| 姓名 |
楊清奇(Ching-chi Yang)
查詢紙本館藏 |
畢業系所 |
機械工程學系在職專班 |
| 論文名稱 |
連接器鍍金厚度之研究
(A Study of Gold Plating on Electrical Connectors)
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| 相關論文 | |
| 檔案 |
 [Endnote RIS 格式]
[Bibtex 格式]
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| 摘要(中) |
工業自動化產品由於產品壽命長，應用環境較惡劣，對於電子連接器的性能及品質要求較3C產業嚴格。表面鍍金的方法經常被用來增加連接器的耐久性及對抗環境的變異性，但近年來黃金價格持續且快速的飊漲，造成連接器的成本受到相當大的影響，嚴重衝擊到最終產品的成本。
鍍金的厚度與連接器的價格成正比，因此鍍金的厚度由60年代未到70年代出所使用的100 μinch，減少到現在的1 μinch以下，以降低連接器的成本。然而鍍金層表面的多孔性卻又與鍍金層的厚度成反比，多孔性會造成鍍金層底下的基材及鍍層受到外界環境的氣體所腐蝕，而使連接器產生接觸不良或訊號中斷的問題。
本論文將介紹與連接器相關的測試規範，並根據規範來設計實驗，以討論鍍金厚度與耐久度的關聯。最後，提出幾點結論，以供後續連接器鍍層選用及未來研究工作之參考。
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| 摘要(英) |
As the longer life cycle and harsher application environment of the industrial automation product, its connector requires higher quality and better performance than other 3C products. Gold plating method is usually used to improve the durability and against the variability of the environment. However, the price of gold has become higher and higher in recent years. It caused a great effect on the connector cost and consequently it had a serious impact on the cost of end products.
The price of connector is proportional to the thickness of gold plating, so the thickness of gold plating has reduced from 100 μinch in late 1960’s to 1970’s to less than 1 μinch nowadays in order to reduce the cost of connector. However, the porosity of the surface in gold plating coating is contrary to the thickness of gold plating layer. The porosity leads to corrosion on both the substrate material of gold plating coating and cladding exposing in the gas of external environment. This would occur the problems of connection failure or data missing in connector.
In order to find the relationship between durability and thickness of gold plating, the related test specifications of connector will be introduced in this thesis and the experiments will be conducted based on the specifications. In the end, some conclusions will be presented as the selection of connector coating as well as the reference for future research.
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| 關鍵字(中) |
★ 鍍金
★ 連接器 |
關鍵字(英) |
★ Gold Plating
★ Connector |
| 論文目次 |
中文摘要………….. i
英文摘要Abstract ii
目錄………..... iiii
表目錄........... v
圖目錄..............................................................................................................................vi
第一章、 緒論 1
1-1 研究動機 1
1-2 文獻回顧 2
1-3 論文內容 2
第二章、 連接器接觸鍍層介紹 6
2-1 端子接觸鍍層簡介 6
2-2 錫與錫合金 6
2-3 金 7
2-4 鍍金規格的分類 8
第三章、 鍍金品質的檢驗標準及方法 14
3-1 鍍金品質檢驗標準簡介 14
3-2 純度(Deposit Purity) 14
3-3 硬度(Hardness) 14
3-4 外觀(Appearance) 15
3-5 厚度(Thickness) 15
3-6 附著力(Adhesion) 16
3-7 鍍層完整性(Plating Integrity) 16
3-8 延展性(Ductility) 17
第四章、 實驗方法 19
4-1 實驗設計簡介 19
4-2 混合腐蝕氣體試驗(MFG:Mixed Flowing Gas) 19
4-2.1 實驗設計 20
4-2.2 實驗設備 21
4-3 鹽霧測試(Salt Spray Test) 21
4-3.1 實驗設計 22
4-3.2 實驗設備 22
4-4 高溼度的溫度循環(Cycling Temperature with High Humidity) 23
4-4.1 實驗設計 23
4-4.2 實驗設備 24
4-5 實驗試件 24
第五章、 實驗結果與討論 32
5-1 簡介 32
5-2 混合腐蝕氣體試驗(Mixed Flowing Gas)實驗結果 32
5-3 鹽霧測試(Salt Spray Test)實驗結果 34
5-4 高溼度溫度循環(Cycling Temperature with High Humidity)實驗結果 35
5-5 不同鍍金厚度之價格比較 35
第六章、 結論與未來工作 54
6-1 結論 54
6-2 未來工作 55
參考文獻 56
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| 參考文獻 |
[1] Goldprice網站http://goldprice.org/gold-price-history.html
[2] MAX PEEL. (2000), “Gold Flash Contacts : Super Saver or Ticking Time Bomb.”
[3] Xue-Yan Lin, Ji-Gao Zhang (2002), ”Properties of Corrosion Stainson Thin Gold Plating”, Proceedings of the Forty-Eighth IEEE Holm Conference on, :156- 162.
[4] Stennett, N.A. (1993), "Failure mechanisms in stationary low current contacts.” Connectors on Vehicles, IEE Colloquium on, : 4/1-4/12.
[5] 池建明, 王麗娟 (2002), ”連接器鍍金工藝”, 電鍍與塗飾,:34-36.
[6] MIL-G-45204C (1993), Gold Plating, ELECTRODEPOSITE
[7] ASTM-B488-01 (2006), Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses.
[8] ASTM B578 (Standard Test Method for Microhardness of Electroplated Coatings)
[9] ASTM B765 (Standard Guide for Selection of Porosity and Gross Defect Tests for Electrodeposits and Related Metallic Coatings)
[10] ASTM B735 (Standard Test Method for Porosity in Gold Coatings on Metal Substrates by Nitric Acid Vapor)
[11] ASTM B799 (Standard Test Method for Porosity in Gold and Palladium Coatings by Sulfurous Acid/Sulfur-Dioxide Vapor)
[12] ASTM B489 (Standard Practice for Bend Test for Ductility of Electrodeposited and Autocatalytically Deposited Metal Coatings on Metals)
[13] EIA-364-D (Electrical Connector /Socket Test Procedures Including Environmental Classifications)
[14] EIA-364-65A (Mixed Flowing Gas)
[15] ASTM B845, Standard Guide for Mixed Flowing Gas (MFG) Tests for Electrical Contacts
[16] EIA-364-TS-1000.01, Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office Applications.
[17] Yamasaki Seiki Kenkyusho Inc. Mixed Flowing Gas Corrosion Test Cabinet 技術手冊
[18] EIA-364-26B, Salt Spray Test Procedure for Electrical Connectors, Contacts and Sockets.
[19] T-MACHINE鐵木真科技股份有限公司鹽霧測試機技術手冊
[20] EIA-364-31B, Humidity Test Procedure for Electrical Connectors and Sockets.
[21] T-MACHINE鐵木真科技股份有限公司恆溫恆濕試驗機技術手冊
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| 指導教授 |
蕭述三(Shu-San Hsiau)
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審核日期 |
2011-8-26 |
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