溫度循環對電子產品失效及性能退化效應之數學模式評估

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官長治(CHANG-CHIH KUAN) 查詢紙本館藏

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機械工程學系

論文名稱

溫度循環對電子產品失效及性能退化效應之數學模式評估
(Mathematic Modle Estimate of Temperature cycling for Electronic Products Failure)

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摘要(中)

摘要
本研究推導電子產品在溫度循環試驗中之退化方程式，並利用收集到的電子產品在不同溫度環境中之失效或性能退化資料進行迴歸分析，以瞭解溫度循環效應的數學模式。此外，利用田口實驗計畫法進行實驗及分析，以瞭解各參數對溫度循環試驗結果之影響程度。
在溫度循環數學模式方面，文中將進一步將把可靠度與各溫度循環參數結合在同一數學模式中，並把收集到的循環數-可靠度關係資料代入方程式，以求出循環數相關之係數值。得到PLCC IC循環數之參考係數-0.855，SMT銲點循環數之參考係數為-0.77。在溫度循環數學模式驗證方面，將修正型反冪次模式與修正型Hughes模式以本文實驗獲得之數據及收集到的資料驗證其準確性。在田口實驗計畫法方面，則是以瞭解電容及無線電話模組各溫度循環參數所提供之貢獻度為主。

摘要(英)

This article investigates the effects of thermal cycling on the degradation of electronic products, such as components, small module and SMT welds. Three parameters including temperature range, heating rate and numbers of cycles are considered. From the results, the effect of normal thermal cycling condition on the components and small module is very small. The tensile strength of SMT welds decrease with increasing temperature range and heating rate. The relationship between tensile strength, temperature range, heating rate and numbers of cycles can be described by the modified inverse power law and modified Hughes equation for SMT welds.

關鍵字(中)

★ 溫度循環
★ 電子產品

關鍵字(英)

★ Electronic Products
★ Temperature cycling

論文目次

摘要 I
誌謝 II
總目錄 III
表目錄 VI
圖目錄 IX
符號說明 XI
第一章緒論
1- 1 研究動機與目的
1- 2 文獻回顧
1-2-1國內相關重要文獻
1-2-2國外相關重要文獻
第二章理論說明
2-1 溫度循環試驗
2-1-1溫度循環所造成之熱疲勞
2-2 溫度循環對於電子產品之影響
2-3 溫度循環對於銲接點之影響
2-3-1各種電子構裝銲接技術
2-3-2電子構裝銲接點破壞機構
2-4 溫度循環效應的數學模式
2-5 田口實驗設計法簡介
2-5-1品質損失函數
2-5-2望大特性的S/N比
第三章實驗設備與步驟
3-1 試件規格
3-2 儀器設備
3-3 溫度循環試驗之規劃
3-4 實驗步驟
3-5 田口實驗參數設計
第四章結果與討論
4-1 電子產品之退化效應數學模式
4-1-1 溫度範圍-溫變率-可靠度關係式
4-1-2 溫度循環數學模式驗證
4-2 各溫度循環參數之貢獻率
4-2-1 訊號雜訊比之計算
4-2-2 變異數分析
第五章結論
參考文獻

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指導教授

黃俊仁(Jiun-ren Hwang)

審核日期

2002-7-18

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