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姓名 戴志銘(Chih-Ming Tai)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 高效能Ni80Fe15Mo5電磁式微致動器之設計與製作
(On the Design and Fabrication of a Highly Efficient Ni80Fe15Mo5 Electromagnetic Microactuator)
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摘要(中) 本研究提出一個創新的高效能電磁式微致動器,此設計能夠以低驅動電流產生高磁通密度,並且具有位移量大與力量大以及低電磁干擾的特性。致動器是由電磁體與可動結構間隔28μm經過晶片接合而成的,而電磁體是以軟磁性材料Ni80Fe15Mo5薄殼包覆,這樣可以有效的降低漏磁,也就是能夠更有效的利用磁場,其中以有限元素法找出最佳的結構尺寸,另外也以數學解析的方式驗證此結構的特性。
此致動器的製作利用體型微加工技術與電鍍supermalloy (Ni80Fe15Mo5)合金,以Ni80Fe15Mo5製作磁性核,薄殼,可動板來取代傳統的permalloy (Ni80Fe20)。以奈米微壓痕儀測試由四根懸臂樑支撐的可動結構,其結構剛性為45μN/μm。當在平面線圈中通入293mA時,可以產生27.6μm的位移量,此時致動器所產生的力量為1240μN,與近幾年類似的致動器比較發現此致動器具有較低的驅動電流、較大的位移量與較大的力量。
摘要(英) A highly efficient electromagnetic microactuator that is capable of achieving large out-of-plane displacement and large force via passing through a small current density was designed and fabricated in this work. The actuator is assembled by one electromagnetic core (winded with copper coils) and a moving plate (supported with four suspended beams) with a spacing of 28μm. The electromagnet was packed in a Ni80Fe15Mo5 shell for diminishing the loss of magnetic flux. Finite element method was used to find out the possibly best design which is confirmed by theoretical analysis in magnetic paths.
Bulk micromachining and electroplating of supermalloy (Ni80Fe15Mo5) were used in the fabrication of electromagnetic microactuator. Supermalloy was considered as the material of the electromagnetic core, shielding shell, moving plate with suspended beams rather than the conventional permalloy. The movable plate in the microactuator was tested with a nanoindenter. The stiffness is calculated to be 45μN/μm. Passing the current (with 293mA) through the copper coil of the electromagnet, the displacement of the moving plate, towards the electromagnet, measured by microtrak was 27.6μm. The exerted magnetic force is at 1240μN. These results show the microactuator with Ni80Fe15Mo5 alloy is efficient in producing large force and displacement.
關鍵字(中) ★ 微致動器
★ 鎳鐵鉬
★ 電鍍
★ 銅
關鍵字(英) ★ microactuator
★ NiFeMo
★ electroplate
★ Cu
論文目次 Chinese abstract (中文摘要) Ⅰ
Abstract II
Acknowledgement IV
Contents V
Table contents IX
Figure contents X
Chapter 1、Introduction 1
Chapter 2、Types of microactuators and their fabrication 4
2.1、Types of microactuators 4
2.2、Fabrication of the microactuator 6
2.2.1、Surface micromachining 6
2.2.2、Bulk micromachining 8
2.2.3、Bonding technology 8
Chapter 3、Literature survey 10
3.1、Electromagnetic microactuator 10
3.2、Electroplating 12
3.2.1、Copper electroplating 13
3.2.2、Alloy electroplating of Ni-Fe-Mo 14
Chapter 4、Design theory on electromagnetic microactuator 19
4.1、The FEM simulation of the microactuator 20
4.2、The analytical solution of the microactuator 21
4.3、Comparison between the analytical solution and FEM simulation 25
Chapter 5、Experimental details 26
5.1、Experimental procedures 26
5.1.1、Sample preparation 26
5.1.2、Electroplating of copper on silicon wafer 27
5.1.3、Electroplating of NiFeMo on silicon wafer 28
5.1.4、Fabrication of electromagnetic microactuator 29
5.1.4.1、Fabrication of an electromagnet unit covered with a shell of Ni80Fe15Mo5 alloy 30
5.1.4.2、Fabrication of the moving plate of Ni80Fe15Mo5 alloy with four-suspended-beam structure 33
5.2、Experimental equipment 35
5.2.1、Experimental instrument 35
5.2.2、Assaying instrument 37
Chapter 6、Results 39
6.1、The analysis of electroplating copper 39
6.2、The analysis of electroplating Ni-Fe-Mo 41
6.2.1、The composition of electroplating Ni-Fe-Mo 41
6.2.2、The magnetic analysis of electroplating Ni-Fe-Mo 45
6.2.3、The TEM of Ni-Fe-Mo 47
6.3、The performance of the electromagnetic microactuator 48
Chapter 7、Discussions 51
7.1、Electroplating copper 51
7.2、The composition of Ni-Fe-Mo alloy 51
7.3、The magnetism of Ni-Fe-Mo alloy 54
7.4、The relationship of the magnetism and the microstructure 54
7.5、Choice of insulator 55
7.6、Conditions for wetting and drying etching 55
7.7、Comparison of Ni80Fe20 and Ni80Fe15Mo5 56
7.8、Comparison of electromagnetic microactuators 56
Chapter 8、Conclusions 57
Chapter 9、Future work 58
References 59
參考文獻 [AHN1] C. H. Ahn, Y. J. Kim, and M. G. Allen, “A fully integrated micromachined toroidal inductor with a nickel-iron magnetic core” (The Switched DC/DC Boost Converter Application, Tansducers 93 (1993).
