博碩士論文 110552008 詳細資訊




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姓名 楊秉儒(Bing-Ru Yang)  查詢紙本館藏   畢業系所 資訊工程學系在職專班
論文名稱 SMT-ELS機聯網通用數據水平通訊軟體實現
(Implementation of General Data Horizontal Communication for SMT-ELS)
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檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 (2028-7-12以後開放)
摘要(中) 近年來的消費性電子產品種類繁複,SMT 製造廠需要雇用大量人力以因應流水生產線設備繁雜的設定更動,而傳統流水生產線以人力頻繁調整設備的方式,將導致人力成本攀升、設備管理效率低落。本研究提出一個基於SEMI SMT-ELS的通用數據水平通訊軟體,使得以Flow Connection形式連接的所有設備擁有自動化M2M的能力,並實現連線狀態控管、MD參考模式設定、生產路徑規範設定的API控制。本實驗以四台虛擬機模擬流水生產線設備,並以三種應用實例驗證,可得證此軟體能達到Flow Connection M2M全自動化的應用,大幅降低了流水生產線之人力需求,且透過設備間互相協調,其通訊效率亦大幅改善。本研究將能提供流水生產線的設備鏈擁有自主協調的能力,使得智慧製造更加全面,亦能降低企業人力成本,以及提升生產效率,且包裝好的API亦使得後續工程人員能快速部署至工廠現有環境。
摘要(英) With the variety of consumer electronics products in recent years, SMT manufacturing factory need to employ a large number of staff to cope with the complicated setting changes of assembly line equipment, while traditional assembly line frequently adjusts equipment by staff, which will lead to rising labor costs and low equipment management efficiency. This study proposes a General Data Horizontal Communication software based on SEMI SMT-ELS, which enables all devices connected in the form of Flow Connection to have the ability to automate M2M, and implement APIs for connection status control, MD reference mode setting, and production route specification setting control. In this experiment, four virtual machines are used to simulate assembly line equipment, and three application examples are used to verify that this software can achieve the fully automated application of Flow Connection M2M, greatly reducing the manpower requirements of the assembly line, and through the coordination between equipment, Its communication efficiency has also been greatly improved. The research will provide that the equipment chain of the assembly line has the ability to coordinate independently, making smart manufacturing more comprehensive, reducing labor costs for enterprises, and improving production efficiency. The packaged API also enables subsequent engineers to quickly deploy to the existing environment of the factory.
關鍵字(中) ★ 機聯網
★ 水平通訊
關鍵字(英) ★ SEMI SMT-ELS
★ M2M
★ Horizontal Communication
★ Socket
★ General Data
論文目次 摘要 I
Abstract II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 X
第一章、緒論 1
1.1 研究背景 1
1.2 研究目的 3
1.3 論文架構 4
第二章、文獻回顧 5
2.1 Machine to Machine 5
2.2 Socket API 5
2.3 SEMI SMT-ELS A1/A1.1 通用數據水平通訊 7
2.4 SEMI SMT-ELS A2 通用數據水平通訊 17
2.5 MIAT 方法論 22
第三章、通用數據水平通訊模組系統設計 33
3.1 通用數據水平通訊之連線架構 33
3.2 通用數據水平通訊模組階層式系統設計 36
3.2.1 SEMI SMT-ELS A2 模組 36
3.2.2 SEMI SMT-ELS A1/A1.1 模組 38
3.2.3 Line CB Array 模組 38
3.2.4 Line CB 模組 39
3.2.5 Data Handshake 模組 40
3.2.6 Up Tier System Line 模組 40
3.3 通用數據水平通訊模組離散事件建模 41
3.3.1 SEMI SMT-ELS A2 模組離散事件建模 42
3.3.2 SEMI SMT-ELS A1/A1.1 模組離散事件建模 44
3.3.3 Line CB Array 模組離散事件建模 45
3.3.4 Line CB 模組離散事件建模 46
3.3.5 Data Handshake 模組離散事件建模 47
3.3.6 Up Tier System Line 模組離散事件建模 55
第四章、通用數據之水平通訊模組實驗 60
4.1 實驗環境 60
4.1.1 軟硬體實驗環境 60
4.1.2 水平通訊Flow Connection 架設 61
4.2 HC Connection Management 實驗 63
4.2.1 CheckHC、CheckHCResp Management 實驗 63
4.2.2 CheckAllHC Management 實驗 64
4.2.3 CheckAllHCErr Management 實驗 65
4.3 MD Reference Mode Management 實驗 67
4.3.1 SetMDReferMode 實驗 67
4.3.2 SetMDReferModeErr 實驗 68
4.4 Route Specification Management 實驗 70
4.4.1 SetRouteSpec 實驗 70
4.4.2 SetRouteSpecErr 實驗 71
第五章、結論與未來展望 73
5.1 結論 73
5.1 未來展望 74
參考文獻 75
參考文獻 [1] Y. Shen, H. Wang, F. Blaabjerg, H. Zhao, and T. Long, “Thermal Modeling and Design Optimization of PCB Vias and Pads,” IEEE Transactions on Power Electronics, vol. 35, no. 1, pp. 882–900, 2019.
