| 摘要(英) |
The Low Earth Orbit Terminal(LEO Terminal) is used to transmitting and receiving signals from low earth orbits satellites.Since the long distance of transmission links, Terminal mount, antenna and integrated circuit (IC) whose size will shrink due to the employed high frequency, causes Terminal increase the operating temperature, affect the performance.
This research uses natural convection to design the heat dissipation structure, draws the heat dissipation structure through 3D design software, and uses thermal simulation program Flow Simulation for analysis. The purpose is to reduce the temperature of the Terminal case and IC below 60°C and 85°C, respectively, The overall weight should be controlled within 15kg, 4 types of Terminal were analysis to obtain the best design of the Terminal heat dissipation structure, namely TypeA: IC spacing difference, TypeB: heat dissipation result of aluminum heat sink, TypeC: heat dissipation result of aluminum heat sink elongation, TypeD: copper clad aluminum heatsink.
The research results of this paper show that when the distance of the antenna and the IC is designed to be high density, there will be a problem of higher operating temperature.The heat sink structure does not exceeds the Terminal size, the maximum temperature of the IC will be controlled within 85°C. By copper clad aluminum heatsink, the temperature can be further reduced, and the heat spread is more uniform, which is conducive to heat transfer, but the weight will increase and the processing method will be more complicated. Designers can consider whether to copper clad aluminum heatsink according to temperature and weight requirements. when the heat sink structure exceeds the Terminal size, the lowest IC temperature of all types can be obtained. The research results provide designers with different design requirements as a reference to make The Terminal reaches optimum operating temperature. |
| 參考文獻 |
[1] X. Lin, S. Cioni, G. Charbit, N. Chuberre, S. Hellsten, J. F. Boutillon. “On the Path to 6G: Embracing the Next Wave of Low Earth Orbit Satellite Access”, IEEE Communications Magazine, Volume, 59, Number 12, December 2021,
pp. 36-42
[2] IMT-2030 (6G) Promotion Group, White Paper on 6G Vision and Candidate Technologies, June 2021
[3] Ntt Docomo, Inc, White Paper 5G Evolution and 6G, January 2020
[4] P. Prudhomme.” Ka-Band SATCOM Trends and Power Amplification Challenges”, A Comprehensive Guide to mmWave Solutions, May 2020
[5] A. Jasim, F. Sabah, M. R. Mohammed.” Title: Satellite communication channel”, Master’s Thesis, Linnaeus University, June 2012
[6] M. Manulis, C. P. Bridges, R. Harrison, V. Sekar and A. Davis. “Cyber security in New Space Analysis of threats, key enabling technologies and challenges”, International Journal of Information Security, Volume 20, Number 3 , May 2020, pp.287-311
[7] Starlink. ”Starlink accessories”,by https://www.starlink.com/kit
[8] Oneweb.“Oneweb announces LEO flat-panel device for terrestrial broadband service”, August 2021 ,by https://www.intelliantech.com/news/newsroom/oneweb-announces-leo-flat-panel-device-for-terrestrial-broadband-service/#
[9] W. Honcharenko. “Sub-6 GHz mMIMO Base Stations Meet 5G’s Size and Weight Challenges” Microwave Journal, Volume 62, Number 2, February 2019, pp.40-52
[10] Z. Wang ,S. Hu , L Gu, L Lin. “Review of Ka-Band Power Amplifier” Electronics, Volume 11, Number 6:942, March 2022
[11] 邱韋壬：〈先進60GHz前端相位陣列發射模組之散熱效能評估與設計〉，碩士論文，國立清華大學，民國101年7月。
[12] Lotus Arise. ” Satellite Frequency Bands: L, S, C, X, Ku, Ka-band – UPSC”, December 2020, by https://lotusarise.com/satellite-frequency-bands-upsc/
[13] F. Moukalled, L. Mangani, M. Darwish. “The Finite Volume Method in Computational Fluid Dynamics”, Cham:Springer International Publishing ,2016
[14] B. Andersson, R. Andersson, L. Hakansson, M. Mortensen, R. Sudiyo, B. V. Wachem. “Computational Fluid Dynamics for Engineers”, Cambridge:Cambridge University Press, 2012
[15] I. B. Ramlan, N. B. Darlis, “Comparison between Solidworks and Ansys Flow Simulation on Aerodynamic Studies” Journal of Industry, Engineering and Innovation, Volume 2, Number 1, July 2019, pp.1-9
[16] W. M. Rohsenow, J. R. Hartnett, Y. I. Cho, “Handbook Of Heat Transfer”, Third Edition, New York:McGraw-Hill, 1998
[17] B. S. Seo, K. J. Lee, J. K. Yang, Y. S. Cho, D. H. Park. “Development and Characterization of Optimum Heat Sink for 30 W Chip on Board LED Down Light” The Korean Institute of Electrical and Electronic Material Engineers, Volume 13, Number 6, December 2012, pp.292-296
[18] T. Qing, L. Xiu, W. Qingsong. “Diffusion Bonding of Al 6061 and Cu by Hot Isostatic Pressing” Journal of Wuhan University of Technology Mater. Sci. Ed., Volume 35, April 2020, pp.183-191
[19] Anokiwave, Inc. “Whitepaper:Flat Panel Phased Array Antennas: Enabling Scalable & Affordable SATCOM Solutions”, 2020
[20] Solidworks Flow Simulation Engineering Database
[21] Y. Aslan, C. E. Kiper, A. J. Biggelaar, U. Johannsen, A. Yarovoy. “Passive Cooling of mm-Wave Active Integrated 5G Base Station Antennas Using CPU Heatsinks” 2019 16th European Radar Conference (EuRAD), October 2019, pp.121-124.
[22] B. Li, S. Jeon, C. Byon. “Investigation of Natural Convection Heat Transfer Around a Radial Heat Sink With a Perforated Ring” International Journal of Heat and Mass Transfer, Volume 97, 2016, pp.705-711
[23] X. Meng, J. Zhu, X. Wei, Y. Yan. “Natural Convection Heat Transfer of a Straight-fin Heat Sink” International Journal of Heat and Mass Transfer, Volume 123, 2018, pp.561-568 |
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