[AHN2] C. H. Ahn and M. G. Allen, “A fully integrated surface micromachined magnetic microactuator with a multilevel meander magnetic core,” Journal of MEMS,Vol. 2(1), pp. 15-22, 1993.
[AHN3] C. H. Ahn, M. G. Allen, "Micromachined Planar Inductors on Silicon Wafers for MEMS Applications", IEEE Transactions on Industrial Electronics, vol.45, no.6, Dec 1998, 866-876.
[BEC] E. W. Becker, W. Ehrfeld, P. Hagmann, A. Maner and D. Munchmeyer“Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography, Galvanoforming, and Plastic Molding (LIGA Process) ”, Microelectron. Eng., Vol. 4, pp. 35-56 (1986).
[BHA] D. D. Bhailis, C. Murray, M. Duffy, J Alderman, G. Kelly, S. C. Mathuna, “Modelling and analysis of a magnetic microactuator” sensors and actuators 81 (2000) 285-289
[BLY] P. Bley,“ The Liga Process for Fabrication of Three-Dimensional Microscale Structures ”, Interdisciplinary Science Reviews, Vol. 18, No. 3, pp. 267-272 (1993).
[CAL] W. D. Callister, “Materials science and engineering an introduction” pp 660-665 (1999)
[CER] M. Cerisier, K. Attenborough, J. Fransaer, C. V. Haesendonck, and J. P. Celis “Growth Mold of Copper Films Electrodeposited on Silicon from Sulfate and Pyrophosphate Solution” Journal of The Electrochemical Society, 146 (6) 2156-2162 (1999)
[CHO] S. Choi, S. Kawahito, Y. Matsumo, M. Ishida, and Y. Tadokoro, “An integrated micro fluxgate magnetic sensor”, Sensors and Actuators A, vol. 55, pp. 121-126 (1996)
[EHR] W. Ehrfeld,“ The LIGA Process for Microsystems ”, Micro System Technologies, 1990’’s (ed. H. Reichl), Heidelberg, springer-verlag, pp. 521-528 (1990)
[FUL] E. Fullin, J. Gobet, H. Tilmans. and J. Bergqvist, ”A new basic technology for magnetic micro-actuators.” Proc.1998 IEEE MEMS Conf. Heidelberg. Germany, 1998, pp.143-147.
[GUC] H. Guckel, T. R. Christenson, K. J. Skrobis, T. S. Jung, J. Klein, K. V. Hartojo and I. Widjaja, “A first functional current excited planar rotational magnetic micromotor,” 1993 IEEE Workshop on Micro Electro Mechanical-Systems, pp. 7-11, 1993.
[HU] W. Hu, Y. Zhang, D. Song, Z. Zhou, Y. Wang “Electrode properties of amorphous nickel-iron-molybdenum alloy as a hydrogen electrocatalyst in alkaline solution”
[HOL] A. Holmes, S. Saidam and R. Lawes,“ IEEE Microengineering Technologies and How to Exploit Them ”, pp. 1-4 (1997).
[JUD1] J. W. Judy, R. S. Muller and H. H. Zappe, “Magnetic microactuation of polysilicon flexure structures,” Journal of MEMS, Vol. 4, No. 4, pp. 162-169, 1995.
[JUD2] J. W. Judy and R. S. Muller, ”Magnetically actuated, addressable microstructures,” Journal of Microelectromechanical Systems, vol.6, no.3, pp.249-256, Sept.1997.
[LIU1] C. Liu, T. Tsao, Y. C. Tai and C. M. Ho, “Surface micromachined magnetic actuators,” Technical Digest, 1994 IEEE Workshop on Micro-Electro-Mechanical-Systems, pp. 57-62, 1994.
