鎳銦表面鍍層對含銀厚膜之抗遷移性研究

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林智賢(Jyh-Shyan Lin) 查詢紙本館藏

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機械工程學系

論文名稱

鎳銦表面鍍層對含銀厚膜之抗遷移性研究

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摘要(中)

本論文在探討鎳、銦電鍍層對銀及銀-鈀厚膜抗遷移性之影響。純銀厚膜表面經電鍍1，2，3μm厚度鎳後，浸泡於蒸鎦水中，施以5V偏壓，進行遷移研究，結果顯示：表層經鍍鎳後之銀厚膜，具有抑制銀遷移之效果，此項抗遷移性，隨著鎳鍍層厚度由1至3μm而增加，依序為：1<2<3μm。若以試片中銀鎳組成(wt%)而言則為Ag 純銀厚膜及銀-鈀厚膜表面經電鍍1μm、2μm及3μm銦後，在蒸餾水中施以5V偏壓進行遷移研究，結果顯示︰銀及銀-鈀厚膜表面經鍍1μm厚銦後，即具良好抗遷移性，且此遷移性不受熱處理之影響。
為了解銀遷移原因，在0.01M NaOH水溶液中進行電化學陽極極化分析，配合XPS表面分析，得知鎳、銦鍍層對抗遷移性之貢獻如下：鎳及銦鍍層在厚膜表面因陽極鈍化而生成保護膜，此鈍化膜在鎳表層為NiO及Ni(OH)2及銦表層為In2O3，可以抑制下層厚膜中銀的溶解及氧化。

摘要(英)

Deposition of indium is better than deposition of nickel on silver and silver-palladium thick films to provide higher resistance to electrolytic migration. As long as a thickness of 1μm indium has been electroplated, the indium-deposited thick films are good enough to inhibit the electrolytic migration. The resistance to electrolytic migration remains efficiently even the In-deposited thick films having experienced a heat treatment at 200°C for 20min.
Anodic potentiodynamic polarization for Ni- and In-deposited silver thick films in 0.01M NaOH solution has been studied to delineate the mechanism of migration resistance. It was found that the resistance of migration is due to inhibition of silver dissolution from anode. This inhibition was ascribed to oxide passivation arisen from the nickel and indium deposits. The results of ESCA analysis showed that NiO, Ni(OH)2 and In2O3 played an important role on anodic passivation.

關鍵字(中)

★ 厚膜
★ 抗遷移
★ 陽極極化
★ 鎳
★ 銦

關鍵字(英)

★ thick films
★ anti-migration
★ anodic polarization
★ nickel
★ indium

論文目次

摘要(中文)…………………………………………………………Ⅰ
摘要(英文)…………………………………………………………Ⅱ
致謝…………………………………………………………………Ⅲ
目錄……………………………………………………………………Ⅳ
表目錄………………………………………………………………Ⅷ
圖目錄………………………………………………………………Ⅸ
一、前言……………………………………………………………1
二、文獻回顧與理論……………………………………………4
2-1金屬的遷移…………………………………………………4
2-1-1遷移(migration) ……………………………………4
2-1-2金屬遷移的型態……………………………………4
2-1-3金屬遷移的環境……………………………………4
2-1-4金屬遷移的過程與現象……………………………6
2-2銀的遷移……………………………………………………7
2-3鎳的氧化………………………………………………9
2-4銦的氧化………………………………………………10
2-5合金的溶解………………………………………………11
三、實驗裝置………………………………………………………13
3-1厚膜導體材料製備………………………………………13
3-1-1膠體製備……………………………………………13
3-1-2厚膜圖樣……………………………………………13
3-1-3印刷及燒結…………………………………………14
3-2電鍍及熱處理……………………………………………14
3-2-1銀厚膜電鍍鎳及熱處理…………………………14
3-2-2銀厚膜電鍍銦及熱處理…………………………16
3-2-3銀鈀厚膜電鍍銦…………………………………17
3-3電解槽環境…………………………………………………17
3-3-1電解槽及實驗裝置………………………………17
3-3-2電解槽環境………………………………………18
3-4實驗操作與試片準備……………………………………19
3-4-1遷移性的比較……………………………………19
3-4-2動態陽極極化曲線掃描…………………………19
3-4-3陽極定電位腐蝕…………………………………20
3-5儀器分析……………………………………………………20
3-5-1直流分析……………………………………………20
3-5-2 OM及SEM觀察………………………………20
3-5-3 X-ray成份分析…………………………………21
3-5-4 ESCA表面氧化物成份分析及AES縱深分佈……………………………………………………21
四、結果……………………………………………………………22
(Ⅰ)純銀厚膜鍍鎳
4-1-1 純銀厚膜鍍鎳熱處理前後表面SEM觀察……22
4-1-2 厚膜熱處理前後X-ray繞射分析………………22
4-1-3 鍍600秒鎳銀厚膜熱處理後之SEI剖面圖…23
4-1-4 兩極在外加電壓5V時電流密度對時間的關係圖…………………………………………………23
4-1-5 陰極的析出…………………………………………24
(Ⅱ)純銀厚膜鍍銦
4-2-1 純銀厚膜鍍銦熱處理前後表面SEM觀察……26
4-2-2 厚膜熱處理前後X-ray繞射分析………………27
4-2-3 鍍銦銀厚膜之SEI剖面圖及元素面分佈情形……………………………………………………30
4-2-4 兩極在外加電壓5V時電流密度對時間的關係圖……………………………………………………30
(Ⅲ)銀鈀厚膜鍍銦
4-3-1 銀鈀厚膜電鍍銦後試片表面SEM觀察………32
4-3-2 銀鈀厚膜電鍍銦後試片X-ray繞射分析……32
4-3-3 兩極在外加電壓5V時電流密度對時間的關係圖……………………………………………………32
五、討論……………………………………………………………34
(Ⅰ)純銀厚膜鍍鎳
5-1-1 NaOH水溶液中的動態陽極極化曲線分析……34
5-1-2 三種不同鍍鎳銀厚膜的極化曲線比較………38
5-1-3 厚膜在0.01M NaOH水溶液中的陽極電流…40
5-1-4 ESCA表面氧化物成分分析…………………41
5-1-5 AES縱深分佈實驗………………………………44
(Ⅱ)純銀厚膜鍍銦
5-2-1 NaOH水溶液中的動態陽極極化曲線分析……46
5-2-2 三種不同鍍鎳銀厚膜的極化曲線比較………52
5-2-3 ESCA表面氧化物分析………………………54
5-2-4 AES縱深分布……………………………………57
(Ⅲ)銀鈀厚膜鍍銦
5-3-1 NaOH水溶液中的動態陽極極化曲線分析…60
5-3-2 ESCA表面氧化物分析……………………………61
六、結論……………………………………………………………63
七、未來展望………………………………………………………64
八、參考文獻………………………………………………………65
附錄防蝕工程投稿………………………………………………141

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指導教授

林景崎(Jing-Chie Lin)

審核日期

2000-7-13

推文