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姓名 黃建融(Chien-Zong Huang)  查詢紙本館藏   畢業系所 化學工程與材料工程學系
論文名稱 電遷移對銅於液態銲錫中的溶解速率之影響
(The dissolution rate of copper in the molten solder with current stressing)
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摘要(中) 在以往銲錫的電遷移研究中,探討對象都是固態銲錫,而液態銲錫是未被探討的。本實驗利用了微量毛細管設計了一個Cu/Sn/Cu結構,同時探討電遷移對液態、固態無鉛銲錫Sn-3.5Ag中Cu溶解現象的影響。我們利用維氏硬度計在Cu導線上打入marker以計算Cu導線溶解量,此marker與Cu導線頂端距離300 mm。在實驗中發現,試片於240 ℃下,施予電流密度6.3x103 A/cm2,會造成陰極端Cu導線相當嚴重的Cu溶解現象,通電時間達3 hr約有125 mm Cu導線溶解,並於陽極端生成大量IMC;相同的時間與電流密度,於185 ℃通電,陰極端Cu導線卻僅溶解1 mm;而在未通電的情況下,試片於255 ℃反應3 hr,Cu導線溶解約8.5 mm;相同的時間,試片於200 ℃,Cu導線溶解約1 mm;這表示電子流、熱效應對於Cu溶解現象有著交互的影響,本實驗對此現象作深入的探討,此現象有助於flip-chip銲點分析,進而對其毀壞機制的探討。這告訴我們,flip-chip銲點的毀壞,很有可能因電遷移造成銲點局部溶解,進而導致嚴重的Cu溶解現象,最後整個銲點失效。
摘要(英) The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state. In this study, we take the micro capillary to design a Cu/solder/Cu structure. We make the marker on the copper wire with the distance of 300
關鍵字(中) ★ 電遷移
★ 液態銲錫
★ 溶解速率
★ 銅
關鍵字(英) ★ current stressing
★ dissolution ra
★ molten solder
論文目次 目錄
中文摘要................................................................I
英文摘要...............................................................II
目錄..................................................................III
圖目錄.................................................................VI
表目錄..................................................................X
第一章 序論............................................................1
1.1研究背景.............................................................1
1.2實驗目的及規劃.......................................................6
第二章 文獻回顧........................................................7
2.1電遷移理論...........................................................7
2.1.1電遷移之驅動力與通量方程式.........................................7
2.1.2 Blech結構之電遷移機制............................................10
2.1.3 back stress與臨界長度............................................12
2.1.4平均毀壞時間(MTTF)................................................14
2.2銲料中的電遷移現象..................................................15
2.2.1銲料中的電遷移機制................................................15
2.2.2電遷移對界面反應之影響............................................23
2.2.3覆晶銲點之電遷移現象..............................................25
2.2.4覆晶銲點毀壞機制-孔洞生長........................................30
2.2.5覆晶銲點毀壞機制-銅溶解現象......................................33
第三章 實驗方法與步驟.................................................37
3.1試片製作............................................................37
3.1.1將銲錫填入毛細管..................................................37
3.1.2銅導線之前處理....................................................37
3.1.3銅導線與銲錫之接合................................................38
3.2 實驗裝置與條件.....................................................42
3.2.1實驗裝置..........................................................42
3.2.2實驗條件..........................................................44
3.3 試片處理與儀器分析.................................................45
3.3.1試片金相處理......................................................45
3.3.2試片分析..........................................................45
第四章 實驗結果.......................................................47
4.1 Cu/Sn-3.5Ag(液態)/Cu...............................................47
4.1.1通電實驗(240 ℃、6.3×103 A/cm2).................................47
4.1.2未通電實驗(255 ℃)..............................................54
4.1.3銅導線之消耗行為..................................................57
4.2 Cu/Sn-3.5Ag(固態)/Cu...............................................61
4.2.1通電實驗(185 ℃、6.3×103 A/cm2).................................61
4.2.2未通電實驗(200 ℃)..............................................65
4.2.3介金屬之生長行為..................................................67
第五章 討論...........................................................70
5.1 Cu/Sn-3.5Ag(液態)/Cu之探討.........................................70
5.2 Cu/Sn-3.5Ag(固態)/Cu之探討.........................................73
5.3 Cu/Sn-3.5Ag(液態、液態)/Cu之比較...................................75
第六章 結論...........................................................77
6.1電遷移對IMC生長厚度之影響...........................................77
6.2 Cu溶解現象對真實flip-chip銲點之影響................................77
參考文獻...............................................................80
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[王祥文] 王祥文碩士論文,國立中央大學化工所,2002。
[林永河] 林永河碩士論文,國立中央大學化工所,2003。
[魏程昶] 魏程昶碩士論文,國立中央大學化工所,2004。
指導教授 高振宏(C. Robert Kao) 審核日期 2005-6-28
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