封閉區間內多孔熱源陣列之數值模擬

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賴仁杰(Jen-Chieh Lai) 查詢紙本館藏

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化學工程與材料工程學系

論文名稱

封閉區間內多孔熱源陣列之數值模擬
(Simulation of porous thermal array in a enclosure)

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摘要(中)

摘要
本論文應用計算流體力學軟體FIDAP分析圓形封閉區間內，五個圓形多孔熱源排成十字陣列的物理系統。此系統的流場及溫度場之重要參數有：代表熱源發熱量與浮力大小的雷立數；描述多孔質疏密狀態的達西數；以及表示多孔熱源與流體熱傳導係數差異的有效熱傳導係數比。從本研究的結果顯示：系統內的對稱流場隨雷立數增大，於對稱區間內的右上區域均形成順時針流動之雙環流結構。從溫度場可以看出：在低雷立數係均勻向周邊等溫壁面散熱；然在高雷立數時，則熱源所引發浮力效應增強，轉變為經由封閉區間上方散熱。而達西數越大則表示多孔質可透度越大，對於流體區內之流動強度的影響越小。因此改變達西數，對於所有封閉區間的狀態皆有影響。當有效熱傳導係數比增為100時，溫度場結構呈現急遽且均勻的熱量散失狀態，同時促使流場內的雙環流結構更加明顯。

關鍵字(中)

★ 封閉區間
★ 多孔質

關鍵字(英)

★ porous media
★ enclosure

論文目次

目錄
目錄 I
圖目錄 III
表目錄 VI
符號說明 VII
第一章緒論 1
1-1研究飽和多孔質內部流動的重要性 1
1-2飽和多孔質內部流體的流動形式 1
1-3封閉區間內嵌多孔質之文獻回顧與研究動機 5
1-4本論文的研究方向 6
第二章系統描述與理論分析 8
2-1系統描述 8
2-2基本假設 8
2-3系統方程式 10
2-4無因次化 13
第三章數值方法 16
3-1前言 16
3-2計算流體力學CFD的處理程序 17
3-2-1前處理程序 (Pre-processing) 17
3-2-2計算處理程序 (Processing) 18
3-2-3後處理程序(Post-processing) 19
3-3 FIDAP的限制條件 23
3-4 研究的硬體平台與相關設定 25
第四章結果與討論 26
4-1 系統參數值 26
4-2 固定達西數Da為10-2，逐漸增強雷立數 28
4-2-1 固定多孔質與流體熱傳導係數比值λ= 1.0 28
4-2-2 固定多孔質與流體熱傳導係數比值λ= 10.0與100.0 29
4-3 固定達西數Da為10-6，逐漸增強雷立數 32
4-3-1 固定多孔質與流體熱傳導係數比值λ= 1.0 32
4-3-2 固定多孔質與流體熱傳導係數比值λ= 10.0與100.0 33
4-4 固定雷立數Ra = 10000，逐漸減小達西數 33
4-4-1 固定多孔質與流體熱傳導係數比值λ= 1.0 34
4-4-2 固定多孔質與流體熱傳導係數比值λ= 10.0與100.0 35
第五章綜合結論與未來延續之工作 61
5-1 綜合結論 61
5-2 未來延續之工作 62
參考文獻 64

參考文獻

參考文獻
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指導教授

林孝宗(Shaw-Chong Lin)

審核日期

2004-6-26

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