博碩士論文 91323009 詳細資訊




以作者查詢圖書館館藏 以作者查詢臺灣博碩士 以作者查詢全國書目 勘誤回報 、線上人數:9 、訪客IP:3.230.1.126
姓名 石宗甫(Zong-Fu Shi)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 TFT-LCD螢幕掉落破壞分析驗證與包裝系統設計
(Simulation and Validation of Drop Failure and Package System for TFT-LCD Monitors)
相關論文
★ TFT-LCD前框卡勾設計之衝擊模擬分析與驗證研究★ TFT-LCD 導光板衝擊模擬分析及驗證研究
★ 數位機上盒掉落模擬分析及驗證研究★ 旋轉機械狀態監測-以傳動系統測試平台為例
★ 發射室空腔模態分析在噪音控制之應用暨結構聲輻射效能探討★ 時頻分析於機械動態訊號之應用
★ VKF階次追蹤之探討與應用★ 火箭發射多通道主動噪音控制暨三種線上鑑別方式
★ TFT-LCD衝擊模擬分析及驗證研究★ TFT-LCD掉落模擬分析及驗證研究
★ 主動式火箭發射噪音控制使用可變因子演算法★ 醫學/動態訊號處理於ECG之應用
★ 光碟機之動態研究與適應性尋軌誤差改善★ 具新型菲涅爾透鏡之超音波微噴墨器分析與設計
★ 醫用近紅外光光電量測系統之設計與驗証★ 車用DVD光碟機之適應性聚焦伺服控制實現與應用
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 ( 永不開放)
摘要(中) 摘要
TFT-LCD monitor 是具有高精度、高單價之產品,而產品在物流運送過程中經常會遭受到振動、衝擊、掉落等機械力的作用,進而使產品造成破壞,所以產品在物流過程中必須包覆緩衝包裝材料加以保護。本研究延續實驗室所進行產品掉落測試,執行包裝系統的設計和修改,進而滿足規範的要求,而且能減少產品空間和包裝材料的使用,達到降低成本的目的。
本研究主要分成產品特性測試和包裝設計測試兩部分,依循先前已知monitor的face_6無法通過IEC法規的規定,故對於face_6進行包裝系統的改善;首先量測產品的容許速度變化與容許加速度,了解其破壞範圍。並利用LS-DYNA進行模擬,分析其破壞的原因。而在包裝設計階段,利用容許速度變化判斷產品是否需要包裝;在這前提下利用容許加速度值設計包裝系統的規格,前期設計的四個包裝系統先進行掉落測試的模擬,判斷是否滿足容許加速度,而滿足的包裝系統B、C、D在進行實際掉落測試;其中包裝系統D滿足IEC規範的掉落測試,在比較模擬的結果也發現只有包裝系統D沒有破壞的情形產生,所以包裝系統D滿足IEC規範。
本文提供包裝設計的方法,輔以LS-DYNA有限元素軟體進行產品破壞原因的分析與包裝系統掉落測試的模擬,可對產品的破壞進行設計的修正及改善,然後再進行包裝設計模擬,以減少開發設計的時間及成本,提昇產品的競爭力。
摘要(英) TFT-LCD monitors are manufactured precisely and so far relatively expensive. During transportation, the products are often subjected to unintentional drops, vehicle vibration, shock inputs, and compression loads, etc. These mechanical forces may cause products damages or losing functions. To prevent shock damages, products are usually protected by package systems. The study based on previous work performs the package-system design and modification. The proposed new package system is satisfied for the IEC regulations. Furthermore, the amount of material used by the package system is less than that of original design.
The study includes both the characterizing the damage boundary curve and modifying the package system of the test TFT-LCD monitor. Based on previous work, it is noted that the face_6 drop test cannot fulfill the IEC regulations. Therefore, the package system of the TFT-LCD monitor needs further modification. First, the shock characteristics of the product are determined by conducting the damage boundary test. It includes both critical velocity change and critical acceleration. Moreover, the causes of damage are also numerically analyzed by using the LS-DYNA package. The simulations of drop test for modified package systems are performed. Then, The numerical analysis is validated by practical drop test. After comparison between the drop test and numerical simulation, the package system satisfying the IEC regulations can be achieved.
In the study, the procedures about designing a cushioning package system are provided. The finite element analysis assists in exploring the causes of the damage. The numerical analysis is validated by practical drop test. These tasks help to perform the design or modification of both the TFT-LCD monitor and package system. They can shorten the lead-time of product design, and improve shock resistance as well.
