博碩士論文 87323014 詳細資訊




以作者查詢圖書館館藏 以作者查詢臺灣博碩士 以作者查詢全國書目 勘誤回報 、線上人數:11 、訪客IP:54.91.4.56
姓名 林智賢(Jyh-Shyan Lin)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 鎳銦表面鍍層對含銀厚膜之抗遷移性研究
相關論文
★ 銅導線上鍍鎳或錫對遷移性之影響及鍍金之鎳/銅銲墊與Sn-3.5Ag BGA銲料迴銲之金脆研究★ 單軸步進運動陽極在瓦茲鍍浴中進行微電析鎳過程之監測與解析
★ 光電化學蝕刻n-型(100)單晶矽獲得矩陣排列之巨孔洞研究★ 銅箔基板在H2O2/H2SO4溶液中之微蝕行為
★ 助銲劑對迴銲後Sn-3Ag-0.5Cu電化學遷移之影響★ 塗佈奈米銀p型矽(100)在NH4F/H2O2 水溶液中之電化學蝕刻行為
★ 高效能Ni80Fe15Mo5電磁式微致動器之設計與製作★ 銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu與In-48Sn BGA銲料迴銲後之接點強度影響
★ 含氮、硫雜環有機物對鍋爐鹼洗之腐蝕抑制行為研究★ 銦、錫金屬、合金與其氧化物的陽極拋光行為探討
★ n-型(100)矽單晶巨孔洞之電化學研究★ 鋁在酸性溶液中孔蝕行為研究
★ 微陽極引導電鍍與監測★ 鍍金層對Bi-43Sn與Sn-9Zn BGA銲料迴銲後之接點強度影響及二元銲錫在不同溶液之電解質遷移行為
★ 人體血清白蛋白構形改變之電化學及表面電漿共振分析研究★ 光電化學蝕刻製作n-型(100)矽質微米巨孔 陣列及連續壁結構
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   [檢視]  [下載]
  1. 本電子論文使用權限為同意立即開放。
  2. 已達開放權限電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。
  3. 請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。

摘要(中) 本論文在探討鎳、銦電鍍層對銀及銀-鈀厚膜抗遷移性之影響。純銀厚膜表面經電鍍1,2,3μm厚度鎳後,浸泡於蒸鎦水中,施以5V偏壓,進行遷移研究,結果顯示:表層經鍍鎳後之銀厚膜,具有抑制銀遷移之效果,此項抗遷移性,隨著鎳鍍層厚度由1至3μm而增加,依序為:1<2<3μm。若以試片中銀鎳組成(wt%)而言則為Ag 純銀厚膜及銀-鈀厚膜表面經電鍍1μm、2μm及3μm銦後,在蒸餾水中施以5V偏壓進行遷移研究,結果顯示︰銀及銀-鈀厚膜表面經鍍1μm厚銦後,即具良好抗遷移性,且此遷移性不受熱處理之影響。
為了解銀遷移原因,在0.01M NaOH水溶液中進行電化學陽極極化分析,配合XPS表面分析,得知鎳、銦鍍層對抗遷移性之貢獻如下:鎳及銦鍍層在厚膜表面因陽極鈍化而生成保護膜,此鈍化膜在鎳表層為NiO及Ni(OH)2及銦表層為In2O3,可以抑制下層厚膜中銀的溶解及氧化。
摘要(英) Deposition of indium is better than deposition of nickel on silver and silver-palladium thick films to provide higher resistance to electrolytic migration. As long as a thickness of 1μm indium has been electroplated, the indium-deposited thick films are good enough to inhibit the electrolytic migration. The resistance to electrolytic migration remains efficiently even the In-deposited thick films having experienced a heat treatment at 200°C for 20min.
Anodic potentiodynamic polarization for Ni- and In-deposited silver thick films in 0.01M NaOH solution has been studied to delineate the mechanism of migration resistance. It was found that the resistance of migration is due to inhibition of silver dissolution from anode. This inhibition was ascribed to oxide passivation arisen from the nickel and indium deposits. The results of ESCA analysis showed that NiO, Ni(OH)2 and In2O3 played an important role on anodic passivation.
