博碩士論文 953303003 詳細資訊




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姓名 潘俊宏(Pan-Chun Hung)  查詢紙本館藏   畢業系所 機械工程學系在職專班
論文名稱 不同結構與幾何形狀對熱管性能之影響
(Effect of geometry and different wick using in the heat pipe)
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檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 ( 永不開放)
摘要(中) 由於筆記型電腦市場走向輕薄短小的趨勢,使用者及客戶對外型以及美觀的要求,所產生設計上的限制,造成熱管以折彎及打扁的方式,透過熱管來有效的解熱,其性能也造成一定的影響。開會時,若將筆記型電腦放於大腿上,造成熱管傾斜方式來解熱,選用不同結構的熱管,來有效解決熱管抗重力的問題。而本實驗是探討不同結構與幾何形狀對熱管性能之影響。
本研究以實驗方法探討不同結構與幾何形狀熱管的效能表現,在傾斜角度正方向0度、30度、60度、90度及負方向0度、30度、60度、90度對熱管性能之影響。實驗時,利用熱電偶量測各元件之溫度計算其熱阻,而熱管性能則以各熱阻值作為判斷的依據。模擬晶片之發熱瓦數有10W 、20W 、40W 及60W。熱管結構包括燒結、溝槽及複合這三種結構。幾何形狀包括直徑5mm(打扁2.5mm)及直徑8mm(打扁3mm),段差部份包含有無段差0mm及2mm,另外折彎部份包含折彎角度0度、30度、60度、90度。
摘要(英) This research uses experiment method to discuss the different perform-ance of structure and shape Heat-Pipe of geometry. Slope angle from posi-tive direction are 0 degree、30 degree、60 degree、90 degree、-30 degree、-60 degree、-90 degree.Experiment setup thermal-couple to measurement temperature of every components and cal-culate Heat-Pipe heat-resistance, and it is accords to every heat-resistance value to judgments about performance of heat-pipe.
The burning watts have 10W、20W、40W and 60W simulation chip. Heat-pipe structure include three structures sinter、groove and composite. Geometry shape include diameter 8mm(flatten 3mm)and 5mm(flatten 2.5mm),the step part include 0mm and 2mm,another bend part include bend angle 0 degree、30 degree、60 degree、90 degree.
關鍵字(中) ★ 折彎
★ 段差
★ 打扁
★ 熱管
關鍵字(英) ★ Heat-Pipe
★ Flatten
★ Step
★ Bend
論文目次 摘要i
目錄iii
表目錄v
圖目錄vi
符號說明ix
第一章 前言-1
1.1 研究背景-1
1.2 研究目的-2
第二章 文獻回顧-3
2.1歷史沿革-3
2.2工作原理-4
2.3毛細結構-4
2.4幾何形狀性能差異-6
2.5傾斜角性能測試-7
第三章 實驗系統及分析方法-14
3.1熱管製作-14
3.2測試段-15
3.3測試系統-16
3.3.1 量測儀器設備-16
3.4 實驗過程-17
3.5 實驗數據換算-18
第四章 實驗結果與討論-41
4.1 毛細結構的比較-41
4.1.1加熱功率下熱阻值與結構之關係-41
4.2管徑的比較-44
4.2.1不同傾斜角度下各結構的熱阻值對管徑之影響-44
4.3折彎的比較-46
4.3.1不同傾斜角度下各結構的熱阻值對折彎之影響-46
4.4打扁的比較-49
4.4.1不同傾斜角度下各結構的熱阻值對折彎之影響-49
4.5段差的比較-51
4.5.1不同傾斜角度下各結構的熱阻值對段差之影響-51
第五章 結論與建議-83
參考文獻-85
附錄-88
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曾昭源,2007,折彎及壓扁後製程對燒結式熱管毛細結構之影響,大同大學材料工程研究所碩士論文。
指導教授 楊建裕(Chien-Yuh Yang) 審核日期 2008-7-25
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