P型鎂銀銻材料及鎂矽錫/鎂銀銻熱電元件製作

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姓名

楊子廣(Tzu-Kuang Yang) 查詢紙本館藏

畢業系所

電機工程學系

論文名稱

P型鎂銀銻材料及鎂矽錫/鎂銀銻熱電元件製作
(Process Innovation of P-type MgAgSb Thermoelectric Materials and Mg2(SiSn) / MgAgSb Thermoelectric Devices)

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摘要(中)

近年由於溫室氣體造成得地球暖化越來越嚴重，各國專家對於新替代能源及能源回收的研究日益增加，熱電發電是近幾年熱門的研究領域，利用溫差來發電，只要能夠收集廢熱並產生溫度上的落差便能產生電能。近年研究發現MgAgSb作為一種高效能、無毒且豐富的低溫區熱電材料有淺力取代有毒性且較稀有的Bi2Te3化合物，因此MgAgSb成為科學家熱門研究主題。
本實驗對P型MgAgSb熱電材料摻雜不同比例的Mg2Sn，實驗得出摻雜0.2 at%及0.25 at%的試片有最佳的熱電特性，再比較兩者的平均ZT後發現摻雜0.2 at%的試片有較高的平均ZT值。嘗試四種方式製作接觸金屬試片，分別為導電金屬漿料、金屬粉末壓成薄片、金屬薄片及沉積金屬，嘗試不同金屬在試片上下兩側製作一層金屬後高溫燒結，觀察試片與接觸金屬的接合效果，發現P型MgAgSb試片使用Ni粉末壓成薄片作為接觸金屬有較佳的接合及最大的Seebeck值落在110 μV/K至125 μV/K。相比於單純MgAgSb試片的Seebeck值（105 μV/K至135 μV/K），並沒有太大的差異，並不會因為多了接觸金屬後而造成原Seebeck的降低。
單對N-P熱電元件的實驗分別製作了三種不同製程方式的元件，使用耐高溫凸緣密封膠作為試片及玻璃片空隙的接合物後，於試片串聯處塗上太陽能導電Ag漿高溫燒結後電鍍Ni金屬層的製作方式有較大的輸出電壓及輸出功率元件，最大輸出電壓約7.9mV而最大輸出功率約為1 μW。

摘要(英)

Global warming has become more and more serious in recent years, and experts are devoting in searching alternative energy. Thermoelectric materials are promising candidates. Recently, studies have found that MgAgSb, as a high-efficiency, non-toxic thermoelectric material in the low temperature region, could have the potential to replace the toxic and rare Bi2Te3 compounds.
In this study, the P-type MgAgSb thermoelectric material was doped with different ratio of Mg2Sn. The experiments proved that MgAgSb doped with 0.2 at% and 0.25 at% shows better thermoelectric properties and the one doping with 0.2 at% Mg2Sn is the best. Different contact metals were tested, and the result shows that Ni is suitable with the best Seebeck value between 110 μV/K and 125 μV/K.
For thermoelectric devices, Ag paste coating and electroplated Ni are used, and it presents large output voltage and power (approximately 7.9mV and the 1 μW, respectively).

關鍵字(中)

★ 熱電材料
★ 熱電元件
★ 鎂銀銻

關鍵字(英)

論文目次

摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 xiii
1 第一章緒論 1
1-1 前言 1
1-2 研究目的及動機 3
2 第二章基礎理論與文獻回顧 12
2-1 熱電效應 12
2-1-1 Seebeck效應 12
2-1-2 Peltier效應 14
2-1-3 Thomson效應 15
2-2 熱電優值係數(Thermoelectric figure of merit) 16
2-2-1 熱電優值與轉換效率之關係 18
2-2-2 電子熱導對熱導係數的影響 20
2-2-3 聲子熱導對熱導係數的影響 21
2-3 熱電材料介紹 22
2-4 熱電材料之應用 26
2-5 MgAgSb熱電材料 27
2-6 熱電模組之研究 29
2-6-1 熱電材料接合 30
2-6-2 熱電元件電極接合研究 33
2-6-3 擴散阻擋層 35
3 第三章實驗量測儀器 36
3-1 電阻率量測 36
3-2 Seebeck係數量測 40
3-3 熱電塊材熱傳導率之量測 42
3-3-1 比熱量測 43
3-3-2 熱擴散係數量測 45
3-3-3 密度量測 46
3-4 掃描電子顯微鏡（SEM） 47
3-5 X射線粉末繞射儀（XRD） 48
3-6 單一試片及元件輸出量測 49
4 第四章實驗方法與步驟 51
4-1 實驗製成流程 51
4-2 實驗樣品製備 52
4-2-1 Sb粉末製備 52
4-2-2 Mg_3 Sb_2 及Ag_3 Sb粉末製備 56
4-2-3 Mg_3 Sb_2 及Ag_3 Sb冷壓塊材 57
4-2-4 高溫燒結Mg_3 Sb_2 58
4-2-5 高溫燒結Ag_3 Sb 59
4-2-6 球磨Mg_3 Sb_2 及Ag_3 Sb粉末 60
4-2-7 高溫燒結MgAgSb試片 62
4-3 實驗製程開發流程 64
4-3-1 改變摻雜之成分 64
4-3-2 改變摻雜之比例 65
4-4 接觸金屬試片製作 66
4-5 熱電元件製作 70
5 第五章實驗結果與討論 74
5-1 改變摻雜成分實驗結果 74
5-2 改變摻雜成分實驗結果 83
5-3 接觸金屬試片實驗結果 86
5-4 熱電元件實驗結果討論 93
第六章結論與未來展望 97
參考文獻 98

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指導教授

辛正倫

審核日期

2022-7-28

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