關鍵字(中) ★ 厚膜
★ 抗遷移
★ 陽極極化
★ 鎳
★ 銦
關鍵字(英) ★ thick films
★ anti-migration
★ anodic polarization
★ nickel
★ indium
論文目次 摘要(中文)…………………………………………………………Ⅰ
摘要(英文)…………………………………………………………Ⅱ
致謝…………………………………………………………………Ⅲ
目錄……………………………………………………………………Ⅳ
表目錄………………………………………………………………Ⅷ
圖目錄………………………………………………………………Ⅸ
一、前言……………………………………………………………1
二、文獻回顧與理論……………………………………………4
2-1金屬的遷移…………………………………………………4
2-1-1遷移(migration) ……………………………………4
2-1-2金屬遷移的型態……………………………………4
2-1-3金屬遷移的環境……………………………………4
2-1-4金屬遷移的過程與現象……………………………6
2-2銀的遷移……………………………………………………7
2-3鎳的氧化………………………………………………9
2-4銦的氧化………………………………………………10
2-5合金的溶解………………………………………………11
三、實驗裝置………………………………………………………13
3-1厚膜導體材料製備………………………………………13
3-1-1膠體製備……………………………………………13
3-1-2厚膜圖樣……………………………………………13
3-1-3印刷及燒結…………………………………………14
3-2電鍍及熱處理……………………………………………14
3-2-1銀厚膜電鍍鎳及熱處理…………………………14
3-2-2銀厚膜電鍍銦及熱處理…………………………16
3-2-3銀鈀厚膜電鍍銦…………………………………17
3-3電解槽環境…………………………………………………17
3-3-1電解槽及實驗裝置………………………………17
3-3-2電解槽環境………………………………………18
3-4實驗操作與試片準備……………………………………19
3-4-1遷移性的比較……………………………………19
3-4-2動態陽極極化曲線掃描…………………………19
3-4-3陽極定電位腐蝕…………………………………20
3-5儀器分析……………………………………………………20
3-5-1直流分析……………………………………………20
3-5-2 OM及SEM觀察………………………………20
3-5-3 X-ray成份分析…………………………………21
3-5-4 ESCA表面氧化物成份分析及AES縱深分佈……………………………………………………21
四、結果……………………………………………………………22
(Ⅰ)純銀厚膜鍍鎳
4-1-1 純銀厚膜鍍鎳熱處理前後表面SEM觀察……22
4-1-2 厚膜熱處理前後X-ray繞射分析………………22
4-1-3 鍍600秒鎳銀厚膜熱處理後之SEI剖面圖…23
4-1-4 兩極在外加電壓5V時電流密度對時間的關係圖…………………………………………………23
4-1-5 陰極的析出…………………………………………24
(Ⅱ)純銀厚膜鍍銦
4-2-1 純銀厚膜鍍銦熱處理前後表面SEM觀察……26
4-2-2 厚膜熱處理前後X-ray繞射分析………………27
4-2-3 鍍銦銀厚膜之SEI剖面圖及元素面分佈情形……………………………………………………30
4-2-4 兩極在外加電壓5V時電流密度對時間的關係圖……………………………………………………30
(Ⅲ)銀鈀厚膜鍍銦
4-3-1 銀鈀厚膜電鍍銦後試片表面SEM觀察………32
4-3-2 銀鈀厚膜電鍍銦後試片X-ray繞射分析……32
4-3-3 兩極在外加電壓5V時電流密度對時間的關係圖……………………………………………………32
五、討論……………………………………………………………34
(Ⅰ)純銀厚膜鍍鎳
5-1-1 NaOH水溶液中的動態陽極極化曲線分析……34
5-1-2 三種不同鍍鎳銀厚膜的極化曲線比較………38
5-1-3 厚膜在0.01M NaOH水溶液中的陽極電流…40
5-1-4 ESCA表面氧化物成分分析…………………41
5-1-5 AES縱深分佈實驗………………………………44
(Ⅱ)純銀厚膜鍍銦
5-2-1 NaOH水溶液中的動態陽極極化曲線分析……46
5-2-2 三種不同鍍鎳銀厚膜的極化曲線比較………52
5-2-3 ESCA表面氧化物分析………………………54
5-2-4 AES縱深分布……………………………………57
(Ⅲ)銀鈀厚膜鍍銦
5-3-1 NaOH水溶液中的動態陽極極化曲線分析…60
5-3-2 ESCA表面氧化物分析……………………………61
六、結論……………………………………………………………63
七、未來展望………………………………………………………64
八、參考文獻………………………………………………………65
附錄 防蝕工程投稿………………………………………………141
參考文獻 1. Kawanobe, K. Otsuka, "Metal Migration in Electronic Compo-nents," IEEE Trans. Comp., Hybirds, Manuf. Technol., (1982) 220-228.