[LIU2] C. Liu, T. Tsao, Y. C. Tai, W. Liu, P. Will, C. M. Ho, “A micromachined permalloy magnetic actuator array for micro robotics assembly systems” the 8th international conference on solid-state sensors and actuators, June 25-29, 1995
[MEC] A. Meckes, J. Behrens, W. Benecke, "A Microvalve with Electromagnetic Actuator", Actuator 98, 6th International Conference on New Actuators, 17-19 June 1998, Bremen, Germany.
[MIL1] R. A. Miller and Y. C. Tai, “Micromachined electromagnetic scanning mirrors”, Optical Engineering, Vol. 36, no. 5, pp.1399-1407.
[MIL2] R. A. Miller, Y. C. Tai, G. Xu, J. Bartha, and F. Lin, “A electromagnetic MEMS 2*2 fiber optical bypass switch”, 1997 international Conference On Solid-State Sensors and Actuators, pp.89-92, June, 1997.
[OHN] T. R. Ohnstein, J. D. Zook, H. B. French, H. Gucked, T. Earles, J. Klein, and P. Mangat, “Tunable IR filters with integral electromagnetic actuators” Proc. Solid State Sensor and Actuator Workshop, Hilton Head, South Carolina, pp. 196-199 (1996)
[OHN] M. Ohnmacht, V. Seidemann, S. Buttgenbach, “Microcoils and microrelays — an optimized multilayer fabrication process”, Sensors and Actuators 83 (2000) 124–129.
[OSK] G. Oskam, P. M. Vereecken, and P. C. Searson “Electrochemical Deposition of Copper on n-Si/TiN” Journal of The Electrochemical Society, 146 (4) 1436-1441 (1999)
[PAR1] J. Y. Park, S. H. Han, and M. G. Allen “Batch-fabricated microinductors with electroplated magnetically anisotropic and laminated alloy cores” IEEE transactions on magnetics. Vol. 35, no, 5, september 1999.
[PAR2] J. Y. Park, S. H. Han, W. P. Taylor, and M. G. Allen “Fully integrated micromachined inductors with electroplated anisotropic magnetic cores” 1998 IEEE
[SAD1] D. J. Sadler, W. Zhang, and C. H. Ahn, “Micromachined semi-encapsulated spiral inductors for micro electro mechanical systems (MEMS) applications” IEEE Transactions on Magnetics, vol.33, no.5, Sept 1997.
[SAD2] D. J. Sadler, T. M. Liakopoulos, and C. H. Ahn, "A Universal Electromagnetic Microactor Using Magnetic Interconnection Concepts", Journal of Microelectromechanical Systems, vol.9, no.4, Dec 2000, 460-468.
[SCH] M. Schneider, R. Castagnetti, M. G. Allen, and H. Baltes, “Integrated flux concentrator improves CMOS magnetotransistor” Proc. IEEE Micro Electro Mechanical Systems Workship, Amsterdam, pp. 151-156 (1995)
[SEA] C. H. Seah, S. Mridha and L. H. Chan “Growth morphology of electroplated copper: effect of seed material and current density”1998IEEE
[TAY1] W. P. Taylor, C. H. Ahn, M. Schneider, S. Choi, T. R. Ohnstein, J. Mallinson, Magneto-Resistive Heads-Fundamentals and Applications, Academic Press, New York (1996)
[TAY2] W. P. Taylor, M. G. Allen, and C. R. Dauwalter, “A fully integrated magnetically actuated micromachined relay” Proc. Solid State Sensor and Actuator Workshop, Hilton Head, South Carolina, pp. 231-234 (1996).
[TAY3] W. P. Taylor, Michael Schneider, Henry Baltes, and Mark G. Allen “Electroplated soft magnetic materials for microsensors and microactuators” Proc. IEEE 1997 international conference on solid-state sensors and actuators.
[TAY4] W. P. Tayler, Member, IEEE, Oliver Brand, and Mark G. Allen, Member, IEEE, “Fully Integrated Magnetically Actuated Micromachined Relays”, Journal of Microelectromechamical Systems, vol.40, no.2, June 1998,181-191.
[VIS] J. B. Vishniac, “The Case for Magnetically Driven Microactuators”, Sensors and Actuators A, 33 (1992) 207-220.
[WAG] B. Wagner, W. Benecke, G. Engelmann and J. Simon, “Micro actuators with moving magnets for linear, torsional or multi-axial motion,” Sensors and Actuators, A(32), pp. 598-603, 1992.
[WEI] K. Weiss, S. Riedel, S.E. Schulz, M. Schwerd, H. Helneder, H. Wendt, T. Gessner “Develop of different copper seed layers with respect to the copper electroplating process” Microelectronic Engineering 50 (2000) 433-440 Elsevier science
指導教授 林景崎(Jing-Chie Lin) 審核日期 2002-7-26
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