博碩士論文 90323040 詳細資訊




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姓名 巫芳青(Fun-Ching Wu)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 鍍金層對Bi-43Sn與Sn-9Zn BGA銲料迴銲後之接點強度影響及二元銲錫在不同溶液之電解質遷移行為
(Effect of the thickness of Au-coating on the strength of BGA joints soldered by Bi-43Sn and Sn-9Zn systems after reflow, and electrolytic migration of Sn-contained binary solders in various solutions)
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摘要(中) 本論文在探討鍍金層對Bi-43Sn與Sn-9Zn BGA銲料迴銲後之接點強度影響及二元銲錫在不同溶液之電解質遷移行為。為了探討金層對於BGA銲接點強度影響,先在鍍鎳(5µm)銅銲墊上電鍍0.1 ~ 1.2 µm金層,再分別與Bi-43Sn及Sn-9Zn銲球進行迴銲,迴銲後即進行剪力量測,結果顯示:隨著金鍍層愈厚,Bi-43Sn銲料的強度愈差,而Sn-9Zn銲料的強度則些微增強。
二元銲錫(Sn-3.5Ag, Bi-43Sn, Sn-0.7Cu, In-49Sn, Sn-37Pb 和 Sn-9Zn) 分別在蒸餾水、0.01M NaCl、 0.01M (NH4)2SO4及水溶性助銲劑水溶液中,施以5V偏壓,進行遷移研究。結果顯示:Sn-Ag 和Sn-Pb 系統在蒸餾水有明顯的電解質遷移行為,然而在0.01M (NH4)2SO4水溶液中卻沒任何的遷移現象,在含氯的水溶液中,所有的二元銲錫均有嚴重的電解質遷移。
在0.01M (NH4)2SO4水溶液中進行陽極動態極化掃描及定電位陽極反應,配合ESCA表面分析,得知Sn-Ag和Sn-Pb在表面會生成SnO2層,因此抑制遷移行為。
摘要(英) Shear strength of the ball grid array (BGA) Bi-43Sn and Sn-9Zn solder balls re-flowed on the Ni/Au-coated Cu-pads was estimated. The strength of the joint between the re-flowed solder ball and the Ni/Au-coated pad was influenced by the thickness of the Au-coating. For the Bi-43Sn soldering system, the shear strength decreased gradually with increasing the Au-coating from 0.5 to 1.2 μm, and abruptly at thickness greater than 0.1 μm. In contrast, for the Sn-9Zn soldering system, the strength increased gradually with the thickness of the Au-coating.
The electrolytic migration of some tin-based binary solder (i.e., Sn-Ag, Sn-Bi, Sn-Cu, Sn-In, Sn-Pb and Sn-Zn alloy) was explored in various solutions (e.g., de-ionized water, 0.01M (NH4)2SO4, 0.01M NaCl and aqueous flux solution -containing 2.2 mM chloride ion) at a dc-bias of 5V. The Sn-Ag and Sn-Pb systems were susceptible to electrolytic migration in de-ionized water but immune to migration in 0.01 M (NH4)2SO4 solution. All the binary systems in this work were facilitated to migration in the chloride solution.
Potentiodynamic and potentiostatic polarization for various soldering systems were compared. X-ray photoelectron spectroscopy (XPS) of the corrosion products on the anode and the dendrites across the electrode were examined. The results from the electrochemical polarization and the XPS analyses were helpful in elucidation of the distinction on migration behavior of various soldering systems.
關鍵字(中) ★ Sn-9Zn銲料及剪應力強度
★ Bi-43Sn銲料
★ 陽極極化
★ 二元銲錫
★ 電解質遷移
關鍵字(英) ★ Sn-9Zn solder
★ shear strength
★ electrolytic migration
★ solder alloy conductors
★ Bi-43Sn solder
★ anodic polarization
★ active region and passive region
論文目次 Abstract I
Acknowledgement III
Contents IV
List of Tables VIII
List of Figures IX
Chapter I Introduction
1
1-1 Strength of the BGA joints between the Au/Ni/Cu pads influenced by the thickness of Au-coating
1
1-2 Electrolytic migration possibly arisen from binary solder alloys
4
Chapter II Literature Review and Theoretical Aspects
7
2-1 Reaction of Bi-Sn solder with Au/Ni/Cu metallization 7
2-2 Reaction of Sn-Zn solder with Au/Ni/Cu metallization 9
2-3 Metallic migration 10
2-3-1 Types of metallic migration 11
2-3-2 Parameters influence the electrolytic migration 12
2-3-3 Electrolytic migration process 13
2-4 Oxidation behavior of Tin 15
2-5 Dissolution of Alloy 16
Chapter III Materials and Experimetal Procedures
18
3-1 Preparation of lead-free solder alloys 18
3-2 Shear testing for solder joint between solder ball and BGA substrate 18
3-2-1 Preparation of specimens 18
3-2-2 Soldering 19
3-2-3 Annealing 20
3-2-4 Shear testing 20
3-2-5 Analysis of the joints and their reaction products 21
3-3 Migration test for lead-free solder alloys of conducter 21
3-3-1 Preparation of specimens 21
3-3-2 Electrolytic cells and the electrodes 22
3-3-3 Environments of the electrolytic migration testing 23
3-3-4 Electrolytic migration testing 25
3-3-5 Anodic polarization of the conductors in 0.01M (NH4)2SO4 solution
