參考文獻 |
參考文獻
[1] R.F.Pierret, “Semiconductor Device Fundamentals”,Addsion Wesley,
1996.
[2] Guillermo Gonozolez, “Microwave transistor amplifiers analysis and design”, Prentice-Hall, 1984.
[3] T.Yoshimasu, M. Akagi, N. Tanba, and S. Hara, “A Low Distortion and High Efficiency HBT MMIC Power Amplifier with A Novel Linearization Technique for Pi/4 DQPRK Modulation,” Gallium Arsenide Intergrated Circuit (GaAs IC) Symposium, pp.45, 1997.
[4] Y. S. Noh, T. W. Lee, C.S. Park, “Linearized high efficient HBT power amplifier modulate for L-band application,” Gallium Arsenide Intergrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest, pp.197, 2001.
[5] B. Razavi, “Design of Analog CMOS Integrated Circuits”, Mcgraw Hill, 1996.
[6] G. Gonzalez, “Microwave transistor Amplifier Analysis and Design”, Prentice Hall, 1994, p209.
[7] G.D Vendelin, A.M. Pavio, U.L. Rohade, “Microwave Circuit Design Using Linear and Nonlinear Techniques”, Wiley Interscience, 1990, Chapter 6.
[8] B. Razavi, “RF Microelectronics”, Prentice Hall, 1997.
[9] Gunhee Han and Edgar Sanchez-Sinencio, “CMOS Transconductance Multipliers: A Tutorial”, IEEE Trans. Circuits and System, Part II,vol. 45, pp.1550-1562, Dec.1998.
[10] T.H.Lee, The Design of Radio Frequency Integrated Circuit.
[11] B. Gilbert, “A precision for-quadrant multiplier with subnanosecond response”, IEEE J. Solid-State Circuit, vol. SC-3, pp.353-365, Dec. 1968.
[12] J. Chang, “An Integrated 900MHz Spread-Spectrum Wireless Receiver in 1-um CMOS and a Suspended Inductor Technique”, UCLA Ph.D disseration.
[13] S. Wu and B. Razavi, “A 900-MHz/1.8GHz CMOS Receiver for Dual-Band Application”, IEEE J. Solid-State Circuits, vol.33, pp.2178-2185, Dec. 1998.
[14] A. Rofougaran, James Y. C. Chang, M. Rofougaran, and A. A. Abidi, “A 1GHz CMOS RF Front-end IC for a Direct-conversion Wireless Receiver”, IEEE J. Solid State, vol. 31, pp.880-889, July. 1996.
[15] A. Magill, “CSP Present and Future” , International Symposium on Advanced Packaging Materials, 1999.
[16] “BCC(Bump Chip Carrier) technology”, technical report, R&D Engineering Div., Advanced Semiconductor Engineering, Inc.
[17] “Bump chip carrier technical brief” , www.fujitsumicro.com, Feb. 1999.
[18] T.S. Horng, S.M. Wu, C. Shih, “Electrical modeling of RFIC packages up to 12 GHz” , Proc 49th Electronic Components and Technology Conf., pp867-712, 1999. |