參考文獻 |
[1] Rao R. Tummala, “SOP: what is it and why? A new microsystem-integration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade,” IEEE Trans. Advanced Packaging, vol. 27, no. 2, pp. 241-249, May 2004.
[2] K. Zoschke, M. J. Wolf, M. Topper, O. Ehrmann, T. Fritzsch, K. Kaletta, F. J. Schmuckle, and H. Reichl, “Fabrication of application specific integrated passive devices using wafer level packaging technologies,” IEEE Trans. Advanced Packaging, vol. 30, no. 3, pp. 359-368, Aug. 2007.
[3] P. Pieters, and E. Beyne, “3D wafer level packaging approach towards cost effective low loss high density 3D stacking,” in International Conf. Electronic Packaging Technology, Shanghai, China, Aug. 2006, pp. 1-4.
[4] G. J. Carchon, W. D. Raedt, and E. Beyne, “Wafer-level packaging technology for high-Q on-chip inductors and transmission lines,” IEEE Trans. Microwave Theory and tech., vol. 52, no. 4, pp. 1244–1251, Apr. 2004.
[5] X. Sun, O. Dupuis, D. Linten, G. Carchon, P. Soussan, S. Decoutere, W. D. Raedt, and E. Beyne, “High-Q above-IC inductors using thin-film wafer-level packaging technology demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA”, IEEE Trans. Advanced Packaging, vol. 29, no. 4, pp. 810–817, Nov. 2006.
[6] Advanced Design System Data Manual, Agilent Technologies Inc., 2009.
[7] S. K. Yong and C. C. Chong, “An overview of multigigabit wireless through millimeter wave technology: Potential and technical challenges,” Wireless Commu.. and Networking, 2007.
[8] Z. Wang, Q. Lai, R.-M. Xu, B. Yan, W. Lin, and Y. Guo, “A millimeter-wave ultra-wideband four-way switch filter module based on novel three-line microstrip structure band-pass filters,” Progress In Electromagnetics Research, Vol. 94, pp. 297-309, 2009.
[9] X. C. Zhang, Z. Y. Yu, and J. Xu, “Novel band-pass substrate integrated waveguide (SIW) filter based on complementary split ring resonators (Csrrs),” Progress In Electromagnetics Research, Vol. 72, pp. 39-46, 2007.
[10] J. Q. Huang and Q. X. Chu, “Compact UWB band-pass filter utilizing modified composite right/left-handed structure with cross coupling,” Progress In Electromagnetics Research, Vol. 107, pp. 179-186, 2010.
[11] M. D. C. Velazquez-Ahumada, J. Martel-Villagr, F. Medina, and F. Mesa, “Design of band-pass filters using stepped impedance resonators with floating conductors,” Progress In Electromagnetics Research, Vol. 105, pp. 31-48, 2010.
[12] C. H. Chen, C. S. Shih, T. S. Horng, and S. M. Wu, “Very miniature dual-band and dual-mode bandpass filter designs on an integrated passive device chip,” Progress In Electromagnetics Research, Vol. 119, pp. 461-476, 2011.
[13] S. M. Wu, C. T. Kuo, and C. H. Chen, “Very compact full differential bandpass filter with transformer integrated using integrated passive device technology,” Progress In Electromagnetics Research, Vol. 113, pp. 251-267, 2011.
[14] J. Brinkhoff and F. Lin, “Integrated filters for 60 GHz systems on CMOS,” in Proc. IEEE Radio-Frequency Integration Technology, pp. 154-157, Dec. 2007.
[15] S. Sun, J. Shi, L. Zhu, S. Rustagi, and K. Mouthaan, “Millimeter-wave bandpass filters by standard 0.18-um CMOS technology,” IEEE Electron Device Lett., vol. 28, no. 3, pp. 220-222, Mar. 2007.
[16] C. Y. Hsu, C. Y. Chen, and H. R. Chuang, “A 60-GHz millimeter-wave bandpass filter using 0.18-um CMOS technology,” IEEE Electron Device Lett., vol. 29, no.3, pp. 246-248, Mar. 2008.
[17] C. Y. Hsu, C. Y. Chen, and H. R. Chuang, “70 GHz folded loop dual-mode bandpass filter fabricated using 0.18um standard CMOS technology,” IEEE Microwave Wireless Component Letter, vol. 18, no. 9, pp. 587-589, Sept. 2008.
[18] B. Yang, E. Skafidas, and R. J. Evans, “Design of 60 GHz millimetre-wave bandpass filters on bulk CMOS,” lET Microwaves, Antennas & Propagation, vol. 3, no. 6, pp. 943-949, 2009.
[19] C. Y. Hsiao, S. S. Hsu., and D. C. Chang, “A compact V-Band bandpass filter in IPD technology,” IEEE Microw. Wireless Compon. Lett., vol. 21, no. 10, pp. 531–5334, Oct. 2011.
[20] H. C. Lu, C. S. Yeh, S. A. Wei, and Y. T. Chou,“60 GHz CPW dual-mode rectangular ring bandpass filter using integrated passive devices process,” in Asia Pacific Microwave Conf., Yokohama, Japan, Dec. 2010, pp. 1883–1886.