25
3-3-6 Analysis of the conductors and their reaction products
26
Chapter IV Results
27
4-1 Effect of Au coating on the joint strength of BGA after reflow 27
4-1-1 Microstructure of as-bonded solder ball 27
4-1-2 Shear strength of the solder-ball joint influenced by the thickness of Au-coating on the Ni/Au-coated Cu-Pads
30
4-2 Lead-Free Alloys in DI water 31
4-2-1 The X-ray diffraction patterns for the lead-free alloys conductors
31
4-2-2 Measurement of bridging current for the lead-free alloys conductors
31
4-2-3 The in-situ observation of electrolytic migration for the lead-free alloys conductors
33
4-2-4 ECSA analysis of the reaction products 33
4-3 Lead-Free Alloys in (NH4)2SO4 Solution 37
4-3-1 Measurement of bridging current for the lead-free alloys conductors 37
4-3-2 The in-situ observation of electrolytic migration for the lead-free alloys conductors 38
4-3-3 Anodic potentiodynamic polarization of the solder alloy conductors in 0.01M (NH4)2SO4 solution
39
4-3-4 ECSA analysis of the reaction products 40
4-4 Lead-Free Alloys in NaCl Solution 48
4-4-1 Measurement of bridging current for the lead-free alloys conductors
48
4-4-2 The in-situ observation of electrolytic migration for the lead-free alloys conductors
49
4-4-3 ECSA analysis of the reaction products 49
4-5 Lead-Free Alloys in Water-Soluble Flux Solution 52
4-5-1 Measurement of bridging current for the lead-free alloys conductors
52
4-5-2 The in-situ observation of electrolytic migration for the lead-free alloys conductors
52
4-5-3 ECSA analysis of the reaction products 53
4-6 Lead-Free Alloys in Various Solutions 56
Chapter V Discussion
58
5-1 Effect of Au coating on the joint strength of BGA after reflow
58
5-2 Electrolytic migration of Lead-Free Alloys in DI water 60
5-3 Electrolytic migration of Lead-Free Alloys in (NH4)2SO4 Solution
62
5-4 Electrolytic migration of Lead-Free Alloys in Solutions Containing Chloride ion
64
Chapter VI Conclusions
65
References 67
參考文獻 [ABT] M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics”, Materials Science and Engineering, Vol. 27, (2000) 95-141.
[BAR] A. J. Bard, “Electrochemical Methods: Fundmentals and Applications”, John Wiley & Sons. Inc., U. S. A., (1980) 119.
[BOC] J. O. Bockris and A. K. Reddy, “Modern Electrochemistry”, New York, NY: Plenum, (1973) ch. 4 and 10.
[CHA1] 張顧耀, “銅導線上鍍金或鎳/金對遷移性之影響及鍍金層對Sn-0.7Cu 與 In-48 BGA銲料迴銲之接點強度影響”, 國立中央大學機械工程學系碩士論文,指導教授:林景崎 博士 (2002)。
[CHA2] Y. C. Chan, M. Y. Chiu, and T. H. Chuang “Intermetallic Compounds Formed during the Soldering Reaction of Eutectic Sn-9Zn with Cu and Ni Substrates” Z. Metallkd., Vol. 93 (2002) 95-98.
[CHE] C. Chen, C. E. Ho, W. T. Chen, and C. R. Kao, “Selective Interfacial Reaction between Ni and Eutectic BiSn Lead –Free Solder”, Chem. Mater. Vol. 13, (2001) 1051-1056.
[DAT] M. Datta, “Anodic Dissolution of Metals at High Rates”, IBM J. RES. Develop. Vol. 37, No. 2 (1993).
[DEA] J. A. Dean, “ Lange’s Handbook of chemistry”, 1974
[DEV] J. R. Devaney, Proc. ASM’s 3rd Conf. Electron Packag. Materials & Process & Corros. In microelectronics, (1987) 287
[DUM] P. Dumoulin, J. P. Seurin and P. Marce, “Metal Migrations Outside the Package During Accelerated Life Tests”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. chmt-5, No. 4, (1982) 479-486.
[ERI] R. Erich, R. J. Coyle and G. M. Wenger, “Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment”, IEEE Electronics Manufacturing Technology Symposium IEEE/CPMT, (1999) 16- 22.
[HAR1] G. Harsányi, “Electrochemical Processes Resulting in Migrated Short Failures in Microcircuits”, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 18, No. 3, (1995) 602-610.
[HAR2] G. Harsányi and G. Inzelt, “Comparing Migratory Resistive Short Formation Abilities of Conductor Systems Applied Advanced Interconnection”, Microelectronics Reliability, Vol. 41, (2001) 229-237.
[JOZ] M. E. Jozefowicz and N. –C. Lee, Circuit World, Vol. 19, No. 4, (1993) 28.
