||With the computing speed of computers up to several GHz and above, the telecommunications bandwidth through the traditional copper wire will be inadequate. Thus, incorporating optical light as a transmitting media will substantially improve most current interconnect technology due to its high transmission speed. Silicon optical bench technology for optical interconnect applications provides specific characteristics of miniaturized sizes, a good heat spreading, and so on. In addition, the fabrication process can be achieved by employing a standard semiconductor process technology. Therefore, it provides assembly with highly precise alignment, and mass-production possibilities.|
In this thesis, the compact and passive-alignment 4-channel ? 2.5 Gbps optical interconnect receiving module includes a silicon-based 45-degree micro-reflector, V-groove arrays, high-frequency transmission lines of 4-channel ? 2.5 GHz, and bonding pads with Au-Sn eutectic solder. It’s a free-space optical interconnect technology serving as a board to board or chip-to-chip interconnect, which is realized by assembling active and passive optical devices on a silicon optical bench（SiOB）.
The compact and passive-alignment optical interconnect receiving module includes some important fabrication technology, ex: fabrication of SiOB、fabrication of high frequency transmission line、fabrication of bonding pads and fabrication of module assembly.
The transmission speed 2.5 Gbps / channel is achieved by the compact and passive-alignment optical interconnect receiving module and the size of SiOB can be only 5´5 mm2 for 4-channel interconnect. The optical performance simulated by the ray-tracing method, the coupling efficiency between multimode fiber and photo detector can reaches up to -2 dB. The cross-talk between neighboring channels can be suppressed down to -49 dB.
|| Andrew C. Alduino, San Jose, CA（US）; Mario J. Paniccia, Santa Clara, CA（US）, “Method and apparatus providing an electrical-optical coupler”, （US patent NO. 7,306,378, USA, 2007）|
 蕭旭良,“應用於光學連結模組之矽基光學連結技術”, （中央大學光電所碩士論文, 台灣, 2008）
 Yasuhiko Aoki, Toshio Kato, Rogerio Jun Mizuno, Kenichi Iga,“Micro-optical bench for alignment-free optical coupling”, （OSA,Applied Physics,1999）
 Kenji Tokoro et al., “Anisotropic Etching Properties of Silicon inKOH and TMAH Solutions”, IEEE International Symposium on Micromechatronics and Human Science,1998, p.65-69.
 I. Zubel, “Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si（100） anisotropic etching in KOH and KOH+IPA solutions”, Sensors and Actuators A: Physical, 84, p. 116-125,2000
 I. Zubel, “Silicon anisotropic etching in alkaline solutions IV – The effect of organic and inorganic agents on silicon anisotropic etching process”, Sensors and Actuators A: Physical, 87, p. 163-171,2001
 I. Zubel, “The effect of isopropyl alcohol on etching rate and roughness of （100） Si surface etched in KOH and TMAH solutions”, Sensors and Actuators A: Physical, 93, p. 138-147,2001
 J. M. Lai, W. H. Chieng, Y-C Huang, “Precision alignment of mask etching with respect to crystal orientation”, （J. Micromech. Microeng B, p.327-329,1998）
 沈育星,“多層傳輸線應用在共平面波導到共平面帶狀線寬頻轉接的研製”, （中央大學電機所碩士論文, 台灣, 2002）