1. Kawanobe, K. Otsuka, "Metal Migration in Electronic Compo-nents," IEEE Trans. Comp., Hybirds, Manuf. Technol., (1982) 220-228.
3. 陳俊堯,「鈀含量對銀鈀厚膜導體遷移抑制之影響」,國立中央大學機械工程研究所碩士論文,指導教授:林景崎 (1993)。
4. 莊瑞育,「PdO表面膜對Ag-Pd厚膜的銀遷移抑制作用研究」,國立中央大學機械工程學系碩士論文,指導教授:林景崎 (1995)。
5. J. C. Lin and J. Y. Chan, Mater. Chem. Phys., 43, (1996) 256-265.
5. J. C. Lin and J. Y. Chan, Mater. Chem. Phys., 43, (1996) 256-265.
7. 賴耿陽,「金銀白金理論實務」,復漢出版社發行,第115頁(1998)。
8. 鄭福元、周立飛、虎軒東,「厚薄膜混合集成電路-設計、製造和應用」,科學出版社,第59-60頁(1984)。
9. S. A. Watson, "Application of Engineering Nickel Plating," Nickel Development Technical Series, No. 10051, Toronto (1989).
10. J. K. Dennis and T. E. Such, "Nickel and chromium plating," 3rd edi-tion, Publishing by Woodhead Publishing Ltd., England.
11. S. J. Krumbein, "Metallic Electromigration Phenomena," IEEE Transactions on Components, Hybrids, and Manufacturing Technol-ogy, Vol. 11, No. 1, March (1988).
11. S. J. Krumbein, "Metallic Electromigration Phenomena," IEEE Transactions on Components, Hybrids, and Manufacturing Technol-ogy, Vol. 11, No. 1, March (1988).
11. S. J. Krumbein, "Metallic Electromigration Phenomena," IEEE Transactions on Components, Hybrids, and Manufacturing Technol-ogy, Vol. 11, No. 1, March (1988).
11. S. J. Krumbein, "Metallic Electromigration Phenomena," IEEE Transactions on Components, Hybrids, and Manufacturing Technol-ogy, Vol. 11, No. 1, March (1988).
15. A. J. Bard, "Electrochemical Methods : Fundmentals and Applica-tions," John Wiley & sons. Inc., U. S. A. , (1980) 119.
16. M. Pourbaix, "Atlas of Electrochemical Equilibra in Aqueous Solu-tions," Pergamon Press, Oxford, , (1966) 394, 331.
17. V. Rothmund, "Ueber den Einfluss der Anionen auf die Passivier-barkeit der Metalle," Z. Phys. Chem. 110, (1924) 384-392.
18. M. Pourbaix, "Corrosion du fer par les solutions de soude caustique [Thesis, Brussels, 1945 (exact)]," Bull. Techn. A. I. Br., (1946) 67-86 (1947) 109-120.
19. L. M. Voltchkova, L. G. Antonova and A. J. Krasilschikov, "Com-portement anoidique du nickel dans les solutions alcalines," J. Fiz. Khim. 23, (1949) 714-718.
20. M. Pourbaix, "Atlas of Electrochemical Equilibra in Aqueous Solu-tions," Pergamon Press, Oxford, (1966) 437.
21. P. Pascal, "Traite de Chimie minerale," Vol. VII, Masson, Paris, (1932) 455-472.
22. H. Remy, "Treatise on Inorganic Chemistry," Vol. I, Elsevier, (1956) 375-380.
23. M. Datta, "Anodic Dissolution of Metals at High Rates," IBM J. RES. Develop. Vol. 37, No. 2 (1993).
24. H. W. Pickering, "Characteristic Features of Alloy Polarization Curves," Corrosion Science, Vol. 23, No. 10, (1983) 1107-1120.
25. A. A. Wronkowska, A. Wronkowski, "The Corrosion Behavior of Ag-Sn Alloys Investigated by Ellipsometry," Corrosion Sci., Vol. 34, No. 2, (1993) 249-259.
25. A. A. Wronkowska, A. Wronkowski, "The Corrosion Behavior of Ag-Sn Alloys Investigated by Ellipsometry," Corrosion Sci., Vol. 34, No. 2, (1993) 249-259.
