| 摘要(英) |
This paper is divided into four Chapter. Chapter 1 introduces the background and motivation of studying millimeter-wave packaging, followed by the types and applications of packaging, and finally the methods and objectives of studying millimeter-wave packaging.
In Chapter 2, we refer to many related papers, most of them use the π-model to build the equivalent circuit model of the flip-chip interconnection, and the component values in the circuit are calculated by curve fitting for the physical dimensions. This common method still has the limitation that when the structural parameters are different, the function is not selected properly, and then the component value is not physically meaningful. We re-analyze how to build the T-model of flip-chip interconnection in the millimeter-wave and how to extract the physically meaningful component values effectively, and then compare the differences of the scattering parameters with the full-wave simulation and practical measurements.
In Chapter 3, A simple calibration method is proposed and demonstrated by using MATLAB code. The formulae in the references are used, and then the calculation is simplified based on circuit characteristics. In the calibration method, signal flow is represented as a transmission matrix by using the principle of calculation flow. In a back-to-back series structure, the left half-circuit (or the right half-circuit) has a feeding structure on the left and right ends, and we can use the code proposing in MATLAB to calculate the contribution of the feeding structure to the circuit by de-embedding the feeding structure on both ends, and then derive the response of the solder bump and the conductor connected to it.
In Chapter 4, it outlines the fabrication of the flip-chip interconnection structure, and the fabricated version is divided into 10 GHz version and 40 GHz version according to the upper limit of the measured frequency. Firstly, the reasoning for making the two versions of the circuit was explained, and then we present the analysis and design of the structure parameters for the two implementations, and use the calibration method in Chapter 3 to calibrate the 40 GHz version, while the 10 GHz version is not calibrated due to its practical implementation. Finally, the scattering parameters of the theoretical calculation (ADS), the full-wave simulation (HFSS), and the practical measurements are verified by overlaying them with each other.
In Chapter 5, concludes the previous four chapters and describes the difficulties encountered during the implementation of the 10 GHz version and considers how to improve it in the future, while the 40 GHz version has a small discrepancy between the measurement results and the full-wave simulation, and this chapter summarizes the problems and considers possible solutions for future work. |
| 參考文獻 |
參考文獻
[1] Sturdivant. Rick, Microwave and millimeter-wave electronic packaging, Artech, House Microwave Lirary, USA, 2013.
[2] Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, Advanced Flip Chip Packaging, SpringerLink, New York, 2013.
[3] 產業價值鏈資訊平台。2015年3月20日，取自 https://ic.tpex.org.tw/introduce.php?ic=D000
[4] 揚博科技。2016年1月18日，取自 http://www.ampoc.com.tw/Application/Application_More?id=11
[5] Kaixuan Song, Jinchun Gao, George T. Flowers, Ziren Wang, Qingya Li, and Wei Yi, “Impact of the Ball Grid Array Connection Failures on Signal Integrity,” IEEE Holm Conference on Electrical Contacts, Conference paper, pp. 79-84, 2020.
[6] Yanbo Xu, Xiaoli Yang, Yan Li, Panpan Zuo, Hongxing Zheng, Erping Li, “Investigation of electrical discontinuity in flip-chip package,” IEEE Electrical Design of Advanced Packaging and Systems Symposium, Conference paper, pp. 79-81, 2017.
[7] D. Staiculescu, A. Sutono, J. Laskar, “Wideband Scalable Electrical Model for Microwave/Millimeter Wave Flip Chip Interconnects,” IEEE Transactions on Advanced Packaging, Vol 24, No. 3, pp. 254-259, 2001.
[8] R.J. Pratap, D. Staiculescu, S. Pinel, J. Laskar, G.S. May, “Modeling and Sensitivity Analysis of Circuit Parameters for Flip-Chip Interconnects Using Neural Networks,” IEEE Transactions on Advanced Packaging, Vol 28, No. 1, pp. 71-78, 2005.
[9] H.H.M. Ghouz, E.-B. El-Sharawy, “An accurate equivalent circuit model of flip chip interconnects,” IEEE MTT-S International Microwave Symposium Digest, Vol 3, pp. 1827-1830, 1996.
[10] M. Szymanowski, S. Safavi-Naeini, “Characterization of a flip-chip interconnect at frequencies up to 30 GHz,” Canadian Conference on Electrical and Computer Engineering. Conference Proceedings. Navigating to a New Era, Vol 2, pp. 784-787, 2000.
[11] E.B. Liao, A.A.O. Tay, S.S. Ang, H.H. Feng, R. Nagarajan, V. Kripesh, “Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging,” IEEE Transactions on Advanced Packaging, Vol 29, No. 2, pp. 343-353, 2006.
[12] D. Staiculescu, A. Pham, J. Laskar, S. Consolazio, S. Moghe, “Analysis and Performance of BGA Interconnects for RF Packaging,” IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers, Conference paper, pp. 131-134, 1998.
[13] Arlinghaus, Sandra, Paractical Handbook of Curve Fitting, CRC Press, USA, 2020.
[14] Hongwei Liang, J. Laskar, M. Hyslop, “A broad band Through-Line-Line de-embedding technique for BGA package measurements,” IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Conference paper, pp. 125-128, 2001.
[15] David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc., USA, 2011. |
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