[2] C. Li, Q. Chang, G. Xiao, and J. Arinez, “Integrated Process-System Modeling and Performance Analysis for Serial Production Lines,” IEEE Robotics and Automation Letters, vol. 7, no. 3, pp. 7431–7438, 2022.
[3] C. L. S. C. Fonseka, and J. A. K. S. Jayasinghe, “Implementation of an Automatic Optical Inspection System for Solder Quality Classification of THT Solder Joints,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 2, pp. 353–366, 2018.
[4] K. Pan, J. H. Ha, V. L. Pham, H. Wang, J. Xu, and S.B. Park, “The effect of solder paste volume on solder joint shape and self-alignment of passive components,” 2020 IEEE 70th Electronic Components and Technology Conference, pp. 1289–1297, 2020.
[5] C. Xu, X. Yang, Z. He, J. Qiu, and H. Gao, “Precise Positioning of Circular Mark Points and Transistor Components in Surface Mounting Technology Applications,” IEEE Transactions on Industrial Informatics, vol. 17, no. 4, pp. 2534–2544, 2021.
[6] J. M. Park, Y. H. Yoo, U. H. Kim, D. Lee, and J. H. Kim, “D3PointNet: Dual-Level Defect Detection PointNet for Solder Paste Printer in Surface Mount Technology,” IEEE Access, vol. 8, pp. 140310–140322, 2020.
[7] W. Liu, Y. Zhang, and X. Yu, “A Novel Subpixel Industrial Chip Detection Method Based on the Dual-Edge Model for Surface Mount Equipment,” IEEE Transactions on Industrial Informatics, vol. 19, no. 1, pp. 232–242, 2023.
[8] Y. Lai, K. Pan, C. Cai, P. Yin, J. Yang, and S. Park, “Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 3, pp. 562–569, 2022.
[9] J. M. Runji, and C. -Y. Lin, “Automatic Optical Inspection aided Augmented Reality-based PCBA Inspection: A Development,” IEEE Jordan International Joint Conference on Electrical Engineering and Information Technology, pp. 667–671, 2019.
[10] M. El Tanab, and W. Hamouda, “Machine-to-Machine Communications With Massive Access: Congestion Control,” IEEE Internet of Things Journal, vol. 6, no. 2, pp. 3545–3557, 2019.
[11] P. Franco, J. M. Martínez, Y. C. Kim, and M. A. Ahmed, “IoT Based Approach for Load Monitoring and Activity Recognition in Smart Homes,” IEEE Access, vol. 9, pp. 45325–45339, 2021.
[12] C. Chen, L. Lyu, S. Zhu, and X. Guan, “On-Demand Transmission for Edge-Assisted Remote Control in Industrial Network Systems,” IEEE Transactions on Industrial Informatics, vol. 16, no. 7, pp. 4842–4854, 2020.
