參考文獻 |
1. I. Anderson, “Sn-Ag-Cu: A lead-free solder for board applications”, in Proc. NEPCON West 96, 27-29 Feb. 1996, Anaheim, CA, USA, Reed Exhibition, Norwalk, CT, USA, 2, p. 882, 1996.
2. C. M. Miller, I. E. Anderson, and J. F. Smith, “ A viable Sn-Pb solder substitute: Sn-Ag-Cu”, Journal of Electronic Materials, 23, p. 595, 1994.
3. W. G. Bader, “Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a molten Sn-Lead solder”, Welding Journal Research suppliment, 48, p. 551s, 1969.
4. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly 5 , 2000.
5. I. E. Anderson, T. E. Bloomer, R. L. Terpstra, J. C. Foley, B. A. Cook, and J. L. Harringa, Advanced Brazing and Soldering Technologies, 2000.
6. W. T. Chen, C. E. Ho, and C. R. Kao, “Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders,” Journal of Materials Research, 17, p. 263, 2002.
7. C. E. Ho, Y. L. Lin, and C. R. Kao, “Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni,” Chemistry of Materials, 14, p. 949, 2002.
8. C. E. Ho, R. Y. Tsai, Y. L. Lin, and C. R. Kao, “Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni,” Journal of Electronic Materials, 31, p. 548, 2002.
9. L. C. Shiau, C. E. Ho, and C. R. Kao, “Reactions between SnAgCu lead-free solders and Au/Ni surface finish in advanced electronic packages,” Soldering and Surface Mount Technology, 14, p. 25, 2002.
10. Y. L. Lin, W. C. Luo, Y. H. Lin, C. E. Ho, and C. R. Kao, “Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints,” Journal of Electronic Materials, 33, p. 1092, 2004.
11. C. E. Ho, L. C. Shiau, and C. R. Kao, “Inhibiting the formation of (Au1–xNix)Sn4 and reducing the consumption of Ni metallization in solder joints,” Journal of Electronic Materials, 31, p. 1264, 2002.
12. C. M. Liu, C. E. Ho, W. T. Chen, and C. R. Kao, “Reflow soldering and isothermal solid-State aging of Sn-Ag eutectic solder on Au/Ni surface finish,” Journal of Electronic Materials, 30, p. 1152, 2001.
13. C. E. Ho, R.Zheng, G. L. Luo, A. H. Lin, and C. R. Kao, “ Formation and resettlement of (AuxNi1–x)Sn4 in solder joints of Ball-Grid-Array packages with the Au/Ni surface finish,” Journal of Electronic Materials, 29, p. 1175, 2000.
14. A. M. Minor and J. W. Morris, Jr., “Inhibiting growth of the Au0.5Ni0.5Sn4 Intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization,” Journal of Electronic Materials, 29, p. 1170, 2000.
15. E. Gebhardt, G. Petzow, Z. Metallkde, 50, p.597, 1959.
16. K. W. Moon, W. J. Boettinger, U. R. Kattner, F. S. Biancaniello, and C. A. Handwerker, “Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys,” Journal of Electronic Materials, 29, p. 1122, 2000.
17. JEIDA. “Challenges and efforts toward commercialization of lead-free -Solder road map 2000 for commercialization of lead-free solder”, ver. 1.3, July 2000.
18. http://www.nemi.org/
19. T. M. Korhonen, P. Su, S. J. Hong, M. A. Korhonen, and C. Y. Li, “Reactions of lead-free solders and CuNi metallizations,” Journal of Electronic Materials, 29, p. 1194, 2000.
20. Minna Arra, Dongkai Shangguan, Eero Ristolainen, and Toivo Lepisto, “Solder balling of lead-free solder pastes,” Journal of Electronic Materials, 31, p. 1130, 2002.
21. C. S. Chi, H. S. Chang, K. C. Hsieh, and C. L. Chung, “Interfacial microstructure of Pb-free and Pb-Sn solder balls in the Ball-Grid-Array package,” Journal of Electronic Materials, 31, p. 1203, 2002.
22. W. K. Choi, S. K. Kang, and D. Y. Shih, “A study of the solder volume on the interfacial reactions in solder joint using the differential scanning calorimetry technique,” Journal of Electronic Materials, 31, p. 1283, 2002.
23. S. Y. Hwang, J. W. Lee, and Z. H. Lee, “Microstructure of a lea-free composite solder produced by an in-situ process,” Journal of Electronic Materials, 31, p. 1304, 2002.
