利用三維斷層掃描對contact與via分析

以作者查詢圖書館館藏

、以作者查詢臺灣博碩士

、以作者查詢全國書目

、勘誤回報

、線上人數：10

、訪客IP：3.145.178.157

姓名

鍾俊瑋(Jun-Wei Zhong) 查詢紙本館藏

畢業系所

化學工程與材料工程學系

論文名稱

利用三維斷層掃描對contact與via分析
(3D Analysis on Via and Contact by Using Tomography)

相關論文

★ Au濃度Cu濃度體積效應於Sn-Ag-Cu無鉛銲料與Au/Ni表面處理層反應綜合影響之研究	★ 薄型化氮化鎵發光二極體在銅填孔載具的研究
★ 248 nm準分子雷射對鋁薄膜的臨界破壞性質研究	★ 無光罩藍寶石基材蝕刻及其在發光二極體之運用研究
★ N-GaN表面之六角錐成長機制及其光學特性分析	★ 藍寶石基板表面和內部原子排列影響Pt薄鍍膜之de-wetting行為
★ 藍寶石基板表面原子對蝕刻液分子的屏蔽效應影響圖案生成行為及其應用	★ 陽離子、陰離子與陰陽離子共摻雜對於p型氧化錫薄膜之電性之影響研究與陽離子空缺誘導模型建立
★ 通過水熱和溶劑熱法合成銅奈米晶體之研究	★ 自生反應阻障層 Cu-Ni-Sn 化合物在覆晶式封裝之研究
★ 含銅鎳之錫薄膜線之電致遷移研究	★ 微量銅添加於錫銲點對電遷移效應的影響及鎳金屬墊層在電遷移效應下消耗行為的研究
★ 電遷移誘發銅墊層消耗動力學之研究	★ 不同無鉛銲料銦錫'錫銀銅合金與塊材鎳及薄膜鎳之濕潤研究
★ 錫鎳覆晶接點之電遷移研究	★ 錫表面處理層之銅含量對錫鬚生長及介面反應之影響

檔案

[Endnote RIS 格式]

[Bibtex 格式]

[相關文章]

[文章引用]

[完整記錄]

[館藏目錄]

[檢視]

[下載]

本電子論文使用權限為同意立即開放。
已達開放權限電子全文僅授權使用者為學術研究之目的，進行個人非營利性質之檢索、閱讀、列印。
請遵守中華民國著作權法之相關規定，切勿任意重製、散佈、改作、轉貼、播送，以免觸法。

摘要(中)

Tomography 原先被使用在生命科學上，其表現非結晶型的3D物體結構具有相當的成果，由於近年來半導體元件尺寸日漸縮小，光靠二維圖片無法輕易地解釋複雜的結構，因此在未來利用Tomography作為分析用途將是一大利器。
Tomography 主要分為影像拍攝、影像校正、影像重組等部份，然而在影像校正方面分為 Feature Tracking 與 Cross-Correlation兩種方式，良好的影像校正對於接下來的影像品質有很大的關聯。
在Feature Tracking中，金粒子分布及數目是決定校正品質兩大因素；因此，第一部分的實驗將利用不同濃度Protein A金粒子懸浮液附著於碳膜上，觀察其表面金粒子分佈情形。
實驗結果發現碳膜上有大量的汙染物，因此無法順利拍攝到金粒子的分佈情形，觀察其成分發現Protein A懸浮液裡面的緩衝溶液含有20%的甘油，我們決定更換另一種成分只有金與水的懸浮液,使用此懸浮液可以獲得金粒子分佈均勻且清晰的影像。
在Cross-Correlation實驗方面,良好的高通濾波與低通濾波參數會使Cross-Correlation peak清晰，經由校正過後連續影像間偏移也會有所減少，本次實驗所使用的軟體是FEI公司的Inspect 3D，將高通濾波0.01、0.03、0.05、0.07、0.09等五種數值分別在低通濾波0.1、0.3、0.5、0.7、0.9等五種數值，在TEM 與STEM連續影像中比較25對參數哪一組校正的效果最好；發現高通濾波0.09在低通濾波0.5的時候TEM影像校正在這25組中有最好的效果；在STEM測試中，發現高通濾波0.03在低通濾波0.1在STEM的影像在這25組中有最好的結果。

