參考文獻 |
[1] Hecht, O., Dishon, G.,”Automatic Optical Inspection (AOI)”, Electronic Components and Technology Conference, 1990. Proceedings., 40th, Vol. 1, 1990, pp.659-661
[2] R. C. Restrick III,“An Automatic Optical Printed Circuit Inspection System”, Proc. SPIE, Solid-State Imaging Devices, Vol. 116, 1977, pp.76
[3] Atack D, Smith KCA” The scanning electron microscope - A new tool in fibre technology”, Pulp Pap Mag Can, Vol 1, 1956, pp.245-251
[4] Welland, M. E. McKinnon, A. W. Barnes, J. R. O'Shea, S.J., “Scanning probe microscopy”, Engineering Science and Education Journal, Vol. 1, 1992, pp.203-210
[5] Henry Guckel, Madison and Wis, “Formation of Microstructures by Multiple Level Deep X-ray Lithography with Sacrificial Metal Layers”, United States Patent 5190637, Mar. 2, 1993。
[6] R. Bruck, K. Hahn, J. Steinecker, “Technology Description Methods for LIGA processes”, J. Micromech. Microeng, Vol.5, 1995, pp.196-198。
[7] M. Abraham, J. Arnold, W. Ehrfeld, K. Hesch, H. Mobius, T. Paatzsch, C. Schulz, “Laser-LIGA: A Cost Saving Process for Flexible Production of Micro-structures”, SPIE, Vol. 2639, 1995, pp.164-173。
[8] Geoffey Prentice, “Electrochemical Engineering Principles”, 新月圖書代理, 1991。
[9] John D. Madden and Ian W. Hunter, “Three Dimensional Micro-fabrication by localized Electrochemical Deposition”, Journal of micro-electro-mechanical systems. Vol.5 No.1, Mar. 1996, pp24-32
[10] Ian W. Hunter, Serge R. Lafontaine and John D. Madden,“Three-Dimensional Micro-fabrication by localized Electrchemical Deposition and Etching”, United States Patent 5641391, Jun.24, 1997
[11] Lin, J. C., S. B. Jiang, et al., “Micro-electroplating of Nickel on Copper Substrate”, Hsin-Chu, Taiwan, 1998
[12] Lin, J. C. , T. K. Chang, et al., “Fabrication of Copper Columns by MAGE Process”, Nantou, Taiwan, 2004
[13] Lin, J. C., R. W. You, et al., “Potential Moni
toring at Open Circuit and Cathode Polarization by MAGE System with Nickel”, Kaohsiung, Taiwan, 2004
[14] Lin, J. C., S. B. Jiang, et al.,” The Effect of Electric Field on Fabricating Columns by MicroanodeGuided Electroplating (MAGE) process“, Automation 2005, Taichung, Taiwan, 2005
[15] Lin, J. C., S. B. Jiang, et al., “Effect of Electric Field on the Cross Section of Micrometer Nickel Columns Fabricated by MAGE Process”, Automation 2005, Taichung, Taiwan, 2005
[16] Lee, D. L., S. B. Jiang, et al., “Micro-electroplating Control System”, Automation 2000, Taipei, Taiwan, 2000
[17] Lin, J. C., S. B. Jang, et al., “Fabrication of mi
crometer Ni columns by continuous and intermittent micro anode guided electroplating“, J. Micromech. Microeng. Vol. 15, 2005, pp.2405–2413
[18] Lee, D. L., Lin, J. C. et al., “Micro-anode Guided Electroplating (MAGE) Control System” , Materials Science Forum Vols.,2006, pp.505-507
[19] Gamry Instruments’Application Note “Electrochemical Impendence Spectroscopy Theory: A Primer ”網址:http://www.gamry.com/App_Notes/EIS_Primer/EIS_Primer.htm
[20] 陳金德 (民94),電場輔助無電鍍鎳之研究,私立逢甲大學材料與製造工程材料工程碩士論文。
[21] Gamry Instruments’Application Note “Determination of Double-Layer Capacitance form a CPE”網址:http://www.gamry.com/App_Notes/PDF/jovic.pdf
[22] John Edward Brough Randles 介紹網址:http://chem.ch.huji.ac.il/~eugeniik/history/randles.html
[23] Jer-Nan Juang NASA Langley Research Center ”Applied System Identification” Chapter 1.
[24] Gene F. Franklin J. David Powell Abbas Emami-Naeini “Feedback control of dynamic systems Forth Edition” Chapter 3.
[25] 林銀議 (民94),信號與系統,二版二刷
[26] Paul Horowitz,Winfield Hill,THE ART OF ELECTRONICS Second Edition.
[27] Solartron Analytical Electrochemical Analysis’Application Note TECHNICAL REPORT NUMBER 004/83
“IDENTIFICATION OF ELECTROCHEMICAL PROCESSES BY FREQUENCY RESPONSE ANALYSIS” Chapter 1
網址:http://www.solartronanalytical.com/products/applications/electrochemistry/index.php
[28] Princeton Applied Research’Application Note 網址:http://www.princetonappliedresearch.com/
[29] Solartron Analytical Electrochemical Analysis’Application Note TECHNICAL REPORT NUMBER 004/83“IDENTIFICATION OF ELECTROCHEMICAL PROCESSES BY FREQUENCY RESPONSE ANALYSIS” Chapter 2網址:http://www.solartronanalytical.com/products/applications/electrochemistry/index.php
[30]Electrochemistry for Corrosion R.A. Cottis and A. Llewllyn網址:http://www.cp.umist.ac.uk/lecturenotes/Echem/cellfile.html
[31] MAGELLAN BIOSCIENCES The Working Electrode-Introduction 網址:http://www.esainc.com/theory/coulometric/esaelectrode.html
[32] Resources for Electrochemistry’ Application Note 網址:http://www.consultrsr.com/index.htm
[33] Electrochemistry for Corrosion R.A. Cottis and A. Llewllyn-The Reference Electrode Section網址:
http://www.cp.umist.ac.uk/lecturenotes/Echem/cellfile.html
[34] Analog Device Embedded Processing & DSP網址:
http://www.analog.com/processors/processors/ADSP/
[34] Analog Device AD9833 Programmable Waveform Generator網址:
http://www.analog.com/en/prod/0,,770_843_AD9833,00.html
[35] CSIM CSD-205H 微步進馬達驅動器 網址:
http://www.csim.com.tw/csd205h.html
[36] ADLINK PCI-8134 四軸運動控制卡 網址:
http://www.adlinktech.com/PD/big5/PD_detail.php?cKind=FN&pid=132&seq=&id=&sid=
[37] Owen, B. B. & Gurry, R. W., “The Electrolytic Conductivity of Zinc Sulfate and Copper Sulfate in Water “, J. Amer. Chem. Soc. Vol. 40, 1938, pp. 3074 |