摘要(英) |
The effect of green house gases on global warming draws a great attention globally. Under the protectionism stream for the earth, improper treatment of these gases will affect not only the earth environment but also a nation’s economy. The products of semiconductor manufacturing and TFT-LCD from Taiwan share more than 30% in the world. If the quantity of Perfluocarbons (PFCs) used in the manufacturing process is not reduced, an inhibition of the electronic products imported from Taiwan may happen.
The destruction efficiency data of waste gases from semiconductor etching processes by using steam plasma torch coupled with a wet scrubber are compiled in this study. The operating power of steam plasma torch should be above 17 kW to treat CF4 for reaching more than 90% efficiency as found in a pre-study. Therefore, the operating power of steam plasma torch is set at 17 kW in this study. Fourier Transform Infrared Spectroscopy is adopted in this study to measure C2F6, CF4, SF6, HF, and HCl concentrations in the inlet and outlet of treatment process alternately. The results show that the destruction efficiency can reach as high as 90% for PFCs from both one and seven chambers. However, simultaneously treating the waste gases from seven chambers exceeds the capacity of this system such that SO2, C2F6, CF4, and SF6 spikes are observed in the outlet. Hydrogen Cyanide is the by-product normally found in the manufacturing process which is confirmed from outlet detection by only a minor amount in this study. The destruction efficiency from steam plasma torch coupled with a wet scrubber as shown in this study proved to be an effective way in treating green house gases emitted from semiconductor etching processes. |
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