摘要(英)

Tomography is a well-established technique for three dimensional structure determination amorphous specimens in life sciences applications; Semiconductor device size is diminished in recent year, it is difficult to explain complicated structure by two-dimension image. For this reason, it is advantage for tomography used in fault analysis.
Tomography consist of image acquisition、image alignment and image reconstruction. Cross-Collection and Feature Tracking are two methods in image alignment. Alignment well or not can influence with three-dimension image quantity seriously.
In the Feature Tracking, the gold particle number and distribution are two important factors in alignment quality. Therefore, in the first experiment, using different concentration of gold particle suspension adhere on the carbon film, and watching gold particles distribution situation.
Experiment results show large range of pollutants on carbon film, and therefore can not acquire gold distribution image, because of buffer solution in gold particle suspension contains twenty percentages glycerol. We decide to change another suspension only consists gold and water, and we get clear and uniform distribution gold image by using this suspension.
In Cross-Correlation experiment, well high pass filter and low pass filter parameters can make Cross-Correlation peak clear and sharp; the shift between image and above image can be reduced by well alignment.
The software used in this experiment is Inspect 3D made by FEI company, we set high pass filter up 0.01, 0.03, 0.05, 0.07 and 0.09 in low pass filter 0.1, 0.3, 0.5, 0.7 and 0.9. Compare effect of alignment by changing parameters which is the best in twenty-five sets in TEM and STEM modes.
After experiment, we find high pass filter 0.09 in low pass filter 0.5 has the best TEM image alignment in twenty-five sets, and high pass filter 0.03 in low pass filter 0.1 has the best STEM image alignment in twenty-five sets.

關鍵字(中)

★ 斷層掃描

關鍵字(英)

★ TOMOGRAPHY

論文目次

Contents…………………………………………………………….............I
List of Figures…………………………………………………………….III
List of Tables…………………………………………………………….VII
List of Equations………………………………………………………..VIII
Chapter 1 Introduction
1.1 Introduction of Electron Tomography…………………..........1
1.2 Tomography Acquisition……………………………………..6
1.3 Tomography Acquisition Software…………………………...8
1.4 Tomography Alignment and Reconstruction………………..12
1.4.1 Tomography Data Alignment………………………...12
1.4.2 Tomography Reconstruction………………………….15
1.5 Tomography Resolution…………………………...….……..18
1.6 Tomography Artifacts……………………………………….19
1.7 Objectives…………………………………………………...21
Chapter 2 Experimental Instruments…………………………..…..……..23
2.1 Focused Ion Beam ………………………………………….23
2.1.1 Introduction…………………………………………...23
2.1.2 Focus………………………………………………….24
2.1.3 Ion…………………………………………………….24
2.1.4 Image Principle…………………………………….....25
2.1.5 Outline of FIB System………………………………..25
2.2 Transmission Electron Microscopy………………………….26
2.2.1 TEM History……………………………………….....26
2.2.2 The Reaction between Electron Beam and Material.....30
2.2.3 TEM Structure………………………………………...30
Chapter 3 Experimental…………………………………………………..32
3.1 Gold Adherence Test………………………………………...32
3.2 Image Alignment Parameter Test……………………………33
3.2.1 M-Bond…………………………………………….....34
3.2.2 FIB Cutting……………………………………………34
3.2.3 Lift Out Sample……………………………………….38
3.2.4 Acquire TEM/STEM Image………………………......41
3.2.5 Image Alignment……………………………………...42
Chapter 4 Experiment Results and Discussion…………………………...45
4.1 Gold Adherence Ability on Carbon Test…………………......45
4.1.1 Protein A Gold Suspension Test………………………45
4.1.2 The Gold in Aqua Suspension Test…………………...49
4.2 3D Software Parameter Test………………………………...51
4.2.1 TEM CB 3D Software Parameter Test……………......51
4.2.2 STEM CB 3D Software Parameter Test……………...57
Chapter 5 Calculation…………………………………………………….64
Chapter 6 References……………………………………………………..A