27. T. E. Graedel, "Corrosion Mechanisms for Silver Exposed to the At-mosphere", J. Electrochem. Soc., Vol. 139, No. 7, July (1992) 1963-1970.
28. 汪建民,「材料分析」,中國材料科學學會,第305-351頁,第353-382頁 (1998)。
29. W. Keppner, R. Wesche, T. Klas, J. Voigt, and G. Schatz, Thin Solid Films 143, (1986) 201.
30. 黃隆瑋,"銀厚膜表面蒸鍍銦、錫後之固液擴散接合研究",中央大學機械所碩士論文,指導教授:林景崎 (1999)。
31. B. Wodniecka, P. Wodniecki, and A. Z. Hrynkiewicz, Hyperfine In-teractions 78, (1993) 323.
32. L. Berntein, "Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process", J, Electrochem. Soc. 113, (1966) 1282.
33. R. Roy and S. K. Sen, "The Kinetics of Formation of Intermetallics in Ag/In Thin Film Couples", Thin Solid Films 197, (1992) 303.
34. V. Simic and Z. Marinkovic, "Room Temperature Interactions in Ag-Metalls Thin Film Couples", Thin Solid Film 61, (1979) 149.
34. V. Simic and Z. Marinkovic, "Room Temperature Interactions in Ag-Metalls Thin Film Couples", Thin Solid Film 61, (1979) 149.
36. D. E. Davies and W. Barker, "Influence of pH on Corrosion and Pas-sivation of Nickel", Corrosion 20, 47t (1964).
37. S. E. S. El Wakked and S. H. Emara. J. Chem. Soc., (1953) 3504; (1957) 3770.
38. M. Valchkova. L. G. Antonova and A. I. Krasilschikov. Zhur. Fiz. Khim., 23, (1949) 714.
39. T. Dickinson, A. F. Povery and P. M. A. Sherwood, "Dissolution and Passivation of Nickel-An X-ray Photoelectron Spectroscopic Study", J. C. S. Faraday I 73, (1977) 327.
39. T. Dickinson, A. F. Povery and P. M. A. Sherwood, "Dissolution and Passivation of Nickel-An X-ray Photoelectron Spectroscopic Study", J. C. S. Faraday I 73, (1977) 327.
41. K.S.Kim and N. Winograd, "X-ray Photoelectron Spectroscopic Studies of Nickel-Oxygen Surfaces Using Oxygen and Argon Ion-Bombardment", Surface Science, Vol. 43, (1974) 625-643.
41. K.S.Kim and N. Winograd, "X-ray Photoelectron Spectroscopic Studies of Nickel-Oxygen Surfaces Using Oxygen and Argon Ion-Bombardment", Surface Science, Vol. 43, (1974) 625-643.
43. L. H. Tjeng, M. B. J. Meinders, J. van Elp, J. Ghijsen , and G. A. Sa-watzky, "Electronic Structure of Ag2O", Physical review B, Vol. 41, No. 5, (1990) 3190.
44. T. M. Salem, A. A. Ismail, "Electrochemistry of Indium. Part Ⅰ. Anodic Oxidation of Indium in Sodium Hydroxide Solutions", J. Appl. Phys. 37, (1966) 299.
45. F. F. Faizullin and N. A. Amirkhanova, Elektrokhimiya 2, 805-1383 (1966).
45. F. F. Faizullin and N. A. Amirkhanova, Elektrokhimiya 2, 805-1383 (1966).
47. M. Pourbaix, "Atlas of Electrochemical Equilibra in Aqueous Solu-tions", Pergamon Press, Oxford, (1966) 437-442.
48. S. Omanovic, M. Metikos-Hukovic, "Indium as a Cathodic Material: Catalytic Reduction of Formaidehyde", J. Appl. Electrochem. 27, (1997) 35.
48. S. Omanovic, M. Metikos-Hukovic, "Indium as a Cathodic Material: Catalytic Reduction of Formaidehyde", J. Appl. Electrochem. 27, (1997) 35.
48. S. Omanovic, M. Metikos-Hukovic, "Indium as a Cathodic Material: Catalytic Reduction of Formaidehyde", J. Appl. Electrochem. 27, (1997) 35.
48. S. Omanovic, M. Metikos-Hukovic, "Indium as a Cathodic Material: Catalytic Reduction of Formaidehyde", J. Appl. Electrochem. 27, (1997) 35.
指導教授 林景崎(Jing-Chie Lin) 審核日期 2000-7-13
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明