微滾軋製程應用於高分子材料轉印微結構之研究

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姓名

陳宗毅(Tzug-yi Chen) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

微滾軋製程應用於高分子材料轉印微結構之研究
(Transfer the micro structure of polymer materials using micro-rolling process to research)

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摘要(中)

熱滾軋製程是一種高效率的製程，其具有的加工連續的特性可將微結構複製於高分子薄膜上，因此在高分子薄膜應用於微流體的概念上開闢了新機遇，而使用薄膜於滾軋製程中，其具有靈活的基板有卷到卷加工的優勢，這樣可以生產出具有潛力與非常便宜的產品，因此在近期滾軋壓印製造微米應用部分受到相當的重視，在本文中我們研究開發附有微米尺寸幾何圖騰的滾軋輪，並利用黃光製程製作滾軋模，文本討論了影響製程參數，主要包括滾軋壓力、溫度和速率，藉由以上不同参數對於加熱滾軋後聚合材料所產生的形貌特徵，可以獲得製程運作中所產生熱變形與剪應力變形的細微關係，此外，關鍵的因素可能會影響轉印成品的精確度，因此藉由以上參數和形貌進行了探討，其主要目標是實現製程最佳化。最後利用滾軋製程所製作微流體晶片進行微混合進行了可行性評估。

摘要(英)

The hot roller embossing is an efficient process to continuously imprint microstructures on polymer film. Therefore, the concept of using hot roller to replicate polymer film opens up new opportunities in microfluidics application； In addition, hot roller embossing process present several advantages of making flexible polymer film in reel-to-reel format to increase throughput and reduce fabrication cost. Therefore, applying hot roller embossing to fabricate micro-parts draws lots of research interests in recent years. In this thesis, we demonstrated the development of the embossing roll with geometries stamps of micron scales and we tried to employ the embossing roll mould by using the lithography process. The thesis discusses the effects of process parameters such as roller embossing temperature, loading force and rolling speed to the resulting polymer film morphology and depth variation from thermal deformation and shear stress deformation. An optimized process parameter was also investigated from the systematic process parameter research. Finally, a micromixer design was demonstrated to evaluate the hot roller embossing process feasibility in microfluidic application.

關鍵字(中)

★ 微滾軋製程

關鍵字(英)

★ Roller process

論文目次

中文摘要 i
Abstract ii
致謝 iii
第一章緒論 1
1.1 前言 1
1.2 微機電系統與微流體晶片 2
1.3 文獻回顧 3
1.4 研究動機與目的 16
1.5 論文架構 17
第二章滾軋製程與技術 19
2.1 滾軋模的製造與材料 19
2.1.1 微模具概論 19
2.1.2 微結構材料 20
2.1.3 滾軋模基材(Roller Mould Substrate) 22
2.2 高分子材料 23
2.2.1 熱塑性塑膠 23
2.2.2 雙甲基矽氧烷材料(PDMS) 24
第三章實驗方法與步驟 25
3.1 材料 25
3.2 黃光製程 25
3.1.1 光罩設計 26
3.1.2 光阻塗佈 (Spin Coating) 27
3.1.3 軟烤 (Soft Bake) 28
3.1.4 曝光 (Expose) 29
3.1.5 曝後烤 (Post Expose Bake) 29
3.1.6 顯影 (Develop) 30
3.1.7 硬烤 (Hard Bake) 30
3.2 滾軋製程 31
3.3 量測方式 34
3.3.1 壓力感測器原理 34
3.3.2 壓電感測器工作特性 35
3.3.3 輪廓量測 37
3.4 接合方式 40
3.5 微流體元件測試實驗 41
第四章實驗結果與討論 43
4.1 滾軋製程之加熱溫度數對於高分子材料的型態影響 43
4.1.1 滾軋製程之加熱溫度應用於PVC、PC與COC薄膜所產生的深度影響 43
4.1.2 滾軋製程之加熱溫度應用於PVC、PC與COC薄膜所產生的型貌影響 45
4.2 滾軋製程之滾軋速率参數對於高分子材料的型態影響 55
4.2.1 滾軋製程之滾軋速率應用於PVC、PC與COC薄膜所產生的深度影響 55
4.2.2 滾軋製程之滾軋速率應用於PVC、PC與COC薄膜所產生的形貌影響 57
4.3 滾軋製程之滾軋速率参數對於高分子材料的型態影響 66
4.3.1 滾軋製程之滾軋壓力應用於PVC、PC與COC薄膜所產生的深度影響 66
4.3.2 滾軋製程之滾軋壓力應用於PVC、PC與COC薄膜所產生的形貌影響 67
4.4 熱接合法實驗與微流體元件測試結果 76
第五章結論與建議 79
参考文獻 81
附錄 86

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指導教授

曹嘉文(Tsao, Chia-Wen)

審核日期

2011-1-26

推文