超快雷射薄石英晶圓微鑽孔研究

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李韋廷(Wei-Ting Lee) 查詢紙本館藏

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機械工程學系

論文名稱

超快雷射薄石英晶圓微鑽孔研究
(Research on Micro-drilling of Thin Quartz Wafer Using Ultrashort Pulsed Laser)

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摘要(中)

石英晶體擁有比陶瓷、鎳鉻合金更優異的化學穩定性，因此被廣泛投入在半導體、光機電等科技行業的儀器和設備上，自 1880 年居里兄弟(Curie)發現壓電效應後，眾多自然界或人工合成的壓電材料逐漸被挖掘出來，20 世紀中期以α-quartz單晶石英為載體的振盪器開始大量使用於電子網絡系統，作為時脈訊號產生的核心，AT-cut 切向的單晶石英具有良好的頻率穩定性，是該類被動、主動元件運用的大宗。到了21世紀，從 4G、5G 資訊網絡，到工業機電系統，太空衛星也包含在通訊循環的體系中，每年需製造 200 億顆以上的電子元件供應需求，並對數位訊號的穩定性有更上一層的要求。除此之外，為符合商業需求，過去幾十年裡，半導體相關行業都在追求更精細的尺寸、更低的成本和更快的速度，開發新興技術或持續精進原有成熟製程勢在必行，如何快速薄石英晶圓上鑽出微米級的孔洞，用以佈線、蒸鍍金屬電極連接內部振盪晶圓和增加晶體運行得穩定性，為一項極具前景的研究。石英晶體的硬脆和高穿透特性讓其在精密加工領域具備一定的挑戰性，超快雷射因其具備低熱影響、高加工速度和低材料耗損率，被視為極有前景的加工方式之一，本研究使用波長 1030 nm 及 515 nm 之振鏡飛秒雷射系統，探討雷射光束特性及掃描策略對於厚度 80 μm 石英晶圓鑽孔的影響，並配合氫氧化鉀(KOH，35 wt.%)蝕刻後處理，實驗結果證實相較於 1030 nm的P偏振紅外雷射，515 nm 之 S 偏振綠光雷射能夠精準將圓孔內部的材料去除或改質，並成功於 3.6 s 和 2.5 s 內完成直徑70和50 μm 的微孔加工，TEM 檢測的結果亦表明 KOH 蝕刻的成效十分優異，孔洞內無多晶、非晶區的存在，實現錐度最佳可小於 1˚之高品質通孔，參數優化後可期媲美旋切、貝索光束等先進製程，降低生產成本。

摘要(英)

Quartz crystals possess superior chemical stability compared to ceramics and nickel-chromium alloys, making them widely used in instruments and equipment in industries such as semiconductors and optomechanics. Since the discovery of the piezoelectric effect by the Curie brothers in 1880, numerous naturally occurring or artificially synthesized piezoelectric materials have been gradually unearthed. In the mid-20th century, oscillators using α-quartz single-crystal quartz as a carrier began to be extensively used in electronic network systems as the core for generating clock signals. AT-cut quartz crystals exhibit excellent frequency
stability and are widely utilized in passive and active components.
In the 21st century, from 4G and 5G information networks to industrial electromechanical systems and even space satellites, all encompassed in the communication
infrastructure, the demand for manufacturing over 20 billion electronic components annually has grown. Therefore, there is a higher requirement for the stability of digital signals. In addition, to meet commercial needs, the semiconductor industry and related sectors have been pursuing more precise dimensions, lower costs, and faster speeds over the past few decades, which necessitates the development of new technologies or the continuous
improvement of existing mature processes. The rapid drilling of micrometer-sized holes on thin quartz wafers for wiring, metal electrode deposition, internal oscillator wafer
connections, and improved crystal stability is a highly promising research area.
The hardness and brittleness of quartz crystals, as well as their high penetration
characteristics, have posed significant challenges in the field of precision machining.
Ultrashort pulsed lasers, due to their low thermal impact, high processing speed, and low
material consumption rate, are considered one of the promising methods for machining
quartz. In this study, a femtosecond laser galvanometer system with wavelengths of 1030 nm and 515 nm was used to investigate the influence of laser beam properties and scanning strategies on drilling holes in 80 μm thick quartz wafers. The experiment was combined with post-processing using a 35 wt.% potassium hydroxide (KOH) etching solution to remove the residual recast layer after laser processing.
The experimental results confirmed that the 515 nm S-polarized green laser, compared to the 1030 nm P-polarized infrared laser, can precisely remove or modify the material inside the holes. Micro-drilling with diameters of 70 μm and 50 μm was successfully completed within 3.6 s and 2.5 s, respectively. Transmission electron microscopy (TEM) analysis also indicated excellent performance of KOH etching, as no polycrystalline or amorphous regions were observed inside the holes. This achieved high-quality through-holes with a taper angle of less than 1°, and with parameter optimization, the process can be expected to be
comparable to advanced techniques such as trepanning optics system and Bessel beam, thereby reducing production costs.

