電弧噴塗積層製造：Ta/TaN 薄膜物理氣相沉積中腔體襯套翻新與顆粒缺陷減少相關性研究

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姓名

楊上賢(Shang-Shian Yang) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

電弧噴塗積層製造：Ta/TaN 薄膜物理氣相沉積中腔體襯套翻新與顆粒缺陷減少相關性研究
(Arc spray-additive manufacturing: Correlation of Chamber Kits Refurbishing and Particle Defects Reduction in Ta/TaN Thin-Film Physical Deposition Processes)

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摘要(中)

物理氣相沉積（PVD）的鉭/氮化鉭（Ta/TaN）作為半導體製造中的銅互連部分中的擴散阻擋層和襯墊在起著至關重要的作用，特別是在130奈至5奈米及更高技術節點上。本論文專注於電弧噴塗積層製造（ASAM）塗層在PVD腔體襯套（chamber kit）翻新過程中的表面製備和特徵對於PVD Ta/TaN 製程中顆粒缺陷的影響。通過使用噴砂預處理基材，創造合適的表面紋理，以及將純鋁（99.8%）替換為鋁合金作為ASAM塗層材料，用以增強噴塗塗層的附著力。然而實驗結果顯示使用高附著力的塗層會增加kit壽命中期發生缺陷失控（OOC）的概率。這種現象的根本原因可能歸因於ASAM塗層的尖點狀表面形態。使用有限元分析模擬應力分佈並觀察多層Ta/TaN薄膜中的應力集中區域，並比較不同表面形態的兩種ASAM塗層。數值模擬和實驗觀察顯示，ASAM塗層表面形態顯著影響薄膜分層，這是顆粒缺陷的主要原因。本研究強調了理解形成顆粒缺陷的潛在機制的重要性，並強調了改善噴塗塗層的均勻性和增加表面曲率半徑以減少應力集中的重要性。

摘要(英)

Physical Vapor Deposition(PVD) of Tantalum/Tantalum Nitride (Ta/TaN) barrier and liner plays a crucial role in the copper-interconnecting part of semiconductor manufacturing, and this will be used for the 130nm-5nm technology node and beyond. This study focuses on the surface preparation and characterization of arc spray-additive manufacturing (ASAM) coating in the refurbishment process of PVD chamber kits. Spray coating adhesion strength is enhanced due to the pre-treatment of the substrate with grit blasting, which creates a suitable surface texture, and the replacement of aluminum alloy as an ASAM coating material from pure aluminum (99.8%). However, it was experimentally found that using high adhesion strength coating chamber kits increases the probability of out-of-control (OOC) occurrences in the mid-stage of the kit lifetime, and the fundamental reasons may be attributed to the spiky surface morphology of ASAM coating layers. Finite element analysis simulates stress distribution and identifies stress concentration regions within the multilayer Ta/TaN thin film using two surface morphologies with significantly different curvature radii of spray coatings. Differences in ASAM processing parameters include a slower travel speed, a longer spray time, and a lower feed rate. It is numerically simulated and experimentally observed that spray coating surface morphology dramatically affects thin film delamination, which is the primary cause of particle defects. This study emphasizes the potential mechanisms for forming particle defects, improved uniformity in spray coatings, and increased surface curvature radius to minimize stress concentration.

關鍵字(中)

★ 半導體製造
★ Ta/TaN
★ 電弧噴塗積層製造(ASAM)
★ 有限元分析
★ 薄膜分層

關鍵字(英)

★ Semiconductor manufacturing
★ Ta/TaN
★ Arc spray-additive manufacturing (ASAM)
★ Finite element analysis
★ Film delamination

論文目次

摘要 i
ABSTRACT iii
誌謝 v
目錄 vii
圖目錄 List of Figures x
表目錄 List of Tables xii
一、緒論 1
1-1 前言 1
1-2 研究動機與目的 3
二、研究理論與背景介紹 5
2-1 物理氣相沉積（PVD） 5
2-2 濺鍍（Sputter）薄膜沉積原理與設備保養 6
2-3 電弧噴塗積層製造（ASAM） 7
2-4 ASTM-C633 試驗方法 9
2-5 塗層之附著力與kit使用壽命之關係 10
2-6 顆粒缺陷之監測 11
三、研究方法 13
3-1 實驗流程 13
3-2 實驗方法 14
3-2-1 試片準備 14
3-2-2 試片噴砂處理 16
3-2-3 電弧噴塗鋁塗層沉積 17
3-2-4 塗層附著力強度測試 19
3-2-5 腔體襯套顆粒缺陷監測 20
3-3 實驗裝置與量測 21
3-3-1 電弧噴塗積層製造（ASAM） 21
3-3-2 表面粗糙度測量儀 23
3-3-3 掃描式電子顯微鏡 25
3-3-4 拉伸試驗機 28
3-3-5 PVD Ta/TaN製程顆粒缺陷監測 30
四、實驗結果與討論 32
4-1 試片噴砂處裡之表面和電弧噴塗之塗層橫截面 32
4-2 塗層附著力強度測試 36
4-3 PVD腔體襯套與製程缺陷監控 39
4-4 Ta/TaN薄膜與腔體襯套表面的CTE不匹配應力模擬 42
4-5 改善方案 47
4-6 氣孔逃逸的機制與導致塗層表面尖峰的關係 51
4-7 薄膜剝落的潛在機制 53
五、結論 55
參考文獻 57
附件 62

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指導教授

利定東(Ting-Tung Li)

審核日期

2023-12-15

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