參考文獻

1. A. Argyros, S. Manos, M.C.J. Large, D.R. McKenzic, G.C. Gox and D.M. Dwdrte, micron, 33, p.483 (2002).
2. Christian Kübel, Andreas Voigt, Remco Schoenmakers and Max Otten, Microsc. Microanal, 11, p.378 (2005).
3. James, E.M. and Browning, N.D., Ultramicroscopy, 78, p.125 (1999).
4. Kisielowski, C., Hetherington, C.J.D., Wang, Y.C., Kilaas, R., O’Keefe, M.A. and Thust, A., Ultramicroscopy 80, p.243 (2001).
5. U. Ziese, A.H. Janssen, J.L. Murk, W.J. Geerts, T. Krift, A.J. Verkleij, and A.J. Koster, J Microsc, 205, p.187 (2002).
6. Spence, J., Materials Today, 5, p.20 (2002).
7. Voyles, P.M., Muller, D.A., Grazul, J.L., and Citrin, P.H., Nature, 416, p.826 (2002).
8. Jia, C.L., Lentzen, M. and Urban, K., Science, 299, p870 (2003).
9. Timon Fliervoet, Imaging & Microscopy, 2, p.45 (2005).
10. T. Yaguchi, M.Konno, T. Kamino, Proceedings of the 31th International Symposium for Testing and Failure Analysis, (2005).
11. Abraham J. Koster, Rudo Grimm, Dieter Typke, Reiner Hegerl, Arne Stoschek, Jochen Walz, and Wolfgang Baumeister, Journal of Structural Biology, 120, p.76 (1997).
12. Wolfgang Baumeister, Rudo Grimm and Jochen Walz, Trends in Cell Biology, 9, p.81 (1999).
13. Bruce F. McEwen and Michael Marko, Journal of Histochemistry & Cytochemistry, 49, p.553 (2001).
14. J. Richard McIntosh, Journal of Cell Biology, 153, p.25 (2001).
15. R. H. M. Schoenmakers, R. A. Perquin, T. F. Fliervoet, W. Voorhout and H. Schirmacher, Microscopy and Analysis, p.5 (July 2005).
16. Xplore3D. Technical Note, FEI Company, 2003
17. T. Yaguchi, M.Konno, T. Kamino, M.Ogasawara, K. Kaji, T.Ohnishi, M.Watanabe, Proceedings of the ISTFA, p.382 (2005).
18. Richard Gordon, Robert Bender and Gabor T. Herman, journal of Theoretical Biology, 29, p.471 (1970).
19. Peter Gilbert, journal of Theoretical Biology, 36, p.117 (1972)
20. M. Weyland and P. A. Midgley, Microscopy and Microanalysis, 9, (6) p.542 (2003).
21. Skoglund U., Ofverstedt L.G., Burnett R.M.and Bricogne G, Journal of Structural Biology, 117, (3) p.173 (1996).
22. M Radermacher, Journal of Electron Microscopy Technique, 9, p.359 (1988).
23. P.A. Midgley and M. Weyland, Ultramicroscopy, 96, p.413 (2003).
24. Radermacher M, Plenum Press, p.91 (1992).
25. S. Marco, T. Boudier, C. Messaoudi, and J.-L. Rigaud, Biochemistry, 11, p.1219 (2004).
26. David B. Williams et.al., Transmission electron microscopy, (1996).
27. 陳力俊, 材料電子顯微鏡學, 中華民國九十三年十月.
28. R. Schoenmakers, W. Voorhout, FEI Company, (2003).
29. Toshiaki Suzuki, Noriaki Endo, Eiji Okunishi, JEOL News, 38, p.30 (2003).
30. W. Voorhout and A. Voigt, TEM Tomography, FEI Company, (2005).
31. A. Voigt and W. Voorhout, TEM Calibration, FEI Company, (2005).
32. C. Kübel and A. Voigt, STEM Tomography, FEI Company, (2005).
33. A. Voigt and C. Kübel, STEM Calibration, FEI Company, (2005).

指導教授

劉正毓、高政宏
(Cheng-Yi Liu、C. R. Kao)

審核日期

2007-1-16

推文