流體黏度對旋塗減量之影響

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姓名

楊正斌(Cheng-Pin Yang) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

流體黏度對旋塗減量之影響

相關論文

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★ 熱氣泡式噴墨塗佈	★ 注液模式對旋轉塗佈之影響
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摘要(中)

摘要
現今科技的不斷發展，使得半導體工業方面的製程也不斷的改進，以往使用在8吋以下晶圓的旋塗均是由中心點注入流體，達到塗佈的目的，但隨晶圓面積加大所需的流體原料相對也須增加，如此將造成原料大量浪費增加成本，且將會造成環境污染。在本實驗中採用兩種不同，第一部分為靜置後旋轉(Release)塗佈模式，第二部份為移動注液(Mobile Injection)塗佈模式，經由實驗後發現在使用黏度較高的流體時，採用第一種方式將需要更多的原料使晶圓表面塗滿，因此，我們需要不同的旋轉塗佈模式來改進這些缺點。實驗的第二部分為在旋轉塗佈時改變注入流體的噴嘴的位置，不同於以往在中心點位置注入，我們改變噴嘴的位置，在塗佈過程的初始階段，晶圓利用低轉速旋轉並移動噴嘴使之從中心向外移動，產生螺旋紋的原料，再經由加速使流體向外擴張並均勻的塗佈於晶圓表面，在實驗中我們改變晶圓轉速、噴嘴移動速度及注液速率獲得最佳的塗佈模式，如此將可節省許多原料浪費，並進一步提供半導體業界參考。

關鍵字(中)

★ 靜置後旋塗
★ 螺旋紋
★ 旋轉塗佈

關鍵字(英)

★ spiral
★ spin coating

論文目次

目錄
摘要..... I
致謝..... III
目錄..... IIII
表目錄... V
圖目錄... VI
符號說明表........ XI
第一章緒論....... 1
1-1 前言....... 1
1-2 文獻回顧... 2
1-2.1 旋轉塗佈之相關文獻回顧.... 2
1-2.2 風剪效應相關文獻回顧...... 5
1-2.3 不穩定手指狀流之相關文獻回顧........7
第二章實驗設備與方法...... 11
2-1 注液系統簡介.......... 11
2-2 旋塗轉速控制系統...... 12
2-3 影像擷取系統.......... 14
2-4 實驗方法...............15
第三章結果與討論..........18
3-1 靜置後旋轉對旋塗液模擴展之影響...........18
3-1.1 不穩定手指狀流的生成...... 18
3-1.2 科氏力對不穩定手指狀流的影響....... 19
3-1.3 靜置後旋轉液膜擴展情形.....21
3-2 螺旋波紋塗佈模式對旋轉塗佈的影響........ 23
3-2.1 螺旋波紋塗佈模式參數的決定......... 23
3-2.2 使用不同黏度的矽油測試螺旋波紋塗佈模式是
否可行......... 25
第四章結論...... 28
參考文獻.......... 31
附表..... 38
附圖..... 39

參考文獻

參考文獻
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指導教授

周復初(Fu-Chu Chou)

審核日期

2003-7-8

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