週期二雙迴圈飛秒雷射掃描策略對於通孔的影響 ………………………………………………- 49 -
4.3 藍寶石上之濕式蝕刻效果分析藍寶石上之濕式蝕刻效果分析……………………………………- 51 -
4.3.1 蝕刻液的選擇……………………………………………………………………………………… - 52 -
4.4 雷射加工後形貌與品質探討雷射加工後形貌與品質探討…………………………………………- 56 -
4.4.1 藍寶石八字成形因素分析 …………………………………………………………………………- 57 -
4.4.2 藍寶石八字型下半部及表面分析 …………………………………………………………………- 64 -
4.4.3 藍寶石沙漏狀孔洞分析…………………………………………………………………………… - 68 -
4.4.4 雷射加工藍寶石成果分析與探討………………………………………………………………… - 80 -
4.5 濕式蝕刻後處理輔助之雷射藍寶石通孔研究……………………………………………………… - 81 -
4.5.1 改善後週期一雙迴圈飛秒雷射鑽孔 ………………………………………………………………- 81 -
4.5.2 改善後週期二雙迴圈飛秒雷射鑽孔………………………………………………………………- 84 -
4.5.3 濕式蝕刻改善雷射通孔品質 ………………………………………………………………………- 85 -
Chapter5 結論 …………………………………………………………………………………………… - 89 -
參考文獻 ……………………………………………………………………………………………………- 90 -
碩士論文口試委員問題集 ………………………………………………………………………………- 94 -

參考文獻

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[18] Z. Liang, X. Wang, Y. Wu, L. Xie, Z. Liu, and W. Zhao, "An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire," Journal of Materials Processing Technology, vol. 212, no. 4, pp. 868-876, 2012, doi: 10.1016/j.jmatprotec.2011.11.009.
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[1] H. J. Scheel, "Historical aspects of crystal growth technology," Journal of Crystal Growth January 2000, doi: 10.1016/S0022-0248(99)00780-0.
[2] L. A. L. Elena R. Dobrovinskaya , Valerian Pishchik, Sapphire Material, Manufacturing, Applications (Springer US). 2009.
[3] Y. Development. "6’’ and Below : Small Dimension Wafer Market Trends 2020." https://s3.i-micronews.com/uploads/2020/09/YDR2001.pdf (accessed.
[4] "Global High Purity Alumina Market – Industry Analysis and Forecast (2019-2026) " https://www.maximizemarketresearch.com/?s=Global+Sapphire+Substrates+Market (accessed 2019 August
[5] R. B. Pravin Pawar, Amaresh Kumar, "Machining processes of sapphire: An overview," International Journal of Modern Manufacturing Technologies, vol. Volume 9, Issue 1, Pages 47 - 72, 2017.
[6] 程陽. "下世代行動寬頻揭序幕　七大重點技術成就5G eMBB." https://www.2cm.com.tw/2cm/zh-tw/tech/AE3100A41F36440CB003988E4EE76CA3 (accessed.
[7] T. Baier, "High-throughput laser processing of sapphire and chemically strengthened glass," 2014.
[8] A. R. D. Ashkenasi, H. Varel, M. Wahmer, and E. E. B. Campbell, "Laser processing of sapphire with picosecond and subpicosecond pulses," 1997.
[9] E. Gu et al., "Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser," (in English), Thin Solid Films, vol. 453, pp. 462-466, Apr 1 2004, doi: 10.1016/j.tsf.2003.11.133.
[10] Y. Okamoto, T. Takekuni, and A. Okada, "Formation of Internal Modified Line with High Aspect Ratio in Sapphire by Sub-nanosecond Pulsed Fiber Laser," (in English), J Laser Micro Nanoen, vol. 9, no. 1, Mar 2014, doi: 10.2961/jlmn.2014.01.0011.
[11] "Femtosecond laser micromachining: A back-to-basics primer." https://www.industrial-lasers.com/cutting/article/16488567/femtosecond-laser-micromachining-a-backtobasics-primer (accessed 2012 Jun.
[12] s. choi, "The Conditional Analysis of Dispositions and the Intrinsic Dispositions Thesis," Philosophy and Phenomenological Research, 2009.
[13] A. N. Samant and N. B. Dahotre, "Laser machining of structural ceramics—A review," Journal of the European Ceramic Society, vol. 29, no. 6, pp. 969-993, 2009, doi: 10.1016/j.jeurceramsoc.2008.11.010.
[14] Z. H. S. X. Wang, J. Lu, and X. W. Ni, "Laser-induced damage threshold of silicon in millisecond, nanosecond, and picosecond regimes," Journal of Applied Physics, vol. 108, no. 3, 2010, doi: 10.1063/1.3466996.
[15] J. Z. Mahadi Hasan., Zhengyi Jiang, "A review of modern advancements in micro drilling techniques," Journal of Manufacturing Processes,, vol. 29, pp. Pages 343-375, 2017.
[16] Y. Fukuzawa, N. Mohri, T. Tani, and A. Muttamara, "Electrical discharge machining properties of noble crystals," Journal of Materials Processing Technology, vol. 149, no. 1-3, pp. 393-397, 2004, doi: 10.1016/j.jmatprotec.2003.12.028.
[17] J. Wang, P. Feng, J. Zhang, C. Zhang, and Z. Pei, "Modeling the dependency of edge chipping size on the material properties and cutting force for rotary ultrasonic drilling of brittle materials," International Journal of Machine Tools and Manufacture, vol. 101, pp. 18-27, 2016, doi: 10.1016/j.ijmachtools.2015.10.005.
[18] Z. Liang, X. Wang, Y. Wu, L. Xie, Z. Liu, and W. Zhao, "An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire," Journal of Materials Processing Technology, vol. 212, no. 4, pp. 868-876, 2012, doi: 10.1016/j.jmatprotec.2011.11.009.
[19] Y.-A. C. Bor Kai Wang, Aric Shorey, Garrett Piech, "Thin Glass Substrates Development and Integration For Through Glass Vias (TGV) With Copper (Cu) Interconnects," presented at the Packaging, Assembly and Circuits Technology Conference, 2012.
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指導教授

何正榮(Jeng-Rong Ho)

審核日期

2022-4-15

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