關鍵字(中) ★ 掉落測試
★ 破壞邊界曲線
★ 衝擊測試
關鍵字(英) ★ damage boundary curve
★ drop test
★ shock test
論文目次 Abstract A
Contents I
List of Figures III
List of Tables VI
Chapter 1 Introduction 1
1.1 Motivation 1
1.2 Literature Review 2
1.3 Outline of the Thesis 3
Chapter2 Theoretical Basis 5
2.1 Package Cushioning Design 5
2.1.1 Purpose 5
2.1.2 Steps of Package system design 5
2.1.3 Summary 21
2.2 Theory of Shock and Drop 22
2.3 Implicit Finite Element Method 27
Chapter 3 Damage Boundary Curve Test and Simulation 29
3.1 Instruments 30
3.1.1 Shock Machine 30
3.1.2 Measuring System 33
3.2 Test Procedure 34
3.2.1 Step Velocity Test 34
3.2.1 Step Acceleration Test 38
3.3 Results of the Damage Boundary test 38
3.3.1 Test Results of Critical Velocity Change 39
3.3.2 Test results of Critical Acceleration 41
3.3.3 Damage Boundary Curve 42
3.4 Simulation 44
3.4.1 Finite Element Model 44
3.4.2 Material Properties and Boundary Conditions 45
3.5 Simulation Results 48
3.5.1 Comparisons 48
3.6 Discussions on Structural Damage 50
Chapter4 Drop Simulation and Validation of Package Systems 58
4.1 Drop Simulation of Package Systems 58
4.1.1 The Finite Element Model 58
4.1.2 Material Properties and Boundary Conditions 58
4.1.3 Sample 60
4.2 Drop Test of Package Systems 63
4.2.1 Instruments 63
4.2.2 Sample 64
4.2.3 Drop tests 67
4.3 Comparisons of Simulation and Test 67
4.3.1 Comparisons 68
4.3.2 Results 75
4.4 Comparisons with Package Systems 80
Chapter5 Conclusions 83
Bibliography 85
參考文獻 [1] 陳伯群, 2003, “TFT-LCD 掉落模擬分析及驗證研究,” 國立中央大學碩士論文.
[2] S.S. Choi, E. Kang, D.C. Kim, 1998, “Drop Impact Simulation for Design of TFT-LCD,” 5th International LS-DYNA Users Conference.
[3] S.S. Choi, J.G. Lee, 2002, “Structural Design Review of LCD-TV Module by Impact Analysis,” 4th European LS-DYNA Users Conference.
[4] C.T. Lim, Y.M. Teo, V.P.W. Shim, 2002, “Numerical Simulation of the Drop Impact Response of a Portable Electronic Product,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 3, pp. 478-485.
[5] D.V. Caletka, R.N. Caldwell, J.T. Vogelmann, 1990, “Damage Boundary Curves: A Computational (FEM) Approach,” Transactions of ASME, Journal of Electronic Packaging, Vol. 112, No. 3, Sep, pp. 198-203.
[6] K. Igarashi, 1998, “Packaging and Mechanical Technologies for Mobile Notebook PCs,” FUJITSU Sci. Tech. J., 34, 1, pp. 18-29.
[7] K.H. Low et al., 2001, “Initial Study on the Drop-Impact Behavior of Mini Hi-Fi Audio Products,” Advances in Engineering Software, 32, pp. 683-693.
[8] K.H. Low, 2003, “Drop-Impact Cushioning Effect of Electronics Products Formed by Plates,” Advances in Engineering Software, 34, pp. 31-50.
[9] K.H. Low et al., 2003, “A Virtual Boundary Model of a Quick Drop-Impact Analysis of PCB in Electronic Products,” IEEE Electronics Packaging Technology Conference, pp. 275-281.
[10] K.H. Low et al., 2004, “Initial Global-Local Analysis for Drop-Impact Effect Study of TV Products,” Advances in Engineering Software, 35, pp. 179-190.
[11] 唐瑢書, 2002, “壓出型發泡聚乙烯緩衝包材之設計: 落下實驗及數值模擬,” 國立台灣大學碩士論文.
[12] MIL-HDBK-304C, 1997, “Department of Defense Handbook: Package Cushioning Design,” Department of Defense in United States of America.
[13] Dale Root, 1992, “6-Step Product/ Package Development Method,” Lansmont Corporation, Monterey, CA.
[14] W. I. Kipp, 2000, “Developments in Testing Products for Distribution,” Packaging Technology and Science, 13,pp. 89-98.
[15] E. Suhir, 1994, “Dynamic Response of a Rectangular Plate to a Shock Load, With Application to Portable Electronic Products,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 17, No. 3, pp. 449-460.
[16] T. Belytscko , W. K. Liu, B. Moran, 2000, “Nonlinear Finite Elements for Continua and Structures,” New York, John Willey & Sons.
[17] ASTM D3332-77, 1988, “Standard Test Method for Mechanical-Shock Fragility of Products, Using Shock Machines,” American Society for Testing and Materials, Philadelphia, Pennsylvania.
[18] 徐灝, 1996, “機械設計手冊:第四卷,” 建宏出版社.
指導教授 潘敏俊(Min-chun PAN) 審核日期 2004-9-23
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明