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姓名 張庭綱(Ting-Kang Chang)  查詢紙本館藏   畢業系所 機械工程學系
論文名稱 微陽極導引電鍍法製作微銅柱及銅柵欄之研究
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摘要(中) 本研究採用微陽極導引專利電鍍法來製備直徑約50 微米之銅
柱。在硫酸銅鍍液中(硫酸銅200g/l,硫酸65g/l 及35g/l, 鹽酸1ml),
控制微陽極(白金線直徑125 微米)以間歇運動自陰極(1 公分見方之鍍
銅矽晶片)表面向上移動10 微米,在適當偏壓下進行微電鍍研究。微
銅柱之表面形貌以掃描式電子顯微鏡進行觀察,結果發現: 銅柱形貌
受兩極偏壓大小影響極大。偏壓為2.6V 時,銅柱的表面平滑柱徑平
均; 偏壓為3.2V 時,銅柱表面凹凸不平外觀如珊瑚狀。兩極間距越小
(1 微米),微銅柱柱徑較小表面較不平整會有節狀出現,兩極間距越
大(40 微米),微銅柱表面較平整但柱徑較大。固定兩電極間距200μ
m 下,利用電化學交流組抗頻譜儀測試來探討微電鍍行為,發現當兩
極偏壓由0.615V(OCP)升至0.773V 時,此偏壓範圍為活性極化,此
時銅已還開始析出,而0.773 至1.1V 為銅之擴散極化,若偏壓繼續
提高超過1.1V,電容與極化電阻值減小,銅與氫氣析出在銅基材上。
實用上銅柱析鍍之電位選擇從2.6V 至3.2V,此乃因小於2.6V 銅柱
析渡速率太慢,若兩極偏壓高於3.2V,則生成之銅柱外貌粗糙且無
法掌控外形,因此不符實際需要。本研究依據實驗結果歸納出微銅柱
製作之最佳條件,並提出微電鍍之反應機制,並應用微陽極導引電鍍
來製作銅柵欄。
摘要(英) Micrometer copper columns (roughly 50µm in diameter) were fabricated by a
patented process named as micro anode guided electroplating (MAGE). In this
process, a micro anode (made of Pt wire 125µm in diameter) was controlled to depart
from the cathode intermittently (1×1 cm2 silicon coated with 1.8µm copper) under
optimed biases to fabricate copper micro-columns in an acidic CuSO4 bath(CuSO4.
5H2O 200g/l,H2SO4 65g/l and 35g/l, HCl 1ml). The surface morphologies of the
copper micro columns, examined by scanning electron microscopy (SEM), depended
on the bias applied between the electrodes. The microcolumn obtained at a bias of
2.6V, displayed uniform diameter and smooth surface. In contrast, the micro column
fabricated at a bias of 3.2V was coralline and displayed rough surface. The sem
morphology of microcolumns was also influenced by the gap in each intermittent step.
A short gap (e.g. 1µm) led to nodose microcolumn with rough surface but a long gap
(e.g. 40µm) led to uniform microcolumn with smooth surface. The nodose
microcolumn exhibited a smaller diameter (1µm) than the uniform one (40µm).
Electrochemical impedance spectroscopy (EIS) was conducted to explore the MAGE
process. As the bias beyond 0.615V, the copper deposited. The range of bias from
0.615V(ocp) to 0.773V was the activation polarization of copper and 0.773V to 1.1V
was concerntration polarization. As the bias beyond 1.1V, the data of both C and Rp
decreased with increasing the bias, copper and hytroden found to deposition on the
substrate. In this work, practical range of bias was chosen from 2.6 to 3.2V because
the growth rate of the microcolumn was to slow under biases less than 2.6V, and
coralline microcolumn was not acceptable under biases greater than 3.2V. In
comparison with the microcolumns fabricated in various conditions, we obtained the
optimal conditions to attain the qualified copper microcolumns. The mechanism of the
MAGE process is discussed on bias of the EIS study. A row of four copper
micrometer columns was successfully fabricated.
關鍵字(中) ★ 微陽極導引電鍍
★ 微銅柱
★ 銅柵欄
關鍵字(英) ★ copper micro column
★ MAGE
論文目次 摘要I
摘要英文版II
誌謝Ⅲ
目錄Ⅳ
表目錄Ⅴ
圖目錄Ⅵ
壹、簡介1
1.1、研究背景2
1.2、研究動機與目標
貳、文獻回顧與原理學說4
2.1 文獻回顧4
2.1.1 國外發展4
2.1.2 國內發展5
2.2 微陽極導引電鍍法7
2.2.1 局部微電析概說7
2.2.2 運動模式7
2.3 電場與電力線8
2.3.1 庫倫定律8
2.3.2 電場9
2.3.3 電力線10
2.3.4 電位差10
2.3.5 等位面11
2.3.6 電力線與等位面的關係12
2.3.7 導體的電位12
2.4 微電極12
2.4.1 微電極之獨特性13
2.4.2 微電極之限制15
2.4.3 微電極造成的局部微電鍍15
2.5 電鍍原理16
2.5.1 直流電電鍍16
2.5.2 物質移動程序17
2.5.3 電荷交換程序21
2.5.4 電結晶化程序21
2.6 濃度極化現象之影響21
2.7 電化學交流阻抗頻譜分析22
參、實驗與設備27
3.1 實驗之流程圖27
3.2 實驗前準備27
3.3 實驗流程28
3.3.1 微陽極導引電鍍實驗28
3.3.2 兩極偏壓參數之改變實驗29
3.3.3 兩極間間距參數實驗29
3.3.4 微電鍍電化學交流阻抗實驗29
3.3.5 四極式微陽極導引電鍍實驗30
3.4、使用儀器簡介30
3.41 實驗儀器30
3.42 檢測儀器32
肆、結果34
4.1 析鍍偏壓之影響34
4.2 兩極間距之影響39
4.3 電化學交流阻抗頻譜分析42
伍、討論46
5.1 質量傳輸46
5.1.1 兩極偏壓之影響48
5.1.2 兩極間距之影響56
5.2 電化學交流阻抗分析62
5.3 硫酸濃度之影響64
5.4 流體循環之影響65
陸、結論66
柒、未來展望67
捌、參考文獻68
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指導教授 林景崎(J. C. Lin) 審核日期 2004-7-18
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