| 摘要(英) |
FR-4, or glass fiber-reinforced electronic-grade epoxy resin, is a crucial material for printed circuit boards (PCBs) due to its excellent electrical insulation, high mechanical strength, elevated heat resistance, chemical stability, and cost-effectiveness. In the context of FR-4 substrate cutting, commonly employed techniques include V-cutting, high-pressure water jet cutting, and diamond wheel cutting. Generally, diamond wheel cutting has been the primary method for FR-4 substrate separation, offering fast cutting and good surface quality. However, with the market demand for smaller, lighter, and more high-functional components, the need for multi-layer and higher density circuit fabrication has become increasingly vital. As line widths and spacings shrink to tens of micrometers or smaller, traditional mechanical diamond wheel cutting methods are showing limitations.
Laser cutting, with advantages such as precision, small kerf, suitability for complex shapes, and no mechanical contact to prevent cutting force-induced damage, is considered a promising technology. However, the mixture of glass fiber and epoxy resin presents challenges for laser cutting. Glass fiber can generate debris, burrs, and cracks during processing, affecting the substrate′s micro-precision and reliability. Additionally, epoxy resin is prone to forming a carbonized layer due to the high thermal effects of laser cutting, influencing the substrate′s resistance and dielectric constant, thereby impacting electrical and signal transmission performance. Post-processing is necessary to remove residual carbonization.
To address issues like debris, burrs, and high thermal effects associated with conventional laser cutting, this study employs ultrafast laser cutting on FR-4 substrates. The aim is to enhance cutting quality by utilizing high instantaneous power and low thermal effects during ultra-short pulse durations. Using a femtosecond laser, the study compares the cutting quality and speed of 0.2 mm and 0.8 mm thick FR-4 substrates cut in both atmospheric and underwater conditions. Results indicate that cutting underwater yields fewer residual debris and lower thermal effects compared to cutting in the atmosphere. Under the parameter set: power 14.99 W, frequency 500 kHz, scan speed 500 mm/s, water level height 2118 μm, and 1250 scans, high-quality cross-sections comparable to mechanical cutting can be achieved. The study also discusses patterned cutting and processing parameters. |
| 參考文獻 |
六、 參考文獻
[1] A. Solati, M. Hamedi, and M. Safarabadi, "Comprehensive investigation of surface quality and mechanical properties in CO 2 laser drilling of GFRP composites," The International Journal of Advanced Manufacturing Technology, vol. 102, pp. 791-808, 2019.
[2] "先進封裝技術再進化：超高密度銅─銅 Hybrid Bonding 為何值得期待？." https://technews.tw/2022/07/29/ma-tek-package-design-hybrid-bonding/ (accessed 7/29, 2022).
[3] "Technika cięcia laserowego w procesie separacji płytek drukowanych." https://elektronikab2b.pl/technika/52524-technika-ciecia-laserowego-w-procesie-separacji-plytek-drukowanych (accessed 7/13, 2020).
[4] P. Ciszewski and M. Sochacki, "Processing of printed circuit boards using a 532 nm green laser," Opto-Electronics Review, vol. 28, 2020.
[5] X. Wang, Z. Li, T. Chen, B. Lok, and D. Low, "355 nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates," Optics and Lasers in Engineering, vol. 46, no. 5, pp. 404-409, 2008.
[6] Y. Rong et al., "Precision cutting of epoxy resin board (ERB) by ultraviolet (UV) nanosecond laser ablation with consideration of hazardous gas protection," Optik, vol. 241, p. 167154, 2021.
[7] T. T. P. Nguyen, R. Tanabe, and Y. Ito, "Effects of an absorptive coating on the dynamics of underwater laser-induced shock process," Applied Physics A, vol. 116, pp. 1109-1117, 2014.
[8] J. Lu et al., "Mechanisms of laser drilling of metal plates underwater," Journal of applied physics, vol. 95, no. 8, pp. 3890-3894, 2004.
[9] A. Kruusing, "Underwater and water-assisted laser processing: Part 2—Etching, cutting and rarely used methods," Optics and Lasers in Engineering, vol. 41, no. 2, pp. 329-352, 2004.
[10] N. Ren, K. Xia, H. Yang, F. Gao, and S. Song, "Water-assisted femtosecond laser drilling of alumina ceramics," Ceramics International, vol. 47, no. 8, pp. 11465-11473, 2021.
[11] S. Butkus et al., "Rapid microfabrication of transparent materials using filamented femtosecond laser pulses," Applied Physics A, vol. 114, pp. 81-90, 2014.
[12] D. Sun, F. Han, and W. Ying, "The experimental investigation of water jet–guided laser cutting of CFRP," The International Journal of Advanced Manufacturing Technology, vol. 102, pp. 719-729, 2019.
[13] G. Schnell, U. Duenow, and H. Seitz, "Effect of laser pulse overlap and scanning line overlap on femtosecond laser-structured Ti6Al4V surfaces," Materials, vol. 13, no. 4, p. 969, 2020.
[14] A. B. Khoshaim, A. H. Elsheikh, E. B. Moustafa, M. Basha, and E. A. Showaib, "Experimental investigation on laser cutting of PMMA sheets: Effects of process factors on kerf characteristics," journal of materials research and technology, vol. 11, pp. 235-246, 2021.
[15] S. Butkus, E. Gaižauskas, L. Mačernytė, V. Jukna, D. Paipulas, and V. Sirutkaitis, "Femtosecond beam transformation effects in water, enabling increased throughput micromachining in transparent materials," Applied Sciences, vol. 9, no. 12, p. 2405, 2019. |
[Endnote RIS 格式]
[相關文章]
[文章引用]
[完整記錄]
[館藏目錄]
至系統瀏覽論文 (2027-1-25以後開放)
plurk
funp
live
udn
HD
myshare
netvibes
friend
youpush
delicious
baidu
Google bookmarks
del.icio.us
hemidemi
facebook
twitter
google
reddit