以矽光學平台為基礎之4通道×10-Gbps
光學連結模組之接收端研究

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姓名

陳進達(Chin-Ta Chen) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

以矽光學平台為基礎之4通道×10-Gbps 光學連結模組之接收端研究
(4-Channel×10-Gbps Optical Interconnect Receiving Module Based on Silicon Optical Bench )

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摘要(中)

在本論文中，將提出具矽基光學平台(Silicon Optical Bench, SiOB )之微型化被動式對準光連結接收端模組，模組傳輸速度分別為4通道 × 5-Gbps與4通道 × 10-Gbps兩種，前者所對應為之光檢測器波長為1310 nm，後者所對應之光檢測器波長為850 nm，模組尺寸大小為5 × 5 mm2，此模組可應用於板對板(Board to Board)或晶片對晶片(Chip to Chip)之光學連接，矽基光連結接收端模組具有單石積體化45度微反射面、V型溝槽陣列、10-GHz高頻傳輸線、金錫焊料與高反射率金屬層，並利用混成構裝之技術將光檢測器與八芯光纖陣列以被動式對準封裝整合；45度微反射面提供光線非共平面傳輸，其表面粗糙度小於10 nm，蝕刻深度為110 um，V型溝槽陣列提供光纖擺放平台，矽基光學平台製程誤差為6 %以內；在模組光學特性上，850模組與1310模組之1-dB光學準位容忍度分別為±16與±20 um，響應度分別為0.5與0.7 A/W，鄰近通道之串音雜訊均在-25 dB以下；在模組高頻特性上，850模組之眼圖可通過OC-192眼罩(Eye Mask)，而1310模組之眼圖通過OC-96眼罩，且誤碼率(Bit Error Rate, BER)皆可達到10-11等級。

摘要(英)

In this thesis, the compact and passive-alignment optical interconnect receiving module based on silicon optical bench (SiOB) is realized. The transmission speed of receiving modules are 4-channel × 5-Gbps and 4-channel × 10-Gbps, the former is corresponded to photo-detector (PD) which wavelength is 1310 nm, the later is corresponded to PD which wavelength is 850 nm. The size of module is 5 × 5 mm2. The receiving module can apply optical interconnect of board to board or chip to chip. The silicon-based optical interconnect receiving module includes a monolithic integration of 45° micro-reflector, V-groove arrays, high-frequency transmission lines of 10 GHz, bonding pads with Au/Sn eutectic solder and metal layer with high reflection coating (HR coating),using hybrid integration of PD and fibber array of 8 channels with passive alignment process. The 45° micro-reflector provides non-coplanar transmission, which surface roughness is less than 10 nm, etching depth is 110 um, V-groove arrays provide bench of setting fiber, the tolerance accuracy of fabrication process for SiOB is less than 6 %. The optical characteristic with receiving module, 1-dB tolerance of optical level of 850-nm and 1310-nm module are ±16 and ±20 um, respectively, responsivity are 0.5 and 0.7 A/W, respectively, the cross-talk between neighboring channels can be less than -25 dB. The frequency characteristic with receiving module, The eye pattern of 850-nm module and 1310-nm module can pass OC-192 and OC-96 eye mask, respectively. The bit error rate (BER) of them can achieve 10-11 order.

關鍵字(中)

★ 光連結

關鍵字(英)

★ optical interconnect

論文目次

摘要 i
Abstract ii
圖目錄 v
表目錄 xi
第一章緒論 1
1-1 前言 1
1-2 研究動機與目的 3
1-3 具矽基光學平台之光學連結接收端模組架構 9
第二章微型化被動式對準之光連結接收端模組設計 10
2-1 850與1310 nm光檢測器之光學評估 10
2-2 接收端模組之光學訊號準位及串音雜訊準位之模擬分析 16
2-3 接收端模組結構與設計 22
第三章光連結接收端模組製程開發與封裝 24
3-1 矽基光學平台之製程與開發 28
3-2 金屬製程與矽基光學平台之整合 34
3-2-1 45度微反射面之高反射率金屬層製程 34
3-2-2 10-GHz 高頻傳輸線之設計與製程開發 37
3-2-3 覆晶封裝之金錫合金焊料製程 49
3-3 封裝製程與矽基光學平台之整合 54
3-3-1 光檢測器元件之覆晶封裝製程 54
3-3-2 八芯多模光纖之封裝製程 56
第四章矽基光連結接收端模組之高頻特性量測分析 59
4-1 10-GHz高頻傳輸線之高頻傳輸特性量測 59
4-2 光連結接收端模組眼圖與誤碼率之高頻特性量測 64
第五章結論 72
參考文獻 76

參考文獻

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指導教授

伍茂仁(Mount-Learn Wu)

審核日期

2010-5-27

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