[13] Y. Sun, J. Liu, K. Yu, M. Alazab, and K. Lin, “PMRSS: Privacy-Preserving Medical Record Searching Scheme for Intelligent Diagnosis in IoT Healthcare,” IEEE Transactions on Industrial Informatics, vol. 18, no. 3, pp. 1981–1990, 2022.
[14] S. Telawi, A. Hayek, and J. Börcsök, “Safe Detection of Wheels Spinning and Sliding in Vehicles,” IEEE Transactions on Vehicular Technology, vol. 71, no. 9, pp. 9410–9421, 2022.
[15] J. Stój, “Cost-Effective Hot-Standby Redundancy With Synchronization Using EtherCAT and Real-Time Ethernet Protocols,” IEEE Transactions on Automation Science and Engineering, vol. 18, no. 4, pp. 2035–2047, 2021.
[16] B. Bajic, A. Rikalovic, N. Suzic, and V. Piuri, “Industry 4.0 Implementation Challenges and Opportunities: A Managerial Perspective,” IEEE Systems Journal, vol. 15, no. 1, pp. 546–559, 2021.
[17] J. Leng, S. Ye, M. Zhou, J. L. Zhao, Q. Liu, W. Guo, W. Cao, and L. Fu, “Blockchain-Secured Smart Manufacturing in Industry 4.0: A Survey,” IEEE Transactions on Systems, Man, and Cybernetics: Systems, vol. 51, no. 1, pp. 237–252, 2021.
[18] S. Ding, and X. Wang, “Medical Remote Monitoring of Multiple Physiological Parameters Based on Wireless Embedded Internet,” IEEE Access, vol. 8, pp. 78279–78292, 2020.
[19] L. Tan, W. Su, W. Zhang, H. Shi, J. Miao, and P. Manzanares-Lopez, “A Packet Loss Monitoring System for In-Band Network Telemetry: Detection, Localization, Diagnosis and Recovery,” IEEE Transactions on Network and Service Management, vol. 18, no. 4, pp. 4151–4168, 2021.
[20] F. A. Yaseen, and H. S. Al-Raweshidy, “Smart Virtualization Packets Forwarding During Handover for Beyond 5G Networks,” IEEE Access, vol. 7, pp. 65766–65780, 2019.
[21] Q. Jiang, X. Huang, N. Zhang, K. Zhang, X. Ma, and J. Ma, “Shake to Communicate: Secure Handshake Acceleration-Based Pairing Mechanism for Wrist Worn Devices,” IEEE Internet of Things Journal, vol. 6, no. 3, pp. 5618–5630, 2019.
[22] T. V. Lakshman, and U. Madhow, “The performance of TCP/IP for networks with high bandwidth-delay products and random loss,” IEEE/ACM Transactions on Networking, vol. 5, no. 3, pp. 336–350, 1997.
[23] A. Praseed, and P. S. Thilagam, “DDoS Attacks at the Application Layer: Challenges and Research Perspectives for Safeguarding Web Applications,” IEEE Communications Surveys & Tutorials, vol. 21, no. 1, pp. 661–685, 2019.
[24] J. Montalban, R. Cabrera, E. Iradier, P. Angueira, Y. Wu, L. Zhang, W. Li, and Z. Hong, “Broadcast Core-Network: Converging Broadcasting With the Connected World,” IEEE Transactions on Broadcasting, vol. 67, no. 3, pp. 558–569, 2021.
[25] H. Si, C. Sun, B. Chen, L. Shi, and H. Qiao, “Analysis of Socket Communication Technology Based on Machine Learning Algorithms Under TCP/IP Protocol in Network Virtual Laboratory System,” IEEE Access, vol. 7, pp. 80453–80464, 2019.
[26] Ching-Han Chen, Ming-Yi Lin, and Xing-Chen Guo, “High-level Modeling and Synthesis of Smart Sensor Networks for Industrial Internet of Things,” Computers & Electrical Engineering, vol.61, pp.48–66, 2017.
指導教授 陳慶瀚(Ching-Han Chen) 審核日期 2023-7-22
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