[21] Y. M. Chen, S. F. Chang, and Y. N. Liao, “A 62 GHz compact low-loss bandpass filter in integrated passive devices technology,” in Asia Pacific Microwave Conf., Melbourne, Australia, Dec. 2011, pp. 1086-1089.
[22] Y. Y. Lim, S. R. Vempati, N. Su, X. Xiao, J. Zhou, A. Kumar, P. P. Thaw, G. Sharma, T. G. Lim, S. Liu, K. Vaidyanathan, and J. H. Lau, “Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP),” in Electronic Components and Technology Conf., San Diego, U.S., May 2009, pp. 508–515.
[23] J. S. Hong, and M. J. Lancaster, “Couplings of microstrip square open-loop resonators for cross-coupled planar microwave filters,” IEEE Trans. Microwave Theory & Tech., vol. 44, No. 12, pp. 2099–2109, Dec. 1996.
[24] S. Y. Lee and C. M. Tsai, “New cross-coupled filter design using improved hairpin resonators,” IEEE Trans. Microwave Theory & Tech., vol. 48, No. 12, pp. 2482–2490, Dec. 2000.
[25] C. C. Wang, H. A. Yang, Y. C. Shyu, M. H. Li, C. T. Chiu, and S. M. Wu, “Analysis of high performance RF integrated passive circuits using the glass substrate,” in IEEE VLSI Packaging Workshop of Japan, Dec. 2008, pp. 135-138.
[26] L. Liu, S. M. Kuo, J. Abrokwah, M. Ray, D. Maurer, and M. Miller, “Compact harmonic filter design and fabrication using IPD technology,” IEEE Trans. Components and Packaging Technologies, vol. 30, no. 4, pp. 556-562, Dec. 2007.
[27] C. Mo. Nam, and I. H. Jung, “High performance RF integrated circuits using the silicon based RE integrated passive device (RFIPD),” in International Conf. Information, Communications and Signal Processing, Bangkok, Thailand, Dec. 2005, pp. 1357-1361.
[28] K. Liu, and R.C. Frye, “Full-circuit design optimization of a RF silicon integrated passive device,” in IEEE Conf. Electrical Performance of Electronic Packaging, Scottsdale, U.S., Oct. 2006, pp. 327-330,.
[29] K. Stadius, and K. Halonen, “Development of 4-GHz flip-chip VCO module,” in IEEE International Symp. Circuits and Systems, Kobe, Japan, May 2005, pp. 2687-2690.
[30] H. Lee, C. Park, and S Hong, “A quasi-four-pair class-E CMOS RF power amplifier with an integrated passive device transformer,” IEEE Trans. Microwave Theory and tech., vol. 57, no. 4, pp. 752-759, April 2009.
[31] S. P. Liu, C. T. Wang, C. H. Lee, and W. Wang, “Miniaturized WiFi system module using SiP IPD for handheld device applications,” in International Conf. Microsystems, Packaging, Assembly and Circuits Technology, Taipei, Taiwan, Oct. 2007, pp. 146-148.
[32] H. K. Chen, Y. C. Hsu, T. Y. Lin, D. C. Chang, Y. Z. Juang, and S. S. Lu, “CMOS wideband LNA design using integrated passive device,” in IEEE MTT-S int. Microwave Symp., Boston, U.S., June 2009, pp. 673-676.
[33] L. Jia, J. G. Ma; K. S. Yeo; and M. A. Do, “9.3-10.4-GHz-band cross-coupled complementary oscillator with low phase-noise performance,” IEEE Trans. Microwave Theory and tech., vol. 52, no. 4, pp. 1273-1278, April 2004.
[34] A. D. Berny, A. M. Niknejad, and R. G. Meyer, “A 1.8 GHz LC VCO with 1.3 GHz tuning range and digital amplitude calibration,” IEEE Jour. Solid-state Circuits, vol. 40, no. 4, pp. 909-917, April 2005.
[35] A. Kral, F. Behbahani, and A. Abidi, “RF-CMOS oscillators with switched tuning,” in Proc. IEEE Custom Integrated Circuits Conf., Santa Clara, U.S., May 1998, pp. 555-558.
[36] J. W. M. Rogers, J. A. Macedo, and C. Plett, “The effect of varactor nonlinearity on the phase noise of completely integrated VCOs,” IEEE Jour. Solid-state Circuits, vol. 35, no. 9, pp. 1360-1367, Sept. 2000.
[37] C. P. Yue, and S. S. Wong, “On-chip spiral inductors with patterned ground shields for Si-based RF ICs,” IEEE Jour. Solid-state Circuits, vol. 35, no. 5, pp. 743-752, May 1998.
[38] F. Zhang, and P. R. Kinget, “Design of components and circuits underneath integrated inductors,” IEEE Jour. Solid-state Circuits, vol. 41, no. 10, pp. 2265-2271, Oct. 2006.
[39] A. Sutono, D. Heo, Y. J. E. Chen, and J. Laskar, “High-Q LTCC-based passive library for wireless system-on-package (SOP) module development,” IEEE Trans. Microwave Theory and tech., vol. 49, no. 10, pp. 1715–1724, Oct. 2001.
[40] J. L., J. Samitier, C. Cane, P. Losantos, and J. Bausells, “Improvement of the quality factor of RF integrated inductors by layout optimization,” IEEE Trans. Microwave Theory and tech., vol. 48, no. 1, pp. 76–83, Jan. 2000. |