| 摘要(英) |
In order to respond to the short product lifecycle, especially in the consumer product industry, the most notable example being smartphones, each brand emphasizes convenience, lightweight design, powerful built-in features, and fast processing speed. As a result, the components inside the hardware, such as circuit boards and electronic parts, are moving towards greater precision, and traditional circuit board production methods are no longer sufficient. The SEMI International Semiconductor Industry Association has proposed the SEMI ELS SMT equipment connectivity specification as the goal of this research. Based on the underlying communication protocol established by SEMI ELS SMT A1/A1.1, the parameter content format proposed by SEMI ELS SMT A2 is used. The system architecture is modeled using the MIAT methodology′s IDEF0 approach, and discrete event modeling is performed using the graphical representation of Grafcet. This model is then used for software high-level synthesis and integrated verification with the underlying communication protocol. |
| 參考文獻 |
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至系統瀏覽論文 (2028-7-31以後開放)
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