24. C. Y. Liu, and S. J. Wang, “Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization,” Journal of Electronic Materials, 32, p. L1, 2003.
25. Y. D. Jeon, Sabine Nieland, Andreas Ostmann, Herbert Reichl, and K. W. Paik, “A study of interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy,” Journal of Electronic Materials, 32, p. 548, 2003.
26. K.Y. Lee, and M. Li, “Interfacial microstructure evolution in Pb-free solder systems,” Journal of Electronic Materials, 32, p. 906, 2003.
27. J. Y. Park, C. U. Kim, Ted Carper, and Viswanadham Puligandla, “Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys,” Journal of Electronic Materials, 32, p. 1297, 2003.
28. J. Y. Park, Rajendra Kabade, C. U. Kim, Ted Carper, Steven Dunford, and Viswanadham Puligandla, “Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8Ag-0.7Cu Pb-free solder alloy,” Journal of Electronic Materials, 32, p. 1474, 2003.
29. C. S. Hung, J. G. Duh, and Y. M. Chen, “Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip chip package,” Journal of Electronic Materials, 32, p. 1509, 2003.
30. P. L. Wu, M. K. Hung, C. P. Lee, and S. R. Tzan, “Effects of different printed-circuit-board surface finishes formation and growth of intermetallics at thermomechanically fatigues, small outline J leads/Sn-Ag-Cu interfaces,” Journal of Electronic Materials, 33, p. 157, 2004.
31. M. D. Cheng, S. Y. Chang, S. F. Yen, and T. H. Chuang, “Intermetallic compounds formed during the reflow and aging Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages,” Journal of Electronic Materials, 33, p. 171, 2004.
32. G. Ghosh, “Reactive interdiffusion of lead-free solders and Ti/Ni/Ag thin film metallizations,” Journal of Electronic Materials, 33, p. 229, 2004.
33. C. S. Hung, G. Y. Jang, and J. D. Duh, “Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps,” Journal of Electronic Materials, 33, p. 283, 2004.
34. Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, and Masahisa Otsuka, “Effect of silver content of shear fatigue properties of Sn-Ag-Cu flip-chip interconnects;” Journal of Electronic Materials, 33, p. 321, 2004.
35. Zhigang, Chen, Yaowu Shi, and Zhidong Xia, “Constitutive relations creep on SnAgCuRE lead-free solder joints,” Journal of Electronic Materials, 33, p. 964, 2004.
36. Paul T. Vianco, Jerome A. Rejent, and Paul F. Hlava, “Solid state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder,” Journal of Electronic Materials, 33, p. 991, 2004.
37. S. W. Chen, and C. A. Chang, “Phase equilibria of the Sn-Ag-Cu-Ni quaternary System at the Sn-rich corner,” Journal of Electronic Materials, 33, p. 1071, 2004.
38. G. Ghosh, “Interfacial reactions between multicomponent of lead-free solders and Ag, Cu, Ni, and Pd substrates,” Journal of Electronic Materials, 33, p. 1080, 2004.
39. G. Y. Jang, J. Y. Lee, and J. G. Duh, “The nanoindentation characteristics of Cu6Sn5, Cu3Sn and Ni3Sn4 intermetallic compounds in the solder bump,” Journal of Electronic Materials, 33, p. 1103, 2004.
40. S. W. Kim, J. W. Yoon, and S. B. Jung, “Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization,” Journal of Electronic Materials, 33, p. 1182, 2004.
41. Snugovsky, C. Cermignani, D. D. Perovic, and J. W. Rutter, “Solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys,” Journal of Electronic Materials, 33, p. 1313, 2004.
42. Qian Zhang, Abhijit Dasgupta, and Peter Haswell, “Partitioned viscoplastic-constitutive of Pb-free Sn3.9Ag0.6Cu solder,” Journal of Electronic Materials, 33, p. 1338, 2004.
43. Paul T. Vianco, Jerome A. Rejent, and Alice. C. Kilgo, “Creep behavior of ternary 95.5Sn-3.9Ag-0.6Cu-part I: As-cast condition,” Journal of Electronic Materials, 33, p. 1389, 2004.
44. S. T. Kao, J. G Duh, “Effects of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying,” Journal of Electronic Materials, 33, p. 1445, 2004.
45. Ahmed Sharif, and Y. C. Chan, “Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering,” Journal of Electronic Materials, 34, p. 46, 2005.
46. Q. L. Zeng, Z. G. Wang, A. P. Xian, and J. K. Shang, “Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure,” Journal of Electronic Materials, 34, p. 62, 2005.
