微熱點與微溫度感測器製作

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姓名

黃忠賢(Chung-Hsien Huang) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

微熱點與微溫度感測器製作
(Micro Hot Spot and Micro Temperature Sensor Manufacturing Process.)

相關論文

★ 化學機械研磨流場模擬實驗研究	★ 變轉速之旋轉塗佈實驗研究
★ 微小熱點之主動式冷卻	★ 大尺寸晶圓厚膜塗佈
★ 科氏力與預塗薄膜對旋轉塗佈之影響	★ 微液滴對微熱點之冷卻
★ 大尺寸晶圓之化學機械研磨實驗研究	★ 液晶顯示器旋轉塗佈研究
★ 流體黏度對旋塗減量之影響	★ 高溫蓄熱器理論模擬
★ 熱氣泡式噴墨塗佈	★ 注液模式對旋轉塗佈之影響
★ 磁流體旋塗不穩定之研究	★ TFT-LCD狹縫式塗佈研究
★ 彩色濾光片噴塗研究	★ 科氏力對不穩定手指狀之影響及光阻減量研究

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至系統瀏覽論文 ( 永不開放)

摘要(中)

微小化是現今微光機電系統的趨勢，然而隨著尺寸越來越小，其散熱之問題亦相形重要之。本實驗室已完成微液滴主動冷卻微熱點的方式，即利用冷卻介質之相變化，直接帶走微熱點上的熱而達到冷卻的目的，以期能應用在高效能的微小光機電元件之冷卻上。本實驗即是接續積體化的步驟，利用微機電的技術製作微感測器以及微熱點，本實驗以鉑作為加熱以及溫度感測的材料，因為鉑的電阻-溫度曲線幾乎為線性，且具有穩定不易氧化的金屬特性。實驗之結果顯示以微機電系統技術所製作出來的微感測器，確實可以達到溫度感測與微熱點模擬的功用，並且在製程上所做的結構改進，亦可確實的達到補強的作用。

關鍵字(中)

★ 微機電系統
★ 微系統
★ 微機電

關鍵字(英)

★ micro system
★ microelectromechanical systems
★ MEMS

論文目次

Ⅰ 摘要…………………………………………………………………………Ⅰ
Ⅱ 目錄…………………………………………………………………………Ⅱ
Ⅲ 表目錄………………………………………………………………………Ⅴ
Ⅳ 圖目錄………………………………………………………………………Ⅵ
第一章緒論……………………………………………………………………1
1-1前言…………………………………………………………………………1
1-2研究動機……………………………………………………………………2
1-3文獻回顧……………………………………………………………………4
1-3-1 微尺度熱傳研究………………………………………………………4
1-3-2 液滴撞擊之研究………………………………………………………6
1-3-3 微感測器研究…………………………………………………………9
1-3-3 A. 熱阻式溫度感測器…………………………………………………9
1-3-3 B. 熱電式溫度感測器………………………………………………10
1-3-3 C. 半導體式溫度感測器……………………………………………11
1-3-3 D. 光學溫度感測器…………………………………………………12
第二章實驗設備及方法……………………………………………………13
2-1實驗設備…………………………………………………………………13
2-1-1電漿輔助化學氣相沈積系統…………………………………………13
2-1-2電子槍蒸鍍系統………………………………………………………14
2-1-3 電子槍及熱蒸鍍系統…………………………………………………15
2-1-4 高密度電漿蝕刻系統…………………………………………………16
2-1-5 曝光機…………………………………………………………………18
2-1-6 紫外光臭氧清洗機……………………………………………………19
2-1-7 表面輪廓測量儀………………………………………………………20
2-1-8 光學顯微鏡……………………………………………………………21
2-1-9測試系統 ………………………………………………………………21
2-2實驗方法……………………………………………………………………22
2-2-1 晶片溫度感測器尺寸之設計…………………………………………22
2-2-2 晶片結構設計…………………………………………………………22
2-2-3 微感測器製程規劃……………………………………………………23
2-3實驗分析……………………………………………………………………26
2-3-1加熱與溫度感測器材料的選擇………………………………26
2-3-2 晶片熱傳模型…………………………………………………27
2-3-3 熱阻與溫度關係………………………………………………29
2-3-4 王水簡介………………………………………………………30
第三章結果與討論…………………………………………………32
3-1製程結果與討論……………………………………………………32
3-1-1 白金薄膜的濕式蝕刻…………………………………………32
3-1-2 鈦蝕刻的影響…………………………………………………34
3-1-3 金屬舉離法……………………………………………………35
3-1-4鋁導線的蝕刻…………………………………………………36
3-1-5氮化矽的蝕刻…………………………………………………37
3-1-6矽基材非等向性蝕刻正面掏空………………………………38
3-1-7導線接點開啟…………………………………………………40
3-2實驗測試……………………………………………………………41
3-2-1微感測器測試…………………………………………………41
3-2-2微熱點測試……………………………………………………42
第四章總結……………………………………………………………44
A.文獻回顧……………………………………………………………46
B.附表…………………………………………………………………50
C.附圖…………………………………………………………………61

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指導教授

周復初(Fu-Chu Chou)

審核日期

2003-7-7

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