摘要(英) |
Taiwan semiconductor assembly industry was established in 1966 by the Integrated Device Manufacturing corporations such as General Instrument Microelectronics, Texas Instrument, Philips Electronics ,etc. Their purpose is for cost reduction program – to shift labor intensive industry from high labor cost region to lower labor cost countries like Taiwan , Philippines ,etc. After some years of learning and with the encouragement of the Taiwan Government , several local IC assembly service corporations gradually took over the IDM company’s IC assembly factory in Taiwan and furthermore promoted the business model from OEM to ODM competing in new product “ time to market “ and “ unit cost “.
In the initial decade, new product development monopolized by technique intensive experts were running pretty successful in low technology application segment, however, such model were observed to be stagnant and sluggish while the new product development task force required complicated knowledge plus harmonious team work.
To figure out if there is an appropriate new product development model that could be applied in Taiwan small size IC assembly industry as well as in other similar business industry company, through the study and evaluation on this specific case, enhancing quality control involvement was practiced and demonstrated in the Taiwan represented local company during a new IC package development. The conclusion looks pretty positive as described below:
1. A qualified QA expert being involved in new product development program to prevent technique expert from monopolizing will obviously benefit the task force in shortening “ Time to Market “ and eliminate redundancy.
2. QA expert involvement in new product development is not only complied with in most well developed countries, it is mandatory to be executed in quality system as a requirement in International Quality Standard. Definitely, it is appropriate for all business industry as long as the corporation forever anticipate prosperity.
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參考文獻 |
ㄧ.中文文獻
1. 小島敏彥( 1996 ),“新產品開發管理”,財團法人中衛發展中心出版,民國91年5月,第一版。
2. 王欣薇(2006),「應用ISO/TS16949建構車用TFT-LCD面板廠商之新產品開發流程」,交通大學,管理學院碩士班未出版碩士論文。
3. 司徒達賢(2004),《策略管理》,台北:遠流出版社。
4. 李佩縈(2009),2008年第四季我國半導體回顧與展望,Retrieved March 12,2009,取自http://itisweb3.itis.org.w/itisppt/Freeppt/slide.aspx?pre_id=1465。
5. 易騰企管譯(2005),ISO/TS16949:2002訓練教材,台北市:易騰企管。
6. 林志信(2003),「資訊產品公司開發消費性電子產品之過程研究-以B公司開發液晶電視為例」,中央大學,管理學院高階企管碩士班未出版碩士論文。
7. 品士公司譯(1993),統計過程控制(SPC)參考手冊,台北市:品士公司。
8. 品士公司譯(1995),先期產品品質規劃和管制計畫(APQP)參考手冊,台北市:品士公司。
9. 品士公司譯(2000),生產件批准程序(PPAP)參考手冊,台北市:品士公司。
10. 品士公司譯(2001),潛在失效模式及效應分析(FMEA)參考手冊,台北市:品士公司。
11. 品士公司譯(2002),ISO/TS16949:2002品質管理系統—汽車行業生產件及相關服務件的組織實施的特殊要求,台北市:品士公司。
12. 品士公司譯(2002),量測系統參考手冊,台北市:品士公司。
13. 范哲豪(2005),2005半導體工業年全鑑,工研院IEK電子分項ITRIEK-0453-T405(94)。
14. 健峰企管顧問公司譯(2002),ISO/TS16949:2002認證顧問輔導書,台北市:健峰企管顧問公司。
15. 陳文輝(2002),「從ISO/TS16949談全球布局」,品質月刊,38卷,04期。
二. 英文文獻
1. Automotive Industry Action Group (2002). Advanced Product Quality Planning and Control Plan Reference Manual.USA. Automotive Industry Action Group.
2. Automotive Industry Action Group (2002).ISO/TS16949 Quality Management System-Particular requirements for the application of ISO 9001:2000 for automotive and electric service part organization, USA, Automotive Industry Action Group.
3. Booz,Allen and Hamilton (1968).Management of New Products,NY:Allen and Hamilton Inc.
4. Booz,Allen and Hamilton (1982).New Product Management for the 1980s.New York.P.17.
5. Floyd,T. D.,Levy.S. and Wolfman.A. B. (1997).Winning the New Product Development Battle.The Institute of Electrical and Electronics Engineers.
6. Gupta,A.K, Raj, S.P. and Wilemon,D.L. (1985)."R & D and Marketing Dialogue in High-Tech Firm"Industrial Marketing Management 14,pp.289-300.
7. International Standard Organization (2000). ISO9001:2000 Quality Management System-Requrements,Switzerland,International Standard Organization.
8. International Standard Organization (2002).Measurement System Analysis Reference Manual. USA. Automotive Industry Action Group.
9. International Standard Organization (2002).Potential Failure Mode and Effects Analysis Reference Manual.USA. Automotive Industry Action Group.
10. International Standard Organization (2002)Production Part Approval Process Reference Manual.USA Automotive Industry Action Group.
11. International Standard Organization (2002)Statictical Process Control Reference Manual.USA Automotive Industry Action Group.
12. International Technology Roadmap for Semiconductor (2008).Assembly and Packaging Retrieved December 12,2008,from http://www.itrs.net/links/2007ITRS/2007_chapter/20.
13. Joint Electron Device Engineering Councils (2008).Package drawings MO251-A.Retrieved December 19,2008,from http://www.jedec.org/download/search/default2.cfm
14. Johnson,S.C.,and Conrad J. (1957)."How to Organize for New Products" Harvard Business Review,May-June.p.52.
15. Kartha, C. P., “A comparison of ISO9000:2000 quality system standards,QS9000, ISO/TS16949 and Baldrige criteria.” The TQM Magazine, Vol.16, No.5,pp. 331~340, 2004.
16. Kotler,P. (1994).Marketing Management:Analysis,Planning,Implementation and Control.8th ed. New Jersey:Prentice Hall.
17. Marquis and Myers (1969)."Successful Industrial Innovation"National Sci. Foundation,Tech. Rep. NSF. pp.69-70.
18. Ulrich,K. T. and Eppinger,S. D. (1980).Product Design and Development,New Jersey:McGraw-Hill Inc.
19. Urban,G.L. and John R. H. (1980).Design and Marketing of New Products,1st ed. New Jersey:Prentice-Hall,pp.538-551.
20. Wu Julie (2009).Overview on Taiwan IC Industry-2008 Edition. Retrieved March 12.2009.from http://www.tsia.org.tw/service/publication_more.asp?zvpWmJ==
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