47. Y. D. Jeon, K. W. Paik, Adreas Ostmann, and Herbert Reichi, “Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy,” Journal of Electronic Materials, 34, p. 80, 2005.
48. G. Y. Jang, J. G. Duh, “The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu under bump metallization,” Journal of Electronic Materials, 34, p. 68, 2005.
49. J. Y. Lee, J. H. Kim, and C. D. Yoo, “Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding,” Journal of Electronic Materials, 34, p. 96, 2005.
50. Andreas R. Fix, Gabriel A. Lopez, Ingo Brauer, Wolfgang Nuchter, and eric Mittemeijer, “Microstructural development of Sn-Ag-Cu solder joint,” Journal of Electronic Materials, 34, p. 137, 2005.
51. M. N. Islam, Ahmed Sharif, and Y. C. Chan, “Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging,” Journal of Electronic Materials, 34, p. 143, 2005.
52. S. W. Shin, Jin. Yu, “Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints,” Journal of Electronic Materials, 34, p. 188, 2005.
53. Q. Xiao, and William D. Armstrong, “Tensile creep and microstructural characterization of Bulk Sn3.9Ag0.6Cu lead-free solder,” Journal of Electronic Materials, 34, p. 196, 2005.
54. Edwin P. Lopez, Paul T. Vianco, and Jerome A. Rejent, “Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substrates,” Journal of Electronic Materials, 34, p. 299, 2005.
55. T. Ogawa, R. Kaga, and T. Ohsawa, “Microstructure and mechanical properties predicted by indentation testing of lead-free solders,” Journal of Electronic Materials, 34, p. 311, 2005.
56. Q. Xiao, N. Y. Luu, and William D. Armstrong, “The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder,” Journal of Electronic Materials, 34, p. 617, 2005.
57. M. N. Islam, and Y. C. Chan, “Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization,” Journal of Electronic Materials, 34, p. 662, 2005.
58. Q. Xiao, N. Y. Luu, and William D. Armstrong, “Anomalously high tensile creep rates from thin cast Sn3.9Ag0.6Cu lead-free solder ” Journal of Electronic Materials, 34, p. 1065, 2005.
59. S. T. Kao, and J. G. Duh, “Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization,” Journal of Electronic Materials, 34, p. 1129, 2005.
60. D. Q. Yu, C. M. Wu, D. P. He, N. Zhao, L. Wang, and J. K. Lai, “Effect of Cu content in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface,” Journal of Materials Research, 20, p. 2205, 2005.
61. T. Laurila, V. Vuorinen, and J. K. Kivilahti, “Interfacial reactions between lead-free solders and common base materials,” Materials Science and Engineering Review, 49, p. 1, 2005
62. C. H. Lin, S. W. Chen, and C. H. W, “Phase equilibria and solidification properties of Sn-Cu-Ni alloys,” Journal of Materials Research, 31, p. 907, 2002.
63. K. Zeng, and K. N. Tu, “Siz cases of reliability study of Pb-free solder joints in electronic packaging technology,” Materials Science and Engineering Review, 38, p. 55, 2005.
64. T. T. Mattila, V. Vuorinrn, and J. K. Kivilahti, “Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections,” Journal of Materials Research, 19, p. 3214, 2004.
65. P. C. Shih, and K. L. Lin, “Interfacial bonding behavior with introduction of Sn–Zn–Bi paste to Sn–Ag–Cu ball grid array package during multiple reflows,” Journal of Materials Research, 20, p. 219, 2005.
66. C. P. Hung, C. Chen, C. Y. Liu, S. S. Lin, and K. H. Chen, “Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization,” Journal of Materials Research, 20, p. 2272, 2005.
67. P. C. Shih, and K. L. Lin, “Effect of microstructural evolution on electrical property of the Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste,” Journal of Materials Research, 20, p. 2854, 2005.
68. K. N. Tu, G. M. Gusak, and M. Li, “Physics and materials challenges for lead-free solders,” Journal of Applied Physics, 93, p. 1335, 2003.
69. C. E. Ho, Y. W. Lin, S. C. Yang and C. R. Kao, “Effects of limited Cu supply on soldering reactions between SnAgCu and Ni,” Journal of Electronic Materials, 35, p. 1017, 2006.
70. S. W. Chen, and C. H. Wang, “Interfacial reactions of Sn-Cu/Ni couples at 250°C,” Journal of Materials Research, 21, p. 2270, 2006. |