摘要(英) |
According to 2006 TFT-LCD market data, the yearly consumption of positive photoresist was about 4,000 tons and that implied a market value of about NTD 2.9 billion for a single material. Considered the tremendous usage, the approximately 2% occupation of the total material cost in TFT-LCD manufacturing process and the waste positive photoresist which spun off from the glass substrate during the spin coating process was almost free of contamination while under clean room environment, a chilling concentration facility using temperature gradient of the hot/cold flow to reuse the positive photoresist was introduced. In the feasibility study on the repetitive reuse of waste positive photoresist, the optimal operation condition was set firstly by using photoresist thinner then applied to waste positive photoresist for solvent removing and dehydration. The chilling concentration efficiencies of the operation condition on photoresist thinner and waste positive photoresist were investigated. Furthermore, through the film thickness prediction equation, the predicted and actual coating thickness of the reuse positive photoresist was also compared.
It was found that the efficiency of the chilling concentration can reach 73.6% and actual efficiency of reuse of waste photoresistant is 48.9% when the operational temperature of hot flow is 30℃, cold flow is -10℃, air volume is 5.09m/s, and liquid flow is 2.0L/min.
It was also found that the actual thickness of the film after 9 photoresistant reuse tests which all less than 500 ? standardized thickness. And the difference of the thickness between the predicted by the formula ln(THf) = 3.523 + 1.424 ln(S.C.) + 0.446 ln(μ) and the actual thickness is only 33?.
Finally, the results of this study indicated that after 9 repetitive diluting, condensing and allotting processes and over expiration date for twenty days, the film thickness of the waste photoresistant may still pass the specifications. |
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