關鍵字(中)

★ 石英
★ 飛秒雷射
★ 雷射輔助濕式蝕刻微鑽孔
★ 偏極化效應
★ 孵化效應

關鍵字(英)

★ Quartz
★ Femtosecond laser
★ Laser assisted wet etching micro-hole drilling
★ Polarization effect
★ Incubation effect

論文目次

大綱
中文摘要........................................................................................................................i
Abstract ........................................................................................................................ii
大綱..............................................................................................................................iv
圖目錄.........................................................................................................................vii
表目錄......................................................................................................................... xv
Chapter 1 緒論...................................................................................................... - 1 -
1.1 前言 ................................................................................................................ - 1 -
1.1.1 石英長晶簡介......................................................................................... - 1 -
1.1.2 合成石英(α-quartz)基礎性質介紹......................................................... - 3 -
1.1.3 石英晶體切割種類與應用-(AT-cut) ..................................................... - 5 -
1.2 研究背景、目的與方法 ................................................................................ - 7 -
1.2.1 石英壓電元件應用簡介......................................................................... - 7 -
1.2.2 晶體振盪器發展概況............................................................................. - 8 -
1.2.3 薄石英晶圓雷射微鑽孔技術............................................................... - 10 -
Chapter 2 文獻回顧............................................................................................ - 13 -
2.1 石英加工方法介紹 ...................................................................................... - 13 -
2.1.1 硬脆透明材料機械加工方式介紹....................................................... - 13 -
2.1.2 硬脆透明材料非接觸式加工介紹....................................................... - 19 -
2.1.3 乾式、濕式蝕刻鑽孔技術介紹........................................................... - 24 -
2.1.4 雷射加工(Laser Machining)與各類加工技術比較............................. - 28 -
2.2 飛秒雷射加工技術 ...................................................................................... - 34 -
2.2.1 雷射種類與飛秒雷射介紹................................................................... - 34 -
2.2.2 飛秒雷射材料加工機制....................................................................... - 37 -
2.2.3 飛秒雷射鑽孔方式及策略回顧........................................................... - 41 -
2.3 飛秒雷射鑽孔影響因素 .............................................................................. - 52 -
2.3.1 α-quartz 光學與物理特性 ..................................................................... - 52 -
2.3.2 飛秒脈衝雷射加工現象....................................................................... - 56 -
2.4 傳承與創新 .................................................................................................. - 60 -
Chapter 3 實驗方法............................................................................................ - 61 -
3.1 實驗流程 ...................................................................................................... - 61 -
3.2 實驗材料與製備 .......................................................................................... - 61 -
3.2.1 實驗材料............................................................................................... - 61 -
3.2.2 石英晶圓清洗程序............................................................................... - 62 -
3.3 雷射結合溼式蝕刻複合式石英鑽孔 .......................................................... - 65 -
3.3.1 飛秒雷射規格及系統........................................................................... - 65 -
3.3.2 雷射光束配置細節............................................................................... - 66 -
3.3.3 第一道製程‐雷射加工......................................................................... - 70 -
3.3.4 第二道製程‐KOH 溼式蝕刻............................................................... - 72 -
3.4 實驗量測、分析設備介紹 .......................................................................... - 74 -
3.5 實驗材料與設備儀器清單 .......................................................................... - 76 -
Chapter 4 實驗結果與討論................................................................................ - 77 -
4.1 雷射參數選定 .............................................................................................. - 78 -
4.1.1 振鏡系統與物鏡系統單發脈衝加工閾值能量................................... - 79 -
4.1.2 偏振特性與光源對石英的加工影響................................................... - 85 -
4.1.3 孵化效應(Incubation effect)對閾值的影響......................................... - 89 -
4.1.4 雷射加工參數選擇............................................................................... - 95 -
4.2 IR-P 偏振雷射光初步鑽孔測試 ................................................................. - 97 -
4.2.1 鑽孔焦點位置測試............................................................................... - 97 -
4.2.2 正負離焦鑽孔加工測試..................................................................... - 101 -
4.2.3 重複率與能量對於 BU 鑽孔的影響 ................................................. - 105 -
4.3 StrategyⅠ兩階段鑽孔結果與討論.......................................................... - 109 -
4.3.1 第一階段(Stage 1): 通孔進程........................................................... - 109 -
4.3.2 第二階段(Stage 2): 孔徑修飾........................................................... - 111 -
4.3.3 StrategyⅠ之鑽孔問題與緣由討論..................................................... - 113 -
4.3.4 StrategyⅠ優化層面分析..................................................................... - 117 -
4.4 StrategyⅡ兩階段式鑽孔結果與討論...................................................... - 121 -
4.4.1 掃描策略更改機制介紹..................................................................... - 121 -
4.4.2 雙孔徑初步 StrategyⅡ鑽孔特徵討論............................................... - 122 -
4.4.3 StrategyⅡ鑽孔參數優化與特徵分析................................................. - 126 -
4.4.4 蝕刻後圓孔形貌與熱影響區檢測..................................................... - 130 -
4.5 飛秒雷射薄石英晶圓鑽孔技術總結 ........................................................ - 136 -
4.5.1 振鏡掃描策略與結果總攬................................................................. - 136 -
4.5.2 各式雷射透明硬脆材料鑽孔文獻比較............................................. - 140 -
Chapter 5 結論.................................................................................................. - 143 -
參考文獻…………………………………………………………………………- 144 -
碩士論文口試教授問題集………………………………………………………- 144 -

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指導教授

何正榮(Jeng-Rong Ho)

審核日期

2023-7-13

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