窗型球柵陣列構裝翹曲及熱應力分析

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姓名

程雲翔(Michael Cheng) 查詢紙本館藏

畢業系所

機械工程學系在職專班

論文名稱

窗型球柵陣列構裝翹曲及熱應力分析
(Window BGA array assemly warpage and rhermal stress analysis)

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摘要(中)

電子構裝因元件間的材料熱膨脹係數不同，在構裝製程的不同溫度負載下會產生膠體翹曲變形及構裝元件熱應力及可靠度問題。本論文為研究市面上常見之 DDRⅢ (Double Data Ram) 動態隨機存取記憶體DREAM(Dynamic Random Access Memory)構裝時所產生的翹曲、熱應力及可靠度問題。由於DDRⅢDRAM構裝採用WBGA(Window Ball Grid Array)型態，屬較先進尺寸構裝，為了得到較佳的電性及及反應速度，其佈線比較短，且膠體分別位於基板上下方也呈不對稱形態，故於構裝過程中易衍生出翹曲、熱應力及可靠度問題。
本研究利用有限元素軟體ANSYS模擬預測翹曲並與實驗結果比較，並探討不同晶片尺寸，及膠體材料對構裝翹曲、熱應力及可靠度的影響。

摘要(英)

The electronic assembly because of C.T.E(Coefficient of thermal expansion) and thermal stage are different between each components, that will lead to warpage , thermal stress and reliability issue during assembly process. The dissertation research DDRⅢ Double data Ram Dynamic Random Access Memory warpage, thermal stress and reliability issue. The finite element method is use to simulate the package warpage and reliability during manufacturing process.
In this research use basic concepts of finite element method with software ANSYS simulate and forecast warpage compare with sample, then study different die size and molding compound for warpage , thermal stress and reliability relation.

關鍵字(中)

★ 構裝

關鍵字(英)

★ Assembly

論文目次

第一章序論.............................................................................................................. 1
1-1 前言...............................................................................................1
1-2 IC構裝形態介紹..........................................................................2
1-3 IC構裝流程簡介.........................................................................6
1-3-1 晶圓切割......................................................................................6
1-3-2 黏晶.............................................................................................7
1-3-3 銲線..............................................................................................8
1-3-4 封膠..............................................................................................8
1-3-5 剪切成型......................................................................................9
1-3-6 印字............................................................................................10
1-4 研究動機與目的...................................................................10
第二章研究方法...............................................................................................12
2-1 翹曲與可靠度分析..............................................................12
2-2 有限元素模擬......................................................................12
2-3 實驗儀器與流程...................................................................15
2-3-1 數值分析儀器及軟體...........................................................16
2-3-2 數值分析模型建構................................................................16
2-4 實驗儀器與成品之選用及製作流程...................................17
2-4-1 WBGA基板設計與選用.......................................................18
2-4-2 環氧樹脂特性選用...............................................................20
2-4-3 打線(Wire Bond)製程限制與金線選用...............................22
2-4-4 壓模加工製程條件...............................................................22
2-5 量測儀器與定義.....................................................................24
2-5-1 光學投影機............................................................................25
第三章構裝翹曲與應力分析理論...................................................................27
3-1 多層板翹曲理論.......................................................................27
3-2 熱應力分析理論.......................................................................32
第四章構裝翹曲模擬結果與產品比較...........................................................35
4-1 WBGA翹曲分析..........................................................................35
4-2 有限元素模擬分析..................................................................36
4-2-1 有限元素模擬分析假設....................................................;...36
4-3 模型網格收斂探討................................................................37
4-4 比較不同有限元素模擬模型...............................................39
4-4-1 實驗計畫一............................................................................39
4-4-1-1 實驗計畫一結果.....................................................................44
4-4-2 實驗計畫二.............................................................................45
4-4-2-1 實驗二結果...........................................................................49
4-4-3 實驗計畫三..........................................................................50
4-4-3-1 實驗三結果..........................................................................55
4-5 可靠度測試..........................................................................56
4-5-1 實驗一可靠度結果.............................................................56
4-5-2 實驗二可靠度結果...............................................................57
4-5-3 實驗三可靠度結果...............................................................59
第五章結果與討論..............................................................................................61
5-1結論..................................................................................................61
5-1-1 構裝翹曲.....................................................................................61
5-1-2 構裝熱應力....................................................................................62
5-2 未來發展..................................................................................63
參考文獻............................................................................................................64
簡歷.........................................................................................................................66

參考文獻

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3. Terril.R. and Beene.G.L., “3D Packaging Technology overview and Mass
Memory Application” IEEE Aerospace ApplicationConference.,pp.347-355, 1996.
4. Kikkawa.T.,Ideda.R.,Matsuda.T. and Watanade.T.,”Development
of 3-Dimensional Memory Module Using Anisotropic Conductive Adhesion Films,” IEEE/CPMT Berlin Int’l Electronics Manufacturing Technology Symposium, pp.31-37,1998.
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R.Lo, ”The Advent of 3-D Package Age” IEEE/CPMT International
Electronics Manufacturing Technology Symposium, pp.102-107, 2000
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Packaging Technology Conference, Proceedings. 5th., pp.695-700, 2003
7. Akay, H. U.; Liu, Y.; Ras, M. “Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages”, Journal of Electronic Packaging, vol. 125, pp.347-353, 2003.
8. Cheng, H. C.; Yu, C. Y.; Chen, W. H. “An Effective Thermal-Mechanical Modeling Methodology for Large-Scale Area Array Typed Packages”, Computer Modeling in Engineering and Sciences, vol.7, pp.1-17, 2005.
9. Chiu, C. C.; Wu, C. J.; Peng, C. T.; Chiang, K. N.; Ku, T.; Cheng, K. “Failure Life Prediction and Factorial Design of Lead-Free Flip Chip Package”, Journal of the Chinese Institute of Engineers, vol.30, pp.481-490, 2007.
10.Chen, K. M.; Tasi, H. Y.; Lai, J. Y. “Comparing the Impacts of the Capillary
and the Molded Underfill Process on the Reliability of the Flip Chip BGA”, IEEE Trans. Comp., Packag., Manufact. Technol., vol.31, pp.586-591, 2008.

指導教授

李雄

審核日期

2012-1-5

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