| 摘要(英) |
This study utilizes sputter of the physics way (Physical Vapor Deposition, PVD) to plate in vacuum. Let conduct metal particle of copper and stainless steel deposits and accumulates on chassis structure of the non-conducting plastic, the function of making this plastic chassis have being protected electromagnetic interference, it would cooperate with this research in the peculiar structure of chassis design; not only make the plastic chassis surface to form continuous electric conduction layer, It can also be under not influencing the prerequisite of the whole intensity of the system. The whole project’’s development has cost reducing relevant electromagnetic interference protecting, show the innovation that the relevant product designs.
While studying, it designs the concept and comparative project of experiment into the products, and will appear and correlated with designing in the note type computer chassis actually. The different preventing and curing processes have compared for electromagnetic interference protecting, propose the advantage and expansionary of this research. It proves that can offer the organization solution of the industry to design tactics in this.
Standardize the inspection specification of the grade via world finally. Study the system and carry on the electromagnetic interference protecting and examining to the experiment. To confirm it reaches the electromagnetic compatibility standard, and then through the relevant mechanical destructiveness and non- destructive of the system experiment. The guarantee the organization designs the reliability of the design tactics, so as to finish the real products and appear as the final research results.
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| 參考文獻 |
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