博碩士論文 953303014 詳細資訊




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姓名 鄭錦勝(CHENG-CHIN SHENG)  查詢紙本館藏   畢業系所 機械工程學系在職專班
論文名稱 LED封裝點膠系統創新設計之研究
(led dispensing system)
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摘要(中) 本論文主要探討LED封裝點膠系統創新自動化設備改善之研究,並對其創新結構的封裝能力進行一系列研究與探討。首先介紹LED生產自動化之重要性,以瞭解現今LED所使用點膠封裝設備結構,再對其機械結構及控制方式進行分類及優劣分析。而後,藉由各專利蒐集分析、觸發並運用創意構思設計之可行性,進行優劣評比後求得其基礎架構之設計解。所構思出之點膠架構,確認點膠作動主體及各空間架構分佈,以CAD設計完成構圖,並從材料選擇、應力應變分析及密封性等進行探討,再以結構性思考其控制能達到輕易操控作動,以求得最完善的主體點膠架構後進行製作。之後,從恆定性及恆定量觀點之實驗作法,佐證膠量控制及膠滴成形分佈狀態,並從高速攝影取像分析,重量量測參數曲線進行比對及差異性分析並發現其誤差值,此作為腔體設計及機構性能之重要依據,最後以LED進行實體封裝,觀測實際封裝效果。
總括言之,本文最後依據真實材料封裝效果及定性與定量實驗方式,遵循特定實驗法則找出符合產品需求之控制參數。從而以此點膠機構封裝性能,進行機械手臂自動化矩陣式點膠或模具開發矩陣式點膠,以達到降低成本,增加產能及縮短開發時程與費用,結省能源為目標。
摘要(英) The present paper mainly discusses LED to seal decorates research of the rubber system
innovation automatic equipment improvement, and conducts a series of research and the
discussion to its innovation structure’’s seal ability. First introduced that importance of the
LED production automation, understood nowadays the LED application point rubber seal
equipment structure, again carries on the classification and the fit and unfit quality analysis to
its mechanism and the control mode. Then, because of various patents collection analysis,
triggers and utilizes feasibility of the creativity conceptual designs, after carrying on the fit
and unfit quality comparison, obtains design of solution its foundation construction. Forms in
one’’s mind the spot rubber construction, confirmed that a rubber does moves the main body
and various spatial construction distribution, completes the composition by the CAD design,
and from the choice of material, the stress strain analysis and leak-proof and so on carries on
the discussion, by the constitutive property pondered again its control can achieve controls
easily does moves, after obtains the most perfect main body rubber construction, carries on
the manufacture. Afterward, experiment of method from the constancy and the constant
quantity viewpoint, the evidence rubber quantity control and the rubber drop forming
distribution condition, and takes from the high-speed photography analyzes likely, the weight
gauging parametric curve carries on compared to analyzes and discovers its magnitude of
error to and the difference, this depends on importantly as the housing design and the
organization performance according to, finally carries on the entity seal by LED, the
observation actual seal effect. Sums up word it, this article rests on the real material seal effect
finally and determines the nature of with the quantitative experiment way, follows the specific
experiment principle to discover conforms to of controlled variable the product demand. Thus
by this rubber organization seal performance, carries on a mechanical arm automation matrix
form rubber or a mold development matrix form rubber, achieves reduces the cost, increases
iii
produces can and the reduction development time interval and the expense, ties the province
energy is the goal
關鍵字(中) ★ led封裝 關鍵字(英) ★ led dispensing
論文目次 中文摘要 ................................................................................................................................... i
Abstract ..................................................................................................................................... ii
致謝 ......................................................................................................................................... iv
目錄 .......................................................................................................................................... v
圖目錄 ................................................................................................................................... viii
表目錄 ...................................................................................................................................... x
第1 章 緒論 ............................................................................................................................. 1
1.1 研究背景 .............................................................................................................. 1
1.2 研究動機 .............................................................................................................. 2
1.3 研究目的及方法 .................................................................................................. 2
1.3.1 LED 生產流程 ............................................................................................ 3
1.3.2 封裝方法 .................................................................................................... 4
第2 章 點膠結構回顧及創新研究 ......................................................................................... 7
2.1 現有點膠成型法 .................................................................................................. 7
2.1.1 針筒式點膠法 ............................................................................................ 7
2.1.2 模頭式點膠法 ............................................................................................ 8
2.2 專利蒐集 ............................................................................................................ 10
2.2.1 泛用型點膠及噴塗結構 .......................................................................... 11
2.2.2 精密型點膠封裝結構 .............................................................................. 12
2.3 創意點膠系統設計 ............................................................................................ 13
2.3.1 迴轉引擎原理注膠 .................................................................................. 13
2.3.2 導螺桿精密注膠 ...................................................................................... 14
2.3.3 迴轉分割注膠 .......................................................................................... 14
2.4 矽膠膜片之研究 ................................................................................................ 15
vi
2.4.1 單矽膠膜片針筒式結構 .......................................................................... 17
2.4.2 單矽膠膜片彈簧復歸結構 ...................................................................... 18
2.4.3 雙矽膠膜片橫隔氣壓結構 ...................................................................... 18
2.4.4 雙矽膠膜片複合作動結構 ...................................................................... 18
2.5 小結 .................................................................................................................... 19
第3 章 新型式膜片點膠系統構成 ....................................................................................... 21
3.1 雙矽膠膜片複合作動結構 ................................................................................ 21
3.2 結構研究過程與設計分析 ................................................................................ 22
3.2.1 設計配置圖 .............................................................................................. 23
3.2.2 分膠區之環型矽膠膜片設計分析 .......................................................... 24
3.2.2.1 結構設計 .................................................................................................. 24
3.2.2.2 應力分析 .................................................................................................. 24
3.2.3 儲膠區之板狀矽膠膜片設計分析 .......................................................... 25
3.2.3.1 結構設計 .................................................................................................. 25
3.2.3.2 應力分析 .................................................................................................. 25
3.2.4 腔體設計 .................................................................................................. 25
3.2.4.1 結構設計 .................................................................................................. 26
3.2.4.2 流道結構設計分析 .................................................................................. 26
3.2.5 密封性設計分析 ...................................................................................... 27
3.2.6 針頭選用 .................................................................................................. 28
3.3 控制系統 ............................................................................................................ 29
3.3.1 氣體控制系統 .......................................................................................... 29
3.3.2 電控迴路控制系統 .................................................................................. 33
3.4 新型式機械自動化(XYZ)作動點膠架構 .................................................... 35
第4 章 實驗方法與結果 ....................................................................................................... 36
4.1 實驗架構 ............................................................................................................ 36
vii
4.2 實驗方法 ............................................................................................................ 37
4.3 定量分析實驗結果與討論 ................................................................................ 38
4.3.1 腔體間隔影響 .......................................................................................... 41
4.3.2 時間間隔影響 .......................................................................................... 44
4.3.3 氣體壓力影響 .......................................................................................... 48
4.4 定性分析實驗結果與討論 ................................................................................ 51
4.4.1 膠滴成型分析 .......................................................................................... 51
4.4.2 驗證(晶片封裝) .................................................................................. 54
第5 章 結論 ........................................................................................................................... 55
5.1 研究成果 ............................................................................................................ 55
5.2 未來與展望 ........................................................................................................ 56
參考文獻 ................................................................................................................................ 57
附錄一 .................................................................................................................................... 60
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指導教授 蔡錫錚(Dr.-Ing. S.-J. Tsai) 審核日期 2011-1-17
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