[KO] 柯賢文, “ 腐蝕及其防制”, 全華科技圖書股份有限公司
[KRU] S. J. Krumbein, “Metallic Electromigration Phenomena”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11, No. 1, (1988) 5-15.
[LAC] R. Lachance, H. Lavoie and A. Montanari, “Corrosion / Migration Study of Flip Chip Underfill and Ceramic Overcoating”, IEEE Electronic Components and Technology Conference, (1997) 885-889.
[LIN] H. C. Ling, and A. M. Jackson, “Correlation of Silver Migration with Temperature-Humidity-Bias (THB) Failures in Multilayer Ceramic Capactors”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 12, No. 1, (1989) 130-137.
[LIU] P. L. Liu and J. K. Shang, “Interfacial Segregation of Bismuth in Copper/ Tin-Bismuth Solder Interconnect”, Scripta mater. Vol. 44, (2001) 1019-1023.
[LOR] Lorh,“58Bi/42Sn 無鉛銲料與球矩陣封裝中Au/Ni/Cu 墊層介面反應之研究”, 國立中央大學化學工程研究所碩士論文,指導教授:高振宏 博士 (2001)
[MAS] T. B. Massalski et al. (eds.) “Binary alloy phase diagram”, Vol. 1-3, 2nd edn; 1990, Materials Park, OH, ASM International.
[MEI] Z. Mei, M. Kaufmann, A. Eslambolchi and P. Johnson, “Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Nickel / Immersion Gold”, Electronic Components & Technology Conference, 48th IEEE, (1998) 952-961.
[MEL] C. Melton, “Reflow Soldering Evaluation of Lead Free Solder Alloys”, IEEE Electronic Components and Technology Conference, 1993. Proceedings., 43rd, (1993) 1008-1011
[PIC] H. W. Pickering, “Characteristic Features of Alloy Polarization Curves”, Corrosion Science, Vol. 23, No. 10, (1983) 1107-1120.
[POU] M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford, (1966) 476-480.
[REF] S. A. M. Refaey, “The Corrosion and Passivation of Tin in Borate Solutions and the Effect of Halide Ions”, Electrochimica Acta, Vol. 41, No. 16, (1996) 2545-2549.
[RIE] D. E. Riemer, “Meteria Selection and Design Guidelines for Migration-Resistant Thick-Film Circuits with Silver-Bearing Conductors”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, (1981).
[SER] M. Seruga, M. Metikos-Hukovic, T. Valla, M. Milun, H. Hoffschultz, and K. Wandelt, “Electrochemical and X-ray Photoelectron Spectroscopy Studied of Passive Film on Tin in Citrate Buffer Solution”, Journal of Electroanalytical Chemistry, Vol. 407, (1996) 83-89.
[SLI] J. D. Slinclair, Proc. ASM’s 3rd Conf. Electron Packag. Materials & Process & Corros. In microelectronics, (1987) 145
[SIN] J. D. Sinclair and L. A. Psota-Kelty, “Measurement and Modeling of Airborne Concentrations and Indoor Surface Accumulation Rates of Ionic Substances at Neenah, Wisconsin”, Atmosphere Environment, Vol. 24A, (1990) 627.
[TAG] T. Taguchi, R. Kato and S. Akita, “Lead Free Interfacial Structures and Their Relationship to Au Plating”, IEEE Electronic Components and Technology Conference, (2001) 675-680.
[TAK] T. Takemoto, R. M. Latanision, T. W. Eagar and A. Matsunawa, “Electrochemical Migration Tests of Solder Alloys in Pure Water”, Corrosion Science, Vol. 39, No. 8, (1997) 1415-1430.
[TUR] L. J. Turbini, J. A. Jachim, G.B. Freeman and J. F. Lane, “Charaterizing Water Soluble Fluxes: Surface Insulation Resistance vs Electrochemical migration”, IEEE Electronics Manufacturing Technology Symposium, (1992) 80-84
[VAU] B. K. Vaughen, J. A. Roth and J. J. Steppan, “Electrolytic Copper Migration in Accelerated Tests – 1. Polyethylene Glycol-400 Doped with Ammonium Perchlorate”, Journal of the Electrochemical Society, Vol. 135, No. 8, (1988) 2027-2033.
[WEI] 魏大華(D. H. Wei), “銅導線上鍍鎳或錫對遷移性之影響及鍍金之鎳/銅銲墊與Sn-3.5Ag BGA銲料迴銲之金脆研究”, 國立中央大學機械工程學系碩士論文,指導教授:林景崎 博士 (2001)。
[YEU] F. Yeung and Y. C. Chan, “Electrical Failure of Multiplayer Ceramic Capacitors Caused by High Temperature and High Humidity Environment”, Electronic Components and Technology Conference, 1994 Proceedings., 44th, (1994) 847-853.
[ZEN] K. Zeng and K. N. Tu, “Six Cases of Reliability Study of Pb-Free Solder Joints in Electronic Packaging Technology”, Materials Science and Engineering: R: Reports, Vol. 38, (2002) 55-105.
指導教授 林景崎(Jing-Chie Lin) 